制造商是'Microsemi'
Microsemi 嵌入式 - FPGA（现场可编程门阵列）
(5267)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 内存大小 | 工作电源电流 | 内存大小 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
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 | AGL400V2-CSG196I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 196-TFBGA, CSBGA | 196 | 143 | -40°C~85°C TA | Tray | IGLOO | 活跃 | 3 (168 Hours) | 196 | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 1.2V | 0.5mm | AGL400 | 1.5V | 27μA | 6.8kB | 现场可编程门阵列 | 9216 | 55296 | 400000 | 250MHz | 700μm | 8mm | 8mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | A3PE3000L-1FG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e0 | 活跃 | 3 (168 Hours) | 896 | 锡铅 | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 30 | A3PE3000L | 620 | 1.2V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 892.86MHz | 1 | 75264 | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
 | AGL1000V5-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~85°C TA | Tray | 2015 | IGLOO | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 230 | 1.5V | 1mm | 30 | AGL1000 | 不合格 | 1.5V | 18kB | 现场可编程门阵列 | 24576 | 147456 | 1000000 | 892.86MHz | 1.73mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||
.png) | A3P600L-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e3 | Obsolete | 3 (168 Hours) | 208 | 哑光锡 | 1.14V~1.575V | QUAD | 鸥翼 | 245 | 1.2V | 0.5mm | 40 | A3P600L | 154 | 1.2V | 5mA | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 892.86MHz | 1 | 13824 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
 | APA600-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | -40°C~85°C TA | Tray | 2009 | ProASICPLUS | e0 | Obsolete | 3 (168 Hours) | 208 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.3V~2.7V | QUAD | 鸥翼 | 225 | 2.5V | 0.5mm | 180MHz | 30 | APA600 | 158 | 2.5V | 2.52.5/3.3V | 15.8kB | 现场可编程门阵列 | 129024 | 600000 | 21504 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||
 | A3P600-FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13.5kB | 表面贴装 | 表面贴装 | 484-BGA | 484 | 235 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 231MHz | 40 | A3P600 | 1.5V | 45mA | 13.5kB | 现场可编程门阵列 | 6500 | 110592 | 600000 | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||
| APA750-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | OBSOLETE (Last Updated: 3 weeks ago) | Lead, Tin | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | -40°C~85°C TA | Tray | 2009 | ProASICPLUS | e0 | Obsolete | 3 (168 Hours) | 208 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.3V~2.7V | QUAD | 鸥翼 | 225 | 2.5V | 0.5mm | 180MHz | 30 | APA750 | 158 | 2.5V | 2.52.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 750000 | 32768 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||
| APA300-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | OBSOLETE (Last Updated: 1 month ago) | Lead, Tin | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | -40°C~85°C TA | Tray | 2005 | ProASICPLUS | e0 | Obsolete | 3 (168 Hours) | 208 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.3V~2.7V | QUAD | 鸥翼 | 225 | 2.5V | 0.5mm | 180MHz | 30 | APA300 | 158 | 2.5V | 2.52.5/3.3V | 9kB | 现场可编程门阵列 | 73728 | 300000 | 8192 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||
 | A3P250L-VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | -40°C~100°C TJ | Tray | 2007 | ProASIC3L | e3 | Obsolete | 3 (168 Hours) | 100 | 哑光锡 | 8542.39.00.01 | 1.14V~1.575V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 40 | A3P250L | 68 | 1.2V | 1.5/3.3V | 3mA | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 781.25MHz | 6144 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||
 | A3P600-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 231MHz | 30 | A3P600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 13824 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
 | APA600-CQ352M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Military grade | 表面贴装 | 表面贴装 | 352-BFCQFP with Tie Bar | 352 | 248 | -55°C~125°C TC | Tray | 2007 | ProASICPLUS | e0 | Obsolete | 3 (168 Hours) | 352 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.3V~2.7V | QUAD | FLAT | 225 | 2.5V | 0.5mm | 20 | APA600 | 248 | 2.5V | 2.52.5/3.3V | 15.8kB | 现场可编程门阵列 | 129024 | 600000 | 5MHz | MIL-STD-883 Class B | 21504 | 2.89mm | 48mm | 48mm | 无 | Non-RoHS Compliant | |||||||||||||||||||
