制造商是'Microsemi'
Microsemi 嵌入式 - FPGA（现场可编程门阵列）
(5267)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 内存大小 | 工作电源电流 | 内存大小 | 传播延迟 | 接通延迟时间 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 高度 | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
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 | AGL030V2-VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 77 | -40°C~85°C TA | Tray | 2009 | IGLOO | e3 | 活跃 | 3 (168 Hours) | 100 | Tin (Sn) | 8542.39.00.01 | 1.14V~1.575V | QUAD | 鸥翼 | 未说明 | 1.2V | 0.5mm | 未说明 | AGL030 | 不合格 | 1.5V | 现场可编程门阵列 | 768 | 30000 | 892.86MHz | 768 | 1mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||
 | A3PN010-QNG48I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 21 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | 34 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 nano | 活跃 | 3 (168 Hours) | 48 | 8542.39.00.01 | 1.425V~1.575V | QUAD | 260 | 1.5V | 0.4mm | 30 | A3PN010 | 1.5V | 1mA | 现场可编程门阵列 | 10000 | 350MHz | 260 | 260 | 880μm | 6mm | 6mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
| A3P250-VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | -40°C~100°C TJ | Tray | 2012 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 100 | TIN/LEAD (SN/PB) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 231MHz | 30 | A3P250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 6144 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||
 | A3PE600-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Lead, Tin | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 270 | -40°C~100°C TJ | Tray | 2015 | ProASIC3E | e0 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 231MHz | 30 | A3PE600 | 270 | 1.5V | 1.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 13824 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||
| A3PE1500-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | Lead, Tin | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 280 | -40°C~100°C TJ | Tray | 2015 | ProASIC3E | e0 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 231MHz | 30 | A3PE1500 | 280 | 1.5V | 1.5/3.3V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 38400 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||
 | A3PE1500-FG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | Lead, Tin | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 444 | -40°C~100°C TJ | Tray | ProASIC3E | e0 | 活跃 | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | A3PE1500 | 444 | 1.5V | 1.5/3.3V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 231MHz | 38400 | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | ||||||||||||||||||
| A3P600L-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 235 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | A3P600L | 235 | 1.2V | 1.5/3.3V | 5mA | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 781.25MHz | 13824 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||
 | APA150-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 100 | -40°C~85°C TA | Tray | 2009 | ProASICPLUS | e0 | 活跃 | 3 (168 Hours) | 144 | 3A001.A.7.A | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 225 | 2.5V | 1mm | 180MHz | 30 | APA150 | 100 | 2.5V | 2.52.5/3.3V | 4.5kB | 现场可编程门阵列 | 36864 | 150000 | 6144 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||
 | APA150-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | -40°C~85°C TA | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 256 | 3A001.A.7.A | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 225 | 2.5V | 1mm | 180MHz | 30 | APA150 | 186 | 2.5V | 2.52.5/3.3V | 4.5kB | 现场可编程门阵列 | 36864 | 150000 | 6144 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||
 | APA450-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 100 | -40°C~85°C TA | Tray | 2007 | ProASICPLUS | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 260 | 2.5V | 1mm | 180MHz | 30 | APA450 | 100 | 2.5V | 2.52.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 12288 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||
| APA450-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 344 | -40°C~85°C TA | Tray | 2009 | ProASICPLUS | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 225 | 2.5V | 1mm | 180MHz | 30 | APA450 | 344 | 2.5V | 2.52.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 12288 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||
| AGL1000V2-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~85°C TA | Tray | 2015 | IGLOO | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 230 | 1.2V | 1mm | 30 | AGL1000 | 不合格 | 1.5V | 18kB | 现场可编程门阵列 | 24576 | 147456 | 1000000 | 892.86MHz | 1.73mm | 23mm | 23mm | Non-RoHS Compliant | 无铅 | |||||||||||||||||||
 | A3P125-TQ144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 1.319103g | 100 | -40°C~100°C TJ | Tray | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 231MHz | 30 | A3P125 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 3072 | 1.4mm | 20mm | 20mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
 | APA150-BGG456 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 456-BBGA | 456 | 242 | 0°C~70°C TA | Tray | 2009 | ProASICPLUS | e1 | Obsolete | 3 (168 Hours) | 456 | 锡银铜 | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 245 | 2.5V | 1.27mm | 40 | APA150 | 242 | 2.5V | 2.52.5/3.3V | 4.5kB | 现场可编程门阵列 | 36864 | 150000 | 180MHz | 6144 | 1.73mm | 35mm | 35mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||
 | A42MX36-2PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 3 weeks ago) | Lead, Tin | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 176 | -40°C~85°C TA | Tray | 2009 | MX | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | 30 | A42MX36 | 208 | 5V | 320B | 现场可编程门阵列 | 2560 | 54000 | 164MHz | 1184 | 2 | 1822 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||
| AGL400V5-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 178 | -40°C~85°C TA | Tray | 2012 | IGLOO | e0 | 活跃 | 3 (168 Hours) | 256 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 230 | 1.5V | 1mm | 30 | AGL400 | 不合格 | 1.5V | 27μA | 现场可编程门阵列 | 9216 | 55296 | 400000 | 250MHz | 1.2mm | 17mm | 17mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||
| AGL400V2-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 178 | -40°C~85°C TA | Tray | 2013 | IGLOO | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | AGL400 | 不合格 | 1.5V | 27μA | 6.8kB | 现场可编程门阵列 | 9216 | 55296 | 400000 | 250MHz | 1.2mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||
| A3P250L-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 157 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | Obsolete | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | A3P250L | 157 | 1.2V | 1.5/3.3V | 3mA | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 781.25MHz | 6144 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||
| A3P250L-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e1 | Obsolete | 3 (168 Hours) | 144 | 锡银铜 | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | A3P250L | 97 | 1.2V | 1.5/3.3V | 3mA | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 781.25MHz | 6144 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||||
| APA450-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 13.5kB | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | -40°C~85°C TA | Tray | ProASICPLUS | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 8542.39.00.01 | 2.3V~2.7V | QUAD | 鸥翼 | 245 | 2.5V | 0.5mm | 180MHz | 40 | APA450 | 158 | 2.5V | 2.52.5/3.3V | 5mA | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 12288 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||
| AX250-2FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 138 | -40°C~85°C TA | Tray | 2005 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 256 | 3A001.A.7.A | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 870MHz | 30 | AX250 | 248 | 1.5V | 6.8kB | 740 ps | 740 ps | 现场可编程门阵列 | 55296 | 250000 | 4224 | 2 | 2816 | 0.74 ns | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | 无铅 | |||||||||||||
| APA450-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | -40°C~85°C TA | Tray | 2007 | ProASICPLUS | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 260 | 2.5V | 1mm | 180MHz | 40 | APA450 | 186 | 2.5V | 2.52.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 12288 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||
 | AGL400V5-CS196I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 196-TFBGA, CSBGA | 196 | 143 | -40°C~85°C TA | Tray | 2015 | IGLOO | 活跃 | 3 (168 Hours) | 196 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 未说明 | 1.5V | 0.5mm | 未说明 | AGL400 | 不合格 | 1.5V | 27μA | 6.8kB | 现场可编程门阵列 | 9216 | 55296 | 400000 | 250MHz | 700μm | 8mm | 8mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||
| AGL030V5-VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 77 | -40°C~85°C TA | Tray | 2009 | IGLOO | e3 | 活跃 | 3 (168 Hours) | 100 | Tin (Sn) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 1.5V | 0.5mm | AGL030 | 1.5V | 现场可编程门阵列 | 768 | 30000 | 892.86MHz | 768 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| APA450-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | -40°C~85°C TA | Tray | 2009 | ProASICPLUS | e0 | Obsolete | 3 (168 Hours) | 208 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.3V~2.7V | QUAD | 鸥翼 | 225 | 2.5V | 0.5mm | 180MHz | 30 | APA450 | 158 | 2.5V | 2.52.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 12288 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | 含铅 |