制造商是'Molex'
Molex 存储器连接器 - 直列式模块插座
(501)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 越来越多的功能 | 房屋材料 | 质量 | 安装选项1 | 板安装选项 | 安装选项2 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | ECCN 代码 | 连接器类型 | 类型 | 定位的数量 | 最高工作温度 | 最小工作温度 | 行数 | 性别 | 附加功能 | HTS代码 | 电压 - 额定直流 | MIL一致性 | 符合 DIN 标准 | IEC一致性 | 过滤功能 | 混合接触 | 选项 | 螺距 | 触头总数 | 方向 | 端子间距 | 深度 | Reach合规守则 | 额定电流 | 导体数量 | 参考标准 | 触点表面处理 | 终端样式 | 电压 - 额定交流 | 可靠性 | 本体长度/直径 | 行间距-交配 | PCB行数 | 螺纹距离 | 接头数量 | PCB接触图案 | 本体宽度 | 触点性别 | UL可燃性规范 | 房屋颜色 | 本体深度 | 额定电流(信号) | 触点样式 | 触点电阻 | 绝缘电阻 | 配套触点间距 | 主体/外壳样式 | 电路数量 | 最大额定电压(交流) | 终端类型 | 镀层 | 偏振键 | 介电耐压 | 连接器样式 | PCB 触点行距 | 耐用性 | 触点表面处理 终端 | 插入力-最大值 | 拉坯力 - 最小值 | 绝缘子颜色 | 标准 | 符合辉光线 | 产品 | 安装角 | 特征 | 高度 | 长度 | 宽度 | 触点表面处理厚度 | 电镀厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||||||||||||||||||||||||||||
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![]() | 87783-0301 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PCB 安装 | Tin | + 85 C | - 55 C | 120 | 30 V | 0877830301 | 0.212737 oz | Socket | 活跃 | Natural (Off-White) | US | ACTIVE (Last Updated: 2 years ago) | Polymer | DDR3 SDRAM | 镍外哑光锡 | 3.78 inch | -55 °C | 85 °C | 有 | 87783-0301 | 2 | 活跃 | DIMM Connectors 0.6MM DDR3 MINIDIMM SKT 244P 22.5ANG AU | MOLEX LLC | ONE | 2.32 | 87783 | Production (Last Updated: 2 years ago) | Gold | 表面贴装 | BOARD | Thermoplastic | LATCH | HOLE .055-.063 | LOCKING | Details | Tray | 87783 | e3 | 有 | Solder | 卡边缘连接器 | DDR3 | 244 Position | 85 °C | -55 °C | 2 | LATCHED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 0.6 mm | 244 | 直角 | 0.6 mm | 15.4 mm | compliant | 1 A | UL | SMD/SMT | COMMERCIAL | 2 | 244 | RECTANGULAR | FEMALE | 94V-0 | Black | 0.606 inch | 1 A | 40 mΩ | 1000000000 Ω | 0.024 inch | 200 | SURFACE MOUNT | Tin | 镍外哑光锡 | BLACK | Vertical | 106.2 mm | 30u inch | 无 | ||||||||||||||||||||||||||||||||||||||||||
![]() | 87782-3003 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | DDR3 SDRAM | 30V | Gold | 表面贴装 | Module | Thermoplastic | 6.135999g | 铜合金 | 2011 | e3 | yes | 活跃 | SMD/SMT | Socket | 85°C | -55°C | 2 | LATCHED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 600μm | Straight | 1A | 244 | FEMALE | 94V-0 | 30V | 无SVHC | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 78726-1060 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tin | + 85 C | - 55 C | 60 | 29 VAC/DC | 0787261060 | 0.231397 oz | Socket | 活跃 | White | Gold | Details | 78726 | 288 Position | 0.85 mm | 750 mA | White | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 87746-5311 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PCB 安装 | Tin | + 85 C | - 55 C | 30 | 30 V | 0877465311 | 0.365191 oz | Socket | 活跃 | Clear | DDR2 SDRAM | Nylon | OBSOLETE (Last Updated: 2 years ago) | SG | GOLD (30) OVER NICKEL | 有 | 87746-5311 | 2 | Obsolete | MOLEX LLC | 5.83 | Obsolete (Last Updated: 2 years ago) | Gold | 通孔 | BOARD | Thermoplastic | Details | Tray | 87746 | e3 | 有 | Press-Fit | 卡边缘连接器 | DDR2 | 240 Position | 85 °C | -55 °C | 2 | LATCHED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 1 mm | 240 | Straight | 1 mm | 7.35 mm | compliant | 500 mA | 通孔 | 240 | FEMALE | 94V-0 | Black | 30 mΩ | 1 GΩ | 240 | PRESS FIT | Tin | Tin (Sn) - with Nickel (Ni) barrier | Vertical | 148 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 87609-0052 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PCB 安装 | Tin | + 85 C | - 10 C | 10 | 125 V | 0876090052 | 0.612568 oz | SG | OBSOLETE (Last Updated: 2 years ago) | 125 V | Polymer | DDR SDRAM | GOLD (15) | 有 | 87609-0052 | 2 | Obsolete | MOLEX LLC | 5.83 | Obsolete (Last Updated: 2 years ago) | Gold | 通孔 | BOARD | Thermoplastic | Details | Tray | 87609 | e3 | 有 | Solder | 卡边缘连接器 | 168 Position | 85 °C | -10 °C | 2 | LATCHED, POLARIZED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 1.27 mm | 168 | 直角 | 1.27 mm | 28.85 mm | compliant | 1 A | 通孔 | 168 | FEMALE | 94V-0 | Black | 168 | SOLDER | Tin | Tin (Sn) | Right | 148.