制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 筛选水平 | 外部数据总线宽度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | S9S12G96F0CLFR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 40 | 98304 | Automotive grade | 表面贴装 | 48-LQFP | YES | A/D 12x10b | -40°C~85°C TA | Tape & Reel (TR) | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 48 | 8542.31.00.01 | QUAD | 鸥翼 | 0.5mm | S9S12G96 | S-PQFP-G48 | 不合格 | 3.3/5V | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 96KB 96K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 23mA | 16 | 3K x 8 | CPU12 | AEC-Q100 | ROHS3 Compliant | ||||||||||||||||||||||||
 | MKL15Z128VFM4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 28 | 131072 | 表面贴装 | 32-VFQFN Exposed Pad | YES | A/D 9x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | e3 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MKL15Z128 | S-XQCC-N32 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, TSI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M0 | 5mm | 5mm | ROHS3 Compliant | ||||||||||||
 | MC9S12D64CPVE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 91 | 65536 | 表面贴装 | 112-LQFP | YES | A/D 16x10b | -40°C~85°C TA | Tray | 1998 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | MC9S12D64 | S-PQFP-G112 | 不合格 | 2.75V | 2.55V | 2.35V | Internal | 25MHz | 4K x 8 | 2.35V~5.25V | MICROCONTROLLER | PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | NO | YES | NO | 16 | 1K x 8 | CPU12 | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||
 | MC9S08QA4CDNE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 4 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | -40°C~85°C TA | Tube | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 8 | 3A991.A.2 | Matte Tin (Sn) | DUAL | 鸥翼 | 260 | 3V | 1.27mm | 40 | MC9S08QA4 | R-PDSO-G8 | 不合格 | 3.6V | 2/3.3V | 1.8V | Internal | 20MHz | 256 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | 8 | YES | NO | YES | NO | 1.75mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||
 | MC908MR16CFUE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 44 | 表面贴装 | 64-QFP | YES | A/D 10x10b | -40°C~85°C TA | Tray | 2005 | HC08 | e3 | 不用于新设计 | 3 (168 Hours) | 64 | EAR99 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC908MR16 | S-PQFP-G64 | 5.5V | 4.5V | Internal | 8MHz | 768 x 8 | 4.5V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 32MHz | FLASH | 8-Bit | 16KB 16K x 8 | SCI, SPI | 8 | YES | YES | YES | NO | 2.4mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||
 | MC9S08AC16CFGE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 34 | 16384 | 表面贴装 | 44-LQFP | YES | A/D 8x10b | -40°C~85°C TA | Tray | 2007 | S08 | e3 | 活跃 | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | ALSO OPERATES WITH 5V NOMINAL SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC9S08AC16 | S-PQFP-G44 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||
| MC912DG128ACPVE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 69 | 表面贴装 | 112-LQFP | YES | A/D 16x8/10b | -40°C~85°C TA | Tray | 2003 | HC12 | e3 | 不用于新设计 | 3 (168 Hours) | 112 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.65mm | 40 | MC912DG128 | S-PQFP-G112 | 不合格 | 5.5V | 4.5V | Internal | 8MHz | 8K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU12 | POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | NO | YES | NO | 16 | 2K x 8 | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||
 | MK20DN512VLQ10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 100 | 524288 | 表面贴装 | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK20DN512 | S-PQFP-G144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||
 | MK51DN512CMC10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 78 | 524288 | 表面贴装 | 121-LFBGA | YES | A/D 37x16b; D/A 2x12b | -40°C~85°C TA | Tray | 2002 | Kinetis K50 | e1 | 活跃 | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK51DN512 | S-PBGA-B121 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.52mm | 8mm | 8mm | ROHS3 Compliant | |||||||||||
| MC9S12XEQ512CAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 91 | 524288 | 表面贴装 | 112-LQFP | YES | A/D 16x12b | -40°C~85°C TA | Tray | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | MC9S12XEQ512 | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 32 | YES | NO | YES | NO | 4K x 8 | CPU12 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||
 | MC56F8037MLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 53 | 表面贴装 | 64-LQFP | YES | A/D 16x12b; D/A 2x12b | -40°C~125°C TA | Tray | 2004 | 56F8xxx | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MC56F8037 | S-PQFP-G64 | 不合格 | 3.6V | 3.3V | 3V | Internal | 32MHz | 4K x 16 | 3V~3.6V | MICROCONTROLLER | 56800E | POR, PWM, WDT | 8MHz | FLASH | 16-Bit | 64KB 32K x 16 | CANbus, I2C, SCI, SPI | 16 | YES | NO | YES | YES | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||
 | MK10DN512VMC10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 90 | 524288 | 表面贴装 | 121-LFBGA | YES | A/D 42x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e1 | 活跃 | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK10DN512 | S-PBGA-B121 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.52mm | 8mm | 8mm | ROHS3 Compliant | |||||||||||
