制造商是'Microsemi'
Microsemi 嵌入式 - FPGA(现场可编程门阵列)
(5267)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 时钟频率 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
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![]() | MPF300TL-FCG784I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 388 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300TS-FCG784I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 388 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300TLS-FCG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | 244 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLE3000V5-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 341 | 0°C~70°C TA | Tray | 2012 | IGLOOe | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGLE3000 | 1.5V | 1.575V | 1.425V | 63kB | 75264 | 516096 | 3000000 | 892.86MHz | 75264 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||
![]() | A42MX36-BGG272 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 272-BBGA | 272 | 272-PBGA (27x27) | 202 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX36 | 5V | 5.25V | 3V | 320B | 1184 | 2560 | 54000 | 131MHz | 1184 | 1822 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
![]() | MPF300TLS-FCG784I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 388 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300TLS-FCVG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BBGA, FCBGA | YES | 284 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 484 | CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL | 0.97V~1.08V | BOTTOM | BALL | 1V | 0.8mm | S-PBGA-B484 | 现场可编程门阵列 | 300000 | 21094400 | 3.32mm | 19mm | 19mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
![]() | MPF300TS-FCSG536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 300 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-1BGG272 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 272-BBGA | 272 | 272-PBGA (27x27) | 202 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX36 | 5V | 5.25V | 3V | 320B | 1184 | 2560 | 54000 | 151MHz | 1184 | 1 | 1822 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | MPF300TLS-FCSG536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 300 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300TS-1FCSG536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 300 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF500TL-FCG784E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 388 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 481000 | 33792000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-2BGG272I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 272-BBGA | 272 | 202 | -40°C~85°C TA | Tray | 2009 | MX | e1 | 活跃 | 3 (168 Hours) | 272 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | BOTTOM | BALL | 250 | 3.3V | 40 | A42MX36 | 5V | 320B | 现场可编程门阵列 | 2560 | 54000 | 164MHz | 1184 | 2 | 1822 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
![]() | MPF300TL-FCSG536E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 300 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-CQ256B | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | Military grade | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-BFCQFP with Tie Bar | 256 | 202 | -55°C~125°C TJ | Tray | 2009 | MX | e0 | 活跃 | 3 (168 Hours) | 256 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | QUAD | FLAT | 225 | 3.3V | 0.5mm | 20 | A42MX36 | 256 | 3.3V | 320B | 73MHz | 现场可编程门阵列 | 2560 | 54000 | MIL-STD-883 | 1822 | 2.7 ns | 2438 | 3.3mm | 36mm | 36mm | 无 | Non-RoHS Compliant | |||||||||||||||||||
![]() | MPF100TS-FCVG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | 284 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 109000 | 7782400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF100TL-FCSG325E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA | 325-FPGA (11x11) | 170 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 109000 | 7782400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL150-FC1152 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 1152-BBGA, FCBGA | YES | 574 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | M2GL150 | S-PBGA-B1152 | 574 | 不合格 | 1.2V | 625kB | 574 | 现场可编程门阵列 | 146124 | 5120000 | 2.9mm | 35mm | 35mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||
![]() | MPF100T-1FCVG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BFBGA | 484-FPBGA (19x19) | 284 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 109000 | 7782400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF200TL-FCG484E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BFBGA | 484-FPBGA (19x19) | 244 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE600L-FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 270 | -55°C~125°C TJ | Tray | ProASIC3EL | e1 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.2V | 1mm | 40 | A3PE600L | 270 | 1.5V | 1.2/1.51.2/3.3V | 13.5kB | 250MHz | 现场可编程门阵列 | 110592 | 600000 | 13824 | 2.44mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
![]() | MPF100TL-FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA | 325-FPGA (11x11) | 170 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 109000 | 7782400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF100TS-FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA | 325-FPGA (11x11) | 170 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 109000 | 7782400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF100TS-1FCVG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | 284 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 109000 | 7782400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX04-PLG84M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 6.777889g | 69 | -55°C~125°C TC | Tube | 2009 | MX | e3 | 活跃 | 3 (168 Hours) | 84 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | QUAD | J BEND | 245 | 3.3V | 1.27mm | 40 | A40MX04 | 5V | 现场可编程门阵列 | 6000 | 139MHz | 547 | 273 | 2.7 ns | 547 | 3.68mm | 29.31mm | 29.31mm | 无 | 符合RoHS标准 |