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 87609-0171 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PCB 安装 | Tin | + 85 C | - 10 C | 10 | 125 V | 0876090171 | 0.553166 oz | SG | OBSOLETE (Last Updated: 2 years ago) | 125 V | Polymer | DDR SDRAM | GOLD (30) | 有 | 87609-0171 | 2 | Obsolete | 1.27mm Pitch DIMM 8-Byte Socket, Right-Angle, Multi-Key, 168 Circuits, with Beveled Metal Pins and Plastic Pegs, with Beige Latches, 3.56mm Tail Length, 0.76u00b5m Gold (Au) Plating, Right Function Key, Lead-Free | MOLEX LLC | 5.83 | Obsolete (Last Updated: 2 years ago) | Gold | 通孔 | BOARD | Thermoplastic | Details | Tray | 87609 | e3 | 有 | Solder | 卡边缘连接器 | 168 Position | 85 °C | -10 °C | 2 | LATCHED, POLARIZED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 1.27 mm | 168 | 直角 | 1.27 mm | 28.85 mm | compliant | 1 A | 通孔 | 168 | FEMALE | 94V-0 | Black | 168 | SOLDER | Tin | Tin (Sn) | Right | 148.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 0780658001 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | DDR2 SDRAM | 30V | 通孔 | 通孔 | Normal, Standard - Top | Nylon | Bronze | Tray | 78065 | e3 | yes | 最后一次购买 | 1 (Unlimited) | Press-Fit | 85°C | -55°C | 2 | Female | LOW PROFILE, LATCHED, POLARIZED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 1mm | Straight | 7.35mm | 1A | Gold | 240 | 94V-0 | SOCKET | DIMM | MO-237 | Latches | 165mm | 30.0μin 0.76μm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 0879781021 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | DDR2 SDRAM | 30V | Tin | 通孔 | 通孔 | Normal, Standard - Top | Thermoplastic | 9.329998g | Brass, Bronze | Tray | 87978 | e3 | yes | 活跃 | 1 (Unlimited) | 通孔 | 85°C | -10°C | 2 | LOW PROFILE, LATCHED, POLARIZED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 1mm | Straight | 500mA | Gold | 240 | FEMALE | 94V-0 | SOCKET | DIMM | MO-237 | Board Lock, Latches | 15.0μin 0.38μm | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 87587-2059 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Polymer | Gold | BOARD | LATCH & EJECT | PEG | LOCKING | 铜合金 | 2006 | e3 | Discontinued | 卡边缘连接器 | 168 | 85°C | -40°C | 2 | LATCHED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 2.54mm | 168 | 直角 | 1A | ONE | UL, CSA | 50V | COMMERCIAL | 4 | 1.27mm | STAGGERED | 0.458 inch | FEMALE | 94V-0 | 0.503 inch | 1A | 黄光型 | 30mOhm | 1GOhm | RECEPTACLE | SOLDER | 菱形钥匙 | 500VAC V | 0.063 mm | TIN (100) | .7784 N | .0695 N | BLACK | 148.5mm | 15μin | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 87918-0301 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | DDR3 SDRAM | 30V | Gold | 表面贴装 | Module | Thermoplastic | 铜合金 | e3 | yes | SMD/SMT | 卡边缘连接器 | 244 | 85°C | -55°C | 2 | LATCH | NO | NO | NO | NO | NO | GENERAL PURPOSE | 600μm | 244 | 直角 | 1A | FEMALE | 94V-0 | 无SVHC | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 0783590001 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 通孔 | Through Hole, 25° Angle | Normal, Standard - Top | DDR3 SDRAM | Tray | 78359 | yes | 活跃 | 1 (Unlimited) | Solder | 2 | POLARIZED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 1mm | Gold | 240 | FEMALE | 94V-0 | SOCKET | DIMM | MO-269 | Board Guide, Board Lock, Latches | 30.0μin 0.76μm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1511050001 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | Normal, Standard - Top | DDR4 SDRAM | Tray | 2015 | 151105 | 活跃 | 1 (Unlimited) | EAR99 | 288 | 8536.69.40.40 | Gold | MiniDIMM | MO-314 | Board Lock, Latches | 30.0μin 0.76μm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 87609-0153 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PCB 安装 | Tin | + 85 C | - 10 C | 10 | 125 V | 0876090153 | 0.553166 oz | GOLD (30) | 有 | 87609-0153 | 2 | Obsolete | MOLEX LLC | 5.83 | Gold | BOARD | Thermoplastic | Details | Tray | 87609 | e3 | 有 | 卡边缘连接器 | 168 Position | LATCHED, POLARIZED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 1.27 mm | 168 | 1.27 mm | compliant | 1 A | 通孔 | FEMALE | 94V-0 | SOLDER | Tin (Sn) | Right | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 87782-3005 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PCB 安装 | Tin | + 85 C | - 55 C | 168 | 30 V | 0877823005 | 0.259793 oz | Socket | 活跃 | Natural (Off-White) | GOLD (30) OVER NICKEL | 有 | 87782-3005 | 2 | 活跃 | DIMM Connectors .6mm MINIDIMM VT/CVR 0.76AULF 244CKT | MOLEX LLC | 1.79 | 87782 | Gold | BOARD | Thermoplastic | Details | Tray | 87782 | e3 | 有 | 卡边缘连接器 | DDR3 | 244 Position | LATCHED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 0.6 mm | 244 | 0.6 mm | compliant | 1 A | SMD/SMT | FEMALE | 94V-0 | Black | SURFACE MOUNT | 镍外哑光锡 | 迷你 DIMM | Vertical | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 78726-1032 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PCB 安装 | Copper Alloy | Black | + 85 C | - 55 C | 300 | 3.5 mm | 29 VAC/DC | 787261032 0787261032 | 0.239052 oz | CN | ACTIVE (Last Updated: 2 years ago) | Socket | 活跃 | Production (Last Updated: 2 years ago) | Gold | Details | Tray | 78726 | DDR4 | 288 Position | 0.85 mm | 750 mA | 通孔 | Black | 288 | Tin | DIMM | Vertical | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 87639-1110 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PCB 安装 | Tin | + 85 C | - 40 C | 210 | 50 V | 0876391110 | 0.390871 oz | SG | OBSOLETE (Last Updated: 2 years ago) | 50 V | Polymer | DDR SDRAM | GOLD (30) | 有 | 87639-1110 | 2 | Obsolete | MOLEX LLC | 5.84 | Obsolete (Last Updated: 2 years ago) | Gold | 通孔 | BOARD | Thermoplastic | Details | Tray | 87639 | e3 | 有 | Solder | 卡边缘连接器 | DDR | 184 Position | 85 °C | -40 °C | 2 | LATCHED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 1.27 mm | 184 | Straight | 1.27 mm | compliant | 1 A | 通孔 | 184 | FEMALE | 94V-0 | Black | 40 mΩ | 1 GΩ | 184 | SOLDER | Tin | Tin (Sn) | 148.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 87746-5391 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PCB 安装 | Tin | + 85 C | - 55 C | 120 | 30 V | 0877465391 | 0.364274 oz | Socket | 活跃 | Clear | GOLD (30) | 有 | 87746-5391 | 2 | Obsolete | MOLEX LLC | 5.83 | Gold | BOARD | Thermoplastic | Details | Tray | 87746 | e3 | 有 | 卡边缘连接器 | DDR2 | 240 Position | LATCHED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 1 mm | 240 | 1 mm | compliant | 500 mA | 通孔 | FEMALE | 94V-0 | Black | PRESS FIT | Tin (Sn) | Vertical | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 87609-0162 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PCB 安装 | Tin | + 85 C | - 10 C | 10 | 125 V | 0876090162 | 0.553166 oz | SG | OBSOLETE (Last Updated: 2 years ago) | 125 V | Polymer | DDR SDRAM | GOLD (30) | 有 | 87609-0162 | 2 | Obsolete | MOLEX LLC | 5.83 | Obsolete (Last Updated: 2 years ago) | Gold | 通孔 | BOARD | Thermoplastic | Details | Tray | 87609 | e3 | 有 | Solder | 卡边缘连接器 | 168 Position | 85 °C | -10 °C | 2 | LATCHED, POLARIZED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 1.27 mm | 168 | 直角 | 1.27 mm | 28.85 mm | compliant | 1 A | 通孔 | 168 | FEMALE | 94V-0 | Black | 168 | SOLDER | Tin | Tin (Sn) | Right | 148.