| MC9S08DZ60AMLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 53 | 表面贴装 | 64-LQFP | YES | A/D 24x12b | -40°C~125°C TA | Tray | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MC9S08DZ60 | S-PQFP-G64 | 5.5V | 2.7V | External | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 2K x 8 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||
| MC9S08DZ60ACLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 53 | 表面贴装 | 64-LQFP | YES | A/D 24x12b | -40°C~85°C TA | Tray | 1996 | S08 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MC9S08DZ60 | S-PQFP-G64 | 5.5V | 2.7V | External | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 2K x 8 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||
 | MK66FN2M0VMD18 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 100 | 262144 | 2097152 | 表面贴装 | 144-LBGA | YES | A/D 2x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 3.3V | 1mm | 未说明 | S-PBGA-B144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 180MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4F | 13mm | 13mm | ROHS3 Compliant | ||||||||||||||
 | S9S08SG8E2CTGR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 12 | 8192 | Automotive grade | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | 2014 | S08 | e3 | 活跃 | 3 (168 Hours) | 16 | EAR99 | 哑光锡 | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 40 | S9S08SG8 | R-PDSO-G16 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | AEC-Q100 | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | |||||||||||
 | LPC812M101JDH20FP | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 4096 | 16384 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | 18 | -40°C~105°C TA | Tube | 2010 | LPC81xM | 活跃 | 1 (Unlimited) | 20 | DUAL | 鸥翼 | 未说明 | 3.3V | 0.65mm | 未说明 | 20 | R-PDSO-G20 | 不合格 | 3.6V | 3.3V | 1.8V | Internal | 30MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | 32 | NO | NO | YES | NO | CORTEX-M0 | 1.1mm | 6.5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||
| MC9S08PA16VTG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 14 | 16384 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x12b | -40°C~105°C TA | Tray | 2002 | S08 | e3 | 不用于新设计 | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 40 | MC9S08PA16 | R-PDSO-G16 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | 256 x 8 | 5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||
| MC9S08QE128CLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 54 | 131072 | 表面贴装 | 64-LQFP | YES | A/D 22x12b | -40°C~85°C TA | Tray | 2009 | S08 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Tin (Sn) | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MC9S08QE128 | S-PQFP-G64 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 128KB 128K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||
 | MC9S12XEQ512CAA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 59 | 524288 | 表面贴装 | 80-QFP | YES | A/D 12x12b | -40°C~85°C TA | Tray | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | MC9S12XEQ512 | S-PQFP-G80 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 32 | YES | NO | YES | NO | 4K x 8 | CPU12 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||
 | FS32K142HAT0MLLT | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 100-LQFP | A/D 16x12b; D/A 1x8b | -40°C~125°C TA | Tray | S32K | 活跃 | 3 (168 Hours) | 260 | 40 | Internal | 80MHz | 32K x 8 | 2.7V~5.5V | ARM® Cortex®-M4F | POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 4K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| MKE02Z32VLD4R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 37 | 4096 | 32768 | 表面贴装 | 44-LQFP | YES | A/D 16x12b; D/A 2x6b | -40°C~105°C TA | Tape & Reel (TR) | 2013 | Kinetis KE02 | e3 | 活跃 | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | 从制造商网站考虑的柱塞尺寸 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.8mm | 40 | S-PQFP-G44 | 5.5V | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | 256 x 8 | 8 | 10mm | 10mm | ROHS3 Compliant | ||||||||||||
 | MKE04Z64VLK4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 71 | 表面贴装 | 80-LQFP | A/D 16x12b; D/A 2x6b | -40°C~105°C TA | Tray | 2014 | Kinetis KE04 | e3 | 活跃 | 3 (168 Hours) | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | 260 | 40 | Internal | 48MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
| MK24FN1M0VLL12R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | A/D 32x16b; D/A 2x12b | 表面贴装 | 100-LQFP | YES | 66 | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis K20 | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | S-PQFP-G100 | 3.6V | 1.71V | Internal | 120MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | YES | YES | YES | YES | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||
| MK02FN128VFM10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 26 | 表面贴装 | 32-VFQFN Exposed Pad | YES | A/D 12x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K02 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | S-XQCC-N32 | 3.6V | 1.71V | Internal | 100MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, LVD, POR, PWM | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | YES | YES | YES | YES | 5mm | 5mm | ROHS3 Compliant |