制造商是'Microsemi'
Microsemi 嵌入式 - FPGA(现场可编程门阵列)
(5267)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 传播延迟 | 接通延迟时间 | 组织结构 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | ||
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![]() | M2GL010S-TQG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | YES | 84 | 0°C~85°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 30 | S-PQFP-G144 | 现场可编程门阵列 | 12084 | 933888 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | M1A3PE3000-2FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~85°C TJ | Tray | 2013 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3PE3000 | 1.5V | 1.575V | 1.425V | 63kB | 516096 | 3000000 | 310MHz | 2 | 75264 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | M1A3PE3000-2FGG324I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 324-BGA | 324 | 221 | -40°C~100°C TJ | Tray | 2010 | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 324 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 310MHz | 40 | M1A3PE3000 | 221 | 不合格 | 1.5V | 1.5/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 75264 | 75264 | 1.78mm | 19mm | 19mm | 符合RoHS标准 | ||||||||||||||||||||||||||
![]() | AX1000-1BGG729 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 729-BBGA | 729 | 516 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 729 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 245 | 1.5V | 763MHz | 40 | AX1000 | 516 | 1.5V | 20.3kB | 850 ps | 850 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 1 | 12096 | 0.84 ns | 1.73mm | 35mm | 35mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
![]() | AX1000-1BGG729I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 729-BBGA | 729 | 516 | -40°C~85°C TA | Tray | 2012 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 729 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 245 | 1.5V | 763MHz | 40 | AX1000 | 516 | 1.5V | 20.3kB | 850 ps | 850 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 1 | 12096 | 0.84 ns | 1.73mm | 35mm | 35mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
![]() | M2GL010S-1TQG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | YES | 84 | 0°C~85°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 144 | 1.14V~2.625V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 30 | S-PQFP-G144 | 现场可编程门阵列 | 12084 | 933888 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010S-1TQG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | YES | 84 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 144 | 1.14V~2.625V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 30 | S-PQFP-G144 | 现场可编程门阵列 | 12084 | 933888 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | AGLE600V2-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 165 | 0°C~70°C TA | Tray | 2012 | IGLOOe | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | AGLE600 | 1.575V | 1.14V | 13824 | 110592 | 600000 | 892.86MHz | 1.2mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
![]() | AX1000-BGG729 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 729-BBGA | 729 | 516 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 729 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 245 | 1.5V | 1.27mm | 649MHz | 40 | AX1000 | 516 | 1.5V | 1.51.5/3.32.5/3.3V | 20.3kB | 990 ps | 990 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 12096 | 0.99 ns | 1.73mm | 35mm | 35mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
![]() | M1A3PE3000-1FG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | -40°C~100°C TJ | Tray | 2015 | ProASIC3E | e0 | 活跃 | 3 (168 Hours) | 896 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | M1A3PE3000 | 620 | 1.5V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 272MHz | 1 | 75264 | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
![]() | AX1000-BGG729I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 729-BBGA | 729 | 516 | -40°C~85°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 729 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 245 | 1.5V | 1.27mm | 649MHz | 40 | AX1000 | 516 | 1.5V | 1.51.5/3.32.5/3.3V | 20.3kB | 990 ps | 990 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 12096 | 0.99 ns | 1.73mm | 35mm | 35mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
![]() | AX1000-2BGG729I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 729-BBGA | 729 | 516 | -40°C~85°C TA | Tray | 2009 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 729 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 245 | 1.5V | 870MHz | 40 | AX1000 | 516 | 1.5V | 20.3kB | 740 ps | 740 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 2 | 12096 | 0.74 ns | 1.73mm | 35mm | 35mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
![]() | AX2000-1FG896M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Military grade | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 586 | -55°C~125°C TA | Tray | 2012 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 896 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | AX2000 | 684 | 1.5V | 36kB | 850 ps | 现场可编程门阵列 | 21504 | 294912 | 2000000 | 763MHz | 32256 | MIL-STD-883 Class B | 1 | 0.84 ns | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
