制造商是'Microsemi'
Microsemi 嵌入式 - FPGA（现场可编程门阵列）
(5267)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A10V10B-PL68C | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 68-LCC (J-Lead) | 57 | 0°C~70°C TA | Tray | 1997 | ACT™ 1 | Obsolete | 3 (168 Hours) | 68 | 8542.39.00.01 | 2.7V~3.6V | QUAD | J BEND | 3.3V | 1.27mm | A10V10 | 68 | S-PQCC-J68 | 57 | 3.3V | 45MHz | 6.5 ns | 57 | 现场可编程门阵列 | 1200 | 295 | 147 | 4.5 ns | 295 | 295 | 24.2316mm | 24.2316mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | A54SX32A-TQ176I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 176-LQFP | 176-TQFP (24x24) | 147 | -40°C~85°C TA | Tray | 2007 | SX-A | Obsolete | 3 (168 Hours) | 2.25V~5.25V | A54SX32A | 48000 | 2880 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AX500-1FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Military grade | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | -55°C~125°C TA | Tray | 2012 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 763MHz | 40 | AX500 | 336 | 1.5V | 9kB | 850 ps | 850 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | MIL-STD-883 Class B | 1 | 5376 | 0.84 ns | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
.png) | AX2000-2FGG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 586 | -40°C~85°C TA | Tray | 2012 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 870MHz | 40 | AX2000 | 684 | 1.5V | 36kB | 740 ps | 740 ps | 现场可编程门阵列 | 294912 | 2000000 | 32256 | 2 | 21504 | 0.74 ns | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| AX250-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 138 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 763MHz | 40 | AX250 | 248 | 1.5V | 6.8kB | 850 ps | 850 ps | 现场可编程门阵列 | 55296 | 250000 | 4224 | 1 | 2816 | 0.84 ns | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| M2GL060T-1FG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | -55°C~125°C TJ | Tray | IGLOO2 | e0 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | 锡铅 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 未说明 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| AX1000-FGG896M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Military grade | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 516 | -55°C~125°C TA | Tray | 2012 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 896 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 649MHz | 40 | AX1000 | 516 | 1.5V | 1.51.5/3.32.5/3.3V | 20.3kB | 990 ps | 990 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | MIL-STD-883 Class B | 12096 | 0.99 ns | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
 | A54SX32A-CQ256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-BFCQFP with Tie Bar | 256 | 256-CQFP (75x75) | 203 | 0°C~70°C TA | Tray | 2007 | SX-A | 活跃 | 3 (168 Hours) | 70°C | 0°C | 2.25V~5.25V | A54SX32A | 2.5V | 1.2 ns | 48000 | 238MHz | 2880 | 2880 | 1980 | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
| M1A3P400-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 178 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
 | M1A3P400-2FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 1.55mm | 13mm | 13mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | M1A3P400-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 151 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 40 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 4.1mm | 28mm | 28mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| M1A3P400-2FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 178 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
| M1A3P400-2PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 151 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
| M1A3P400-1FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 178 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 1.8mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| M1A3P400-2PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 151 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 40 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 4.1mm | 28mm | 28mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| M1A3P1000-2FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P1000 | 1.5V | 1.575V | 1.425V | 18kB | 147456 | 1000000 | 310MHz | 2 | 24576 | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
| U1AFS600-FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 114 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 85°C | 0°C | 1.425V~1.575V | U1AFS600 | 4.5kB | 36864 | 250000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | A42MX24-TQG176M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 176-LQFP | 176 | 150 | -55°C~125°C TC | Tray | MX | e3 | 活跃 | 3 (168 Hours) | 176 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | A42MX24 | 5V | 现场可编程门阵列 | 36000 | 912 | 1410 | 2.5 ns | 1890 | 1.4mm | 24mm | 24mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| APA750-PQG208A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | -40°C~125°C TJ | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 208 | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 0.5mm | APA750 | 158 | 2.5V | 2.52.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 750000 | 180MHz | 32768 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | AX2000-2FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 586 | 0°C~70°C TA | Tray | 2012 | Axcelerator | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 870MHz | AX2000 | 1.5V | 1.575V | 1.425V | 36kB | 740 ps | 740 ps | 21504 | 294912 | 2000000 | 870MHz | 32256 | 21504 | 2 | 21504 | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| A3P250-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 151 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 272MHz | 40 | A3P250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 1 | 6144 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| M1A3P400-FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 97 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
| M1A3P400-1FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 97 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
| M1A3P400-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 178 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P400 | 6.8kB | 55296 | 400000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
| AX250-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 138 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 649MHz | 40 | AX250 | 248 | 1.5V | 1.51.5/3.32.5/3.3V | 6.8kB | 990 ps | 990 ps | 现场可编程门阵列 | 55296 | 250000 | 4224 | 2816 | 0.99 ns | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 |