 | A54SX32A-2BG329I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 329-BBGA | 329 | 249 | -40°C~85°C TA | Tray | 2007 | SX-A | e0 | 活跃 | 3 (168 Hours) | 329 | 锡铅 | 2.25V~5.25V | BOTTOM | BALL | 225 | 2.5V | 313MHz | 30 | A54SX32A | 249 | 2.5V | 900 ps | 900 ps | 现场可编程门阵列 | 2880 | 48000 | 2 | 1980 | 0.9 ns | 1.8mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||
| AGLN060V5-VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 2.3kB | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~100°C TJ | Tray | 2013 | IGLOO nano | e3 | 活跃 | 3 (168 Hours) | 100 | Tin (Sn) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 未说明 | 1.5V | 0.5mm | 未说明 | AGLN060 | 不合格 | 1.5V | 10μA | 2.3kB | 现场可编程门阵列 | 1536 | 18432 | 60000 | 250MHz | 1mm | 14mm | 14mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||
 | AX1000-FG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 516 | -40°C~85°C TA | Tray | 2012 | Axcelerator | e0 | Obsolete | 3 (168 Hours) | 896 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 649MHz | 30 | AX1000 | 516 | 1.5V | 1.51.5/3.32.5/3.3V | 20.3kB | 990 ps | 990 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 12096 | 0.99 ns | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||
| AFS600-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.0989GHz | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
 | M2GL090-1FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 676-BGA | YES | 676 | 425 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | M2GL090 | 425 | 不合格 | 1.2V | 323.3kB | 现场可编程门阵列 | 86316 | 2648064 | 1 | 2.44mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||||||||||||||
 | AX1000-CQ352M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Military grade | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 352-BFCQFP with Tie Bar | 352 | 10.567001g | 198 | -55°C~125°C TA | Tray | 2005 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 352 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | QUAD | FLAT | 225 | 1.5V | 0.5mm | 649MHz | 20 | AX1000 | 516 | 1.5V | 1.51.5/3.32.5/3.3V | 20.3kB | 990 ps | 990 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | MIL-STD-883 Class B | 12096 | 0.99 ns | 2.66mm | 48mm | 48mm | 无 | Non-RoHS Compliant | |||||||||||||
 | AGL1000V2-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~85°C TA | Tray | 2013 | IGLOO | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | AGL1000 | 不合格 | 1.5V | 18kB | 现场可编程门阵列 | 24576 | 147456 | 1000000 | 892.86MHz | 1.2mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||
| AGL1000V2-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~85°C TA | Tray | 2013 | IGLOO | e0 | 活跃 | 3 (168 Hours) | 256 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 230 | 1.2V | 1mm | 30 | AGL1000 | 不合格 | 1.5V | 18kB | 现场可编程门阵列 | 24576 | 147456 | 1000000 | 892.86MHz | 1.2mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||
| M2GL010T-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 484 | 233 | 0°C~85°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | M2GL010T | 233 | 1.2V | 114kB | 现场可编程门阵列 | 12084 | 933888 | 2.44mm | 23mm | 23mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||
 | A3P125-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Lead, Silver, Tin | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 231MHz | 30 | A3P125 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 3072 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||
 | M2GL005-1TQG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 30 | S-PQFP-G144 | 现场可编程门阵列 | 6060 | 719872 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | M2GL010-VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 400-LFBGA | YES | 400 | 195 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | 195 | 不合格 | 1.2V | 114kB | 现场可编程门阵列 | 12084 | 933888 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||
| AGL600V2-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~85°C TA | Tray | 2009 | IGLOO | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | AGL600 | 1.5V | 13.5kB | 现场可编程门阵列 | 13824 | 110592 | 600000 | 892.86MHz | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
 | M2GL050-FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 200 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | S-PBGA-B325 | 200 | 不合格 | 1.2V | 200 | 现场可编程门阵列 | 56340 | 1869824 | 符合RoHS标准 | 无铅 |