制造商是'Microsemi'
Microsemi 嵌入式 - 片上系统（SoC）
(760)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 数据率 | 建筑学 | 输入数量 | 组织结构 | 可编程逻辑类型 | 逻辑元件/单元数 | 核心架构 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 主要属性 | 逻辑单元数 | 等效门数 | 闪光大小 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M2S010-1VF400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 195 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S010 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 10K Logic Modules | 256KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
 | M2S010-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 233 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 未说明 | S-PBGA-B484 | 233 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 233 | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||
 | M2S025T-VFG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 256-LBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 256 | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B256 | 138 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 256KB | 1.56mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||
| M2S005-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | 484-FPBGA (23x23) | 209 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S005 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 5K Logic Modules | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
 | A2F200M3F-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 208-BFQFP | YES | 208 | MCU - 22, FPGA - 66 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 80MHz | 20 | A2F200 | 66 | 不合格 | 1.575V | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | 现场可编程门阵列 | ARM | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 200000 | 256KB | 4.1mm | Non-RoHS Compliant | |||||||||||||||||||||||||||
| M2S060TS-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 未说明 | S-PBGA-B484 | 267 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||
| M2S005S-VFG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LBGA | YES | 161 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 256 | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B256 | 161 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 161 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.56mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||
| M2S010-FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 64KB | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 484 | 233 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 484 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | 未说明 | 233 | 不合格 | 1.2V | 1.26V | 166MHz | 256kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 667 Mbps | MCU, FPGA | 现场可编程门阵列 | 12084 | 400MHz | 1007 | FPGA - 10K Logic Modules | 256KB | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||
| M2S010-VFG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | 256 | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 256 | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | 138 | 不合格 | 1.2V | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
| M2S010-VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 195 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 400 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B400 | 195 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 195 | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 256KB | 1.51mm | 17mm | 17mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
| M2S005-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 64KB | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | 484 | 484-FPBGA (23x23) | 209 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S005 | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 128kB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 667 Mbps | MCU, FPGA | 6060 | ARM | 400MHz | 505 | FPGA - 5K Logic Modules | 128KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
| M2S005-1VF400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 169 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S005 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 5K Logic Modules | 128KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
| A2F200M3F-FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 256-LBGA | 256 | MCU - 25, FPGA - 66 | 0°C~85°C TJ | Tray | 2012 | SmartFusion® | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | BOTTOM | BALL | 225 | 1.5V | 1mm | 80MHz | 30 | A2F200 | 66 | 不合格 | 1.5V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 2mA | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | 现场可编程门阵列 | ARM | 200000 | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 1.7mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||
| M2S010-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 64KB | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | 484 | 484-FPBGA (23x23) | 233 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S010 | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 1.26V | 1.14V | 166MHz | 256kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 667 Mbps | MCU, FPGA | 12084 | ARM | 400MHz | 1007 | FPGA - 10K Logic Modules | 256KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | A2F500M3G-CSG288 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 288-TFBGA, CSPBGA | YES | MCU - 31, FPGA - 78 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | e1 | 活跃 | 3 (168 Hours) | 288 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.5V | 0.5mm | 80MHz | 未说明 | A2F500M3G | S-PBGA-B288 | 78 | 不合格 | 1.575V | 1.51.82.53.3V | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | 78 | 11520 CLBS, 500000 GATES | 现场可编程门阵列 | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 500000 | 512KB | 1.05mm | 11mm | 11mm | 符合RoHS标准 | ||||||||||||||||||||||
 | M2S025T-FCS325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 325-TFBGA, CSPBGA | YES | 180 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.5mm | not_compliant | 未说明 | S-PBGA-B325 | 180 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | ||||||||||||||||||||||||
| M2S050-FCS325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 325-TFBGA, CSPBGA | YES | 200 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.5mm | not_compliant | 未说明 | S-PBGA-B325 | 200 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||
| M2S025-VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B400 | 207 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 256KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||
| M2S025T-VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B400 | 207 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 256KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||
| M2S025-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484-FPBGA (23x23) | 267 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S025 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 25K Logic Modules | 256KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
| M2S050T-VF400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 207 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S050T | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 50K Logic Modules | 256KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
| M2S025-1FCS325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 325-TFBGA, CSPBGA | YES | 180 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.5mm | not_compliant | 未说明 | S-PBGA-B325 | 180 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | ||||||||||||||||||||||||
| M2S025T-1VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 207 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S025T | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 25K Logic Modules | 256KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
| A2F500M3G-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 256-LBGA | YES | 256 | MCU - 25, FPGA - 66 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | e0 | 活跃 | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.5V | 1mm | 80MHz | 20 | A2F500M3G | 66 | 不合格 | 1.575V | 1.51.82.53.3V | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 2mA | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | 现场可编程门阵列 | ARM | 500000 | 24 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | 1.7mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||
 | M2S010-TQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | OBSOLETE (Last Updated: 1 month ago) | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1.2V | 0.5mm | not_compliant | 未说明 | S-PQFP-G144 | 84 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | 现场可编程门阵列 | FPGA - 10K Logic Modules | 256KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant |