制造商是'Microsemi'
Microsemi 嵌入式 - FPGA（现场可编程门阵列）
(5267)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 传播延迟 | 接通延迟时间 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
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.png) | M1AFS250-2PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 93 | -40°C~100°C TJ | Tray | Fusion® | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | QUAD | FLAT | 225 | 1.5V | 0.5mm | 30 | M1AFS250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 1.47059GHz | 2 | 6144 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
 | M1A3P1000-2PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | M1A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 4.1mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||
| M1A3P1000L-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | ProASIC3L | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.575V | QUAD | 鸥翼 | 225 | 1.2V | 0.5mm | 30 | M1A3P1000L | 154 | 1.2V | 1.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 781.25MHz | 24576 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
| A54SX72A-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | Lead, Tin | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 171 | -40°C~85°C TA | Tray | 2007 | SX-A | Obsolete | 3 (168 Hours) | 85°C | -40°C | 2.25V~5.25V | 217MHz | A54SX72A | 2.5V | 2.75V | 2.25V | 1.5 ns | 1.5 ns | 6036 | 108000 | 217MHz | 6036 | 6036 | 4024 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||
 | A3P1000L-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.575V | QUAD | 鸥翼 | 225 | 1.2V | 0.5mm | 30 | A3P1000L | 154 | 1.2V | 1.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 781.25MHz | 24576 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||
 | APA150-BGG456I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 456-BBGA | 456 | 242 | -40°C~85°C TA | Tray | 2007 | ProASICPLUS | e1 | Obsolete | 3 (168 Hours) | 456 | 锡银铜 | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 245 | 2.5V | 1.27mm | 40 | APA150 | 242 | 2.5V | 2.52.5/3.3V | 4.5kB | 现场可编程门阵列 | 36864 | 150000 | 180MHz | 6144 | 1.73mm | 35mm | 35mm | 无 | 符合RoHS标准 | |||||||||||||||||||||
| M1A3P1000L-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | ProASIC3L | e3 | Obsolete | 3 (168 Hours) | 208 | 哑光锡 | 8542.39.00.01 | 1.14V~1.575V | QUAD | 鸥翼 | 245 | 1.2V | 0.5mm | 40 | M1A3P1000L | 154 | 1.2V | 1.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 781.25MHz | 24576 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
| AX250-2PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 115 | -40°C~85°C TA | Tray | 2005 | Axcelerator | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 870MHz | 30 | AX250 | 248 | 1.5V | 6.8kB | 740 ps | 740 ps | 现场可编程门阵列 | 55296 | 250000 | 4224 | 2 | 2816 | 0.74 ns | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||
| M1AFS600-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 95 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e3 | Obsolete | 3 (168 Hours) | 208 | 哑光锡 | 1.425V~1.575V | QUAD | FLAT | 245 | 1.5V | 0.5mm | 40 | M1AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.28205GHz | 1 | 13824 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| AGLE3000V2-FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~70°C TA | Tray | 2012 | IGLOOe | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | AGLE3000 | 1.5V | 1.575V | 1.14V | 63kB | 75264 | 516096 | 3000000 | 892.86MHz | 75264 | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
| M1A3P1000-1PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 272MHz | 30 | M1A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 1 | 24576 | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||
| M1AGLE3000V5-FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | 0°C~70°C TA | Tray | 2012 | IGLOOe | e1 | Obsolete | 3 (168 Hours) | 896 | 锡银铜 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 245 | 1.5V | 30 | M1AGLE3000 | 1.5V | 63kB | 现场可编程门阵列 | 75264 | 516096 | 3000000 | 892.86MHz | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
 | AGLE3000V5-FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~70°C TA | Tray | IGLOOe | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGLE3000 | 1.5V | 1.575V | 1.425V | 63kB | 75264 | 516096 | 3000000 | 892.86MHz | 75264 | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| M1AGLE3000V2-FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | 0°C~70°C TA | Tray | IGLOOe | e0 | Obsolete | 3 (168 Hours) | 896 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.5V | 20 | M1AGLE3000 | 1.5V | 63kB | 现场可编程门阵列 | 75264 | 516096 | 3000000 | 892.86MHz | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||
| M1AGLE3000V2-FG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | -40°C~85°C TA | Tray | 2012 | IGLOOe | e0 | Obsolete | 3 (168 Hours) | 896 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.5V | 20 | M1AGLE3000 | 1.5V | 63kB | 现场可编程门阵列 | 75264 | 516096 | 3000000 | 892.86MHz | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
| AGLE3000V2-FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~70°C TA | Tray | 2012 | IGLOOe | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | AGLE3000 | 1.5V | 1.575V | 1.14V | 63kB | 75264 | 516096 | 3000000 | 892.86MHz | 75264 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
| AX1000-2FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 516 | 0°C~70°C TA | Tray | 2012 | Axcelerator | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 870MHz | AX1000 | 1.5V | 1.575V | 1.425V | 20.3kB | 740 ps | 740 ps | 12096 | 165888 | 1000000 | 870MHz | 18144 | 12096 | 2 | 12096 | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||
 | A3P400-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 194 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3P400 | 1.5V | 1.575V | 1.425V | 6.8kB | 55296 | 400000 | 272MHz | 1 | 9216 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
 | M1A3P400-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 194 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
| M1A3P400-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 194 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
 | A54SX32A-TQG176I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 176-LQFP | 176 | 176-TQFP (24x24) | 147 | -40°C~85°C TA | Tray | 2007 | SX-A | Obsolete | 3 (168 Hours) | 85°C | -40°C | 2.25V~5.25V | 238MHz | A54SX32A | 2.5V | 2.75V | 2.25V | 1.2 ns | 1.2 ns | 2880 | 48000 | 238MHz | 2880 | 2880 | 1980 | 1.4mm | 24mm | 24mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
| M1A3P400-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 194 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||
| M1A3P400-2FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 194 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
 | APA1000-FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 642 | 0°C~70°C TA | Tray | 2007 | ProASICPLUS | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 250 | 2.5V | 180MHz | 40 | APA1000 | 642 | 2.5V | 2.52.5/3.3V | 24.8kB | 现场可编程门阵列 | 202752 | 1000000 | 56320 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||
 | APA300-FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 186 | 0°C~70°C TA | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 70°C | 0°C | 2.3V~2.7V | 180MHz | APA300 | 2.5V | 2.7V | 2.3V | 9kB | 73728 | 300000 | 180MHz | 8192 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | 含铅 |