制造商是'Microsemi'
Microsemi 嵌入式 - FPGA(现场可编程门阵列)
(5267)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
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![]() | A54SX72A-PQ208A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 171 | -40°C~125°C TA | Tray | 2002 | SX-A | Obsolete | 3 (168 Hours) | 125°C | -40°C | 2.25V~5.25V | A54SX72A | 2.5V | 2.75V | 2.25V | 1.5 ns | 108000 | 217MHz | 6036 | 6036 | 4024 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
![]() | A3P125-VQ100T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~125°C TA | Tray | 2009 | Automotive, AEC-Q100, ProASIC3 | Obsolete | 3 (168 Hours) | 100 | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 1.5V | 0.5mm | A3P125 | 71 | 1.5V | 1.5/3.3V | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 231MHz | 3072 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
![]() | A1020B-PL44C | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 44 | 34 | 0°C~70°C TA | Tray | 1997 | ACT™ 1 | e0 | Obsolete | 3 (168 Hours) | 44 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 4.5V~5.5V | QUAD | J BEND | 225 | 5V | 1.27mm | 48MHz | 30 | A1020 | 44 | 69 | 5V | 5V | 4.5 ns | 4.5 ns | 现场可编程门阵列 | 547 | 2000 | 273 | 547 | 547 | 4.572mm | 16.5862mm | 16.5862mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||
![]() | AX2000-2FG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 586 | -40°C~85°C TA | Tray | 2005 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 896 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 870MHz | 30 | AX2000 | 684 | 1.5V | 36kB | 740 ps | 740 ps | 现场可编程门阵列 | 294912 | 2000000 | 32256 | 2 | 21504 | 0.74 ns | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
![]() | APA300-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | 0°C~70°C TA | Tray | 2000 | ProASICPLUS | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 260 | 2.5V | 1mm | 180MHz | 40 | APA300 | 186 | 2.5V | 2.52.5/3.3V | 9kB | 现场可编程门阵列 | 73728 | 300000 | 8192 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
![]() | M2GL025TS-1FG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | -55°C~125°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | S-PBGA-B484 | 267 | 不合格 | 1.2V | 267 | 现场可编程门阵列 | 27696 | 1130496 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
![]() | M2GL090T-FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 676-BGA | YES | 425 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | M2GL090T | S-PBGA-B676 | 425 | 不合格 | 1.2V | 323.3kB | 425 | 现场可编程门阵列 | 86316 | 2648064 | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
![]() | M1A3PE1500-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 280 | 0°C~85°C TJ | Tray | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3PE1500 | 1.5V | 1.575V | 1.425V | 33.8kB | 276480 | 1500000 | 272MHz | 1 | 38400 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
![]() | M2GL090T-FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 676-BGA | YES | 425 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | M2GL090T | S-PBGA-B676 | 425 | 不合格 | 1.2V | 323.3kB | 425 | 现场可编程门阵列 | 86316 | 2648064 | 2.44mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
![]() | M2GL090T-FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 484 | 267 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | 267 | 不合格 | 1.2V | 323.3kB | 现场可编程门阵列 | 86184 | 2648064 | 86316 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
![]() | M2GL090TS-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B484 | 267 | 不合格 | 1.2V | 267 | 现场可编程门阵列 | 86184 | 2648064 | 86316 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
![]() | M1A3PE1500-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 280 | -40°C~100°C TJ | Tray | 2015 | ProASIC3E | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1A3PE1500 | 280 | 1.5V | 1.5/3.3V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 231MHz | 38400 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | M2GL090-1FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 676-BGA | YES | 425 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | M2GL090 | S-PBGA-B676 | 425 | 不合格 | 1.2V | 323.3kB | 425 | 现场可编程门阵列 | 86316 | 2648064 | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
![]() | A54SX32A-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 203 | -40°C~85°C TA | Tray | 2007 | SX-A | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 2.25V~5.25V | BOTTOM | BALL | 260 | 2.5V | 1mm | 238MHz | 40 | A54SX32A | 203 | 2.5V | 2.53.3/5V | 1.2 ns | 1.2 ns | 现场可编程门阵列 | 2880 | 48000 | 1980 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
![]() | M2GL090-1FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 676-BGA | YES | 425 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | M2GL090 | S-PBGA-B676 | 425 | 不合格 | 1.2V | 323.3kB | 425 | 现场可编程门阵列 | 86316 | 2648064 | 2.44mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
![]() | A3PE1500-1FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 676-FBGA (27x27) | 400.011771mg | 444 | 0°C~85°C TJ | Tray | 2015 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3PE1500 | 1.5V | 1.575V | 1.425V | 33.8kB | 276480 | 1500000 | 272MHz | 1 | 38400 | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
![]() | M2GL090-FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 425 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B676 | 425 | 不合格 | 1.2V | 425 | 现场可编程门阵列 | 86184 | 2648064 | 86316 | 2.44mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
![]() | M2GL090T-FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 425 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B676 | 425 | 不合格 | 1.2V | 425 | 现场可编程门阵列 | 86184 | 2648064 | 86316 | 2.44mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
![]() | M2GL090T-1FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 676-BGA | YES | 676 | 425 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | M2GL090T | 425 | 不合格 | 1.2V | 323.3kB | 现场可编程门阵列 | 86316 | 2648064 | 1 | 2.44mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
![]() | M2GL090T-1FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 676-BGA | YES | 425 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | M2GL090T | S-PBGA-B676 | 425 | 不合格 | 1.2V | 323.3kB | 425 | 现场可编程门阵列 | 86316 | 2648064 | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
![]() | M2GL090TS-FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 425 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B676 | 425 | 不合格 | 1.2V | 425 | 现场可编程门阵列 | 86184 | 2648064 | 86316 | 2.44mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
![]() | M2GL090T-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 484 | 267 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | M2GL090T | 267 | 不合格 | 1.2V | 323.3kB | 现场可编程门阵列 | 86316 | 2648064 | 1 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
![]() | AFS600-1FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 40 | AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.28205GHz | 1 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
![]() | M1A3PE1500-2FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 280 | -40°C~100°C TJ | Tray | ProASIC3E | e0 | 活跃 | 3 (168 Hours) | 484 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1A3PE1500 | 280 | 1.5V | 1.5/3.3V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 310MHz | 2 | 38400 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
![]() | A54SX32A-BG329I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 329-BBGA | 329 | 329-PBGA (31x31) | 249 | -40°C~85°C TA | Tray | 2007 | SX-A | 活跃 | 3 (168 Hours) | 85°C | -40°C | 2.25V~5.25V | 238MHz | A54SX32A | 2.5V | 2.75V | 2.25V | 1.2 ns | 1.2 ns | 2880 | 48000 | 238MHz | 2880 | 2880 | 1980 | 1.8mm | 31mm | 31mm | 无 | Non-RoHS Compliant |