![]() | 5962-0151801QXC | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Military grade | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-BFCQFP with Tie Bar | 256 | 203 | -55°C~125°C TJ | Tray | 2007 | SX-A | e4 | 活跃 | 3 (168 Hours) | 256 | 3A001.A.2.C | GOLD | 2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION | 8542.39.00.01 | 2.25V~5.25V | QUAD | FLAT | 2.5V | 0.5mm | 238MHz | 5962-01518 | Qualified | 2.5V | 1.2 ns | 1.2 ns | 32000 GATES | 现场可编程门阵列 | 1800 | 48000 | 2880 | MIL-PRF-38535 Class Q | 1980 | 32000 | 3.22mm | 36mm | 36mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
![]() | 5962-0054301QYC | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Military grade | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFCQFP with Tie Bar | 208 | 171 | -55°C~125°C TJ | Tray | 2007 | SX-A | e4 | 活跃 | 3 (168 Hours) | 208 | 3A001.A.2.C | GOLD | 2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION | 8542.39.00.01 | 2.25V~5.25V | QUAD | FLAT | 2.5V | 0.5mm | 217MHz | 5962-00543 | Qualified | 2.5V | 1.5 ns | 1.5 ns | 72000 GATES | 现场可编程门阵列 | 4024 | 108000 | 6036 | MIL-PRF-38535 Class Q | 72000 | 3.16mm | 29.21mm | 29.21mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
![]() | AX2000-1CGS624M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 通孔 | 通孔 | 624-BCCGA | 624 | 624-CCGA (32.5x32.5) | 418 | -55°C~125°C TA | Tray | 2005 | Axcelerator | 活跃 | 3 (168 Hours) | 125°C | -55°C | 1.425V~1.575V | 763MHz | AX2000 | 1.5V | 1.575V | 1.425V | 36kB | 850 ps | 850 ps | 21504 | 294912 | 2000000 | 763MHz | 32256 | 21504 | 1 | 21504 | 2.73mm | 32.5mm | 32.5mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
![]() | A54SX32-BGG329 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 329-BBGA | 329 | 329-PBGA (31x31) | 249 | 0°C~70°C TA | Tray | 2006 | SX | 不用于新设计 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | 240MHz | A54SX32 | 5V | 5.25V | 4.75V | 900 ps | 900 ps | 2880 | 48000 | 240MHz | 2880 | 2880 | 1080 | 1.8mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | A54SX32-BG329 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 329-BBGA | 329 | 329-PBGA (31x31) | 249 | 0°C~70°C TA | Tray | 2006 | SX | 不用于新设计 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | 240MHz | A54SX32 | 5V | 5.25V | 4.75V | 900 ps | 900 ps | 2880 | 48000 | 240MHz | 2880 | 2880 | 1080 | 1.8mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
![]() | M1A3PE3000-1FGG324 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 324-BGA | 324-FBGA (19x19) | 221 | 0°C~85°C TJ | Tray | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3PE3000 | 63kB | 516096 | 3000000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | AX125-2FGG324 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 324-BGA | 324 | 400.011771mg | 168 | 0°C~70°C TA | Tray | 2012 | Axcelerator | e1 | Obsolete | 3 (168 Hours) | 324 | 锡银铜 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 870MHz | 40 | AX125 | 168 | 1.5V | 2.3kB | 740 ps | 740 ps | 现场可编程门阵列 | 18432 | 125000 | 2016 | 2 | 1344 | 0.74 ns | 1.25mm | 19mm | 19mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
![]() | M2GL050S-1FGG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 896-BGA | 896 | 377 | -40°C~100°C TJ | Tray | IGLOO2 | Obsolete | 3 (168 Hours) | 896 | 1.14V~2.625V | BOTTOM | BALL | 1.2V | 1mm | M2GL050S | 377 | 不合格 | 1.2V | 228.3kB | 现场可编程门阵列 | 56340 | 1869824 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | AGL125V2-VQ100T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-TQFP | 71 | 0°C~70°C TA | Tray | 2016 | IGLOO | Obsolete | 3 (168 Hours) | 8542.39.00.01 | 1.14V~1.575V | AGL125 | 4.5kB | 现场可编程门阵列 | 3072 | 36864 | 125000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL030V2-VQG100T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-TQFP | 77 | 0°C~70°C TA | Tray | 2016 | IGLOO | e3 | Obsolete | 3 (168 Hours) | Tin (Sn) | 8542.39.00.01 | 1.14V~1.575V | 未说明 | 未说明 | AGL030 | 现场可编程门阵列 | 768 | 30000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | 5962-9956903QXC | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Military grade | 表面贴装 | 表面贴装 | 256-BFCQFP Exposed Pad and Tie Bar | 256 | 256-CQFP (75x75) | 10.567001g | 180 | -55°C~125°C TJ | Tray | SX | Obsolete | 3 (168 Hours) | 125°C | -55°C | 3V~3.6V 4.75V~5.25V | 205MHz | 5962-99569 | 5V | 5.5V | 2.97V | 1 ns | 1 ns | 924 | 24000 | 205MHz | 1452 | 1452 | 528 | 2.8mm | 36mm | 36mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
![]() | A54SX08-1PL84 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 6.777889g | 69 | 0°C~70°C TA | Tray | 2006 | SX | e0 | Obsolete | 3 (168 Hours) | 84 | Tin/Lead (Sn/Pb) | 3V~3.6V 4.75V~5.25V | QUAD | J BEND | 225 | 3.3V | 280MHz | 30 | A54SX08 | 5V | 800 ps | 800 ps | 现场可编程门阵列 | 768 | 12000 | 1 | 256 | 0.8 ns | 768 | 8000 | 3.68mm | 29.31mm | 29.31mm | 无 | Non-RoHS Compliant |