制造商是'Microsemi'
Microsemi 嵌入式 - FPGA（现场可编程门阵列）
(5267)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 内存大小 | 时钟频率 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | MPF300TL-FCSG536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | YES | 300 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 536 | CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL | 0.97V~1.08V | BOTTOM | BALL | 1V | 0.5mm | S-PBGA-B536 | 现场可编程门阵列 | 300000 | 21094400 | 1.45mm | 16mm | 16mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
| MPF300T-1FCSG536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 300 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPF300TS-1FCG784I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 388 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MPF500T-1FCG784E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 388 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 481000 | 33792000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | A42MX36-1BGG272I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 272-BBGA | 272 | 202 | -40°C~85°C TA | Tray | 2009 | MX | e1 | 活跃 | 3 (168 Hours) | 272 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | BOTTOM | BALL | 250 | 3.3V | 40 | A42MX36 | 5V | 320B | 现场可编程门阵列 | 2560 | 54000 | 151MHz | 1184 | 1 | 1822 | 2.3 ns | 2438 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
 | MPF500T-1FCG1152E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 1152-BBGA, FCBGA | 584 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 现场可编程门阵列 | 481000 | 33792000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MPF500TL-FCG1152E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 1152-BBGA, FCBGA | 584 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 现场可编程门阵列 | 481000 | 33792000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | M2GL025TS-1FCS325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 325-TFBGA | YES | 180 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | S-PBGA-B325 | 180 | 不合格 | 1.2V | 180 | 现场可编程门阵列 | 27696 | 1130496 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | M2GL025-1VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 27696 | 1130496 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | A3PE600-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 270 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 272MHz | A3PE600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 272MHz | 1 | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| A3PE600-2FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 270 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3PE600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 310MHz | 2 | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | M1AGL600V2-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~85°C TA | Tray | IGLOO | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | M1AGL600 | 不合格 | 1.5V | 13.5kB | 108MHz | 现场可编程门阵列 | 13824 | 110592 | 600000 | 1.05mm | 13mm | 13mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||
 | A3P1000-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 18kB | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 154 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 231MHz | A3P1000 | 1.5V | 1.575V | 1.425V | 8mA | 18kB | 11000 | 147456 | 1000000 | 231MHz | 24576 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||
| A3P250-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 4.5kB | IN PRODUCTION (Last Updated: 1 month ago) | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 157 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 231MHz | A3P250 | 1.5V | 1.575V | 1.425V | 3mA | 4.5kB | 3000 | 36864 | 250000 | 231MHz | 6144 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||
| MPF300TS-1FCG1152I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 512 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | M2GL010-TQG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 30 | S-PQFP-G144 | 现场可编程门阵列 | 12084 | 933888 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| A3P400-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 178 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | 3A001.A.7.B | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 231MHz | 40 | A3P400 | 1.5V | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
| MPF300T-1FCG1152I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 512 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL010T-VFG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B256 | 现场可编程门阵列 | 12084 | 933888 | 1.56mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
 | MPF200T-FCVG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BFBGA | 484-FPBGA (19x19) | 284 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | MPF100T-FCSG325E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA | 325-FPGA (11x11) | 170 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 109000 | 7782400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | MPF300TS-FCG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BBGA, FCBGA | YES | 244 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 484 | 0.97V~1.08V | BOTTOM | BALL | 260 | 1.05V | 1mm | 未说明 | S-PBGA-B484 | 现场可编程门阵列 | 300000 | 21094400 | 2.87mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
| MPF200T-FCG784E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 364 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
| MPF200T-FCG784I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | YES | 364 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 784 | CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL | 0.97V~1.08V | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | S-PBGA-B784 | 现场可编程门阵列 | 192000 | 13619200 | 3.47mm | 29mm | 29mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| MPF500T-FCG1152E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 1152-BBGA, FCBGA | 584 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 现场可编程门阵列 | 481000 | 33792000 | 符合RoHS标准 |