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 0879780031 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Thermoplastic | DDR2 SDRAM | 30V | 通孔 | 通孔 | Normal, Standard - Top | Brass | Tray | 87978 | e3 | yes | 活跃 | 1 (Unlimited) | Solder | 85°C | -10°C | 2 | LOW PROFILE, LATCHED, POLARIZED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 1mm | Straight | 500mA | Gold | 240 | FEMALE | 94V-0 | SOCKET | DIMM | MO-237 | Board Lock, Latches | 1.00μin 0.025μm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 87783-0001 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | DDR2 SDRAM | 30V | Gold | 表面贴装 | Thermoplastic | Copper | 2007 | yes | 活跃 | SMD/SMT | Socket | 244 | 85°C | -10°C | 2 | Female | LATCHED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 600μm | 244 | 1A | ONE | UL | COMMERCIAL | 3.78 inch | 2 | 600μm | RECTANGULAR | 94V-0 | Black | 0.606 inch | 1A | 40mOhm | 1000000000Ohm | RECEPTACLE | 30V | 8.77mm | 30μin | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 0879770021 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Thermoplastic | DDR2 FBDRAM | 30V | 通孔 | 通孔 | Normal, Standard - Top | Bronze | Tray | 87977 | e3 | yes | 活跃 | 1 (Unlimited) | Solder | 240 | 85°C | -10°C | 2 | LATCHED, POLARIZED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 1mm | 240 | 直角 | 1.5A | Gold | FEMALE | 94V-0 | SOCKET | 29 | FB-DIMM | MO-256 | Board Guide, Latches | 15.0μin 0.38μm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 87623-2001 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | DDR SDRAM | 50V | Gold | 通孔 | Thermoplastic | 10.771997g | Brass, Bronze | e3 | yes | 通孔 | EAR99 | 卡边缘连接器 | 85°C | -40°C | 4 | LATCHED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 2.54mm | Vertical | 30.67mm | 1A | ONE | UL | 50V | COMMERCIAL | 4 | 1.27mm | 184 | RECTANGULAR | FEMALE | Black | 1A | 40mOhm | 1GOhm | RECEPTACLE | 50V | 极化外壳 | 500VAC V | 1.6002 mm | 25 Cycles | Non-compliant | 30.7mm | 148.5mm | 141mm | 15μin | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 0783210011 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | DDR3 SDRAM | 通孔 | 通孔 | Normal, Standard - Top | Nylon | Tray | 78321 | yes | 活跃 | 1 (Unlimited) | EAR99 | 85°C | -55°C | 2 | 8536.69.40.40 | 30V | 2mm | Straight | 7.35mm | Gold | 30V | 240 | DIMM | MO-269 | Board Lock, Latches | 141mm | 30.0μin 0.76μm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 87705-1051 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | DDR2 SDRAM | 30V | Gold | 通孔 | Thermoplastic | 10.093989g | Brass, Bronze, Copper | 2008 | e3 | yes | 活跃 | 通孔 | 卡边缘连接器 | 240 | 85°C | -10°C | 2 | LATCHED | NO | NO | NO | NO | NO | GENERAL PURPOSE | 1mm | 240 | Straight | 500mA | ONE | COMMERCIAL | 1.27 mm | 4 | 1mm | STAGGERED | FEMALE | 94V-0 | 0.915 inch | 0.5A | SQ PIN-SKT | 30mOhm | 1000000000Ohm | RECEPTACLE | 30V | 1.905 mm | 30μin | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 78726-1029 | Molex | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PCB 安装 | Copper Alloy | Black | + 85 C | - 55 C | 300 | 3.5 mm | 29 VAC/DC | 787261029 0787261029 | 0.237888 oz | Socket | 活跃 | Gold | Details | Tray | 78726 | DDR4 | 288 Position | 0.85 mm | 750 mA | 通孔 | White | DIMM | Vertical |