制造商是'Microsemi'
Microsemi 嵌入式 - FPGA（现场可编程门阵列）
(5267)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 内存大小 | 传播延迟 | 接通延迟时间 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
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 | A42MX09-2PQ160I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 160-BQFP | 160 | 5.566797g | 101 | -40°C~85°C TA | Tray | 2009 | MX | e0 | Obsolete | 3 (168 Hours) | 160 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 225 | 3.3V | 0.65mm | 30 | A42MX09 | 160 | 5V | 现场可编程门阵列 | 14000 | 269MHz | 336 | 2 | 516 | 1.8 ns | 684 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
| A42MX09-3PQ160 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 160-BQFP | 160 | 160-PQFP (28x28) | 5.566797g | 101 | 0°C~70°C TA | Tray | 2009 | MX | Obsolete | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX09 | 5V | 5.25V | 3V | 336 | 14000 | 296MHz | 336 | 3 | 516 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| A42MX09-1PQ160 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 160-BQFP | 160 | 160-PQFP (28x28) | 5.566797g | 101 | 0°C~70°C TA | Tray | MX | Obsolete | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX09 | 5V | 5.25V | 3V | 336 | 14000 | 247MHz | 336 | 1 | 516 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| A42MX16-1PQ160I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 160-BQFP | 160 | 5.566797g | 125 | -40°C~85°C TA | Tray | 2009 | MX | e0 | Obsolete | 3 (168 Hours) | 160 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 225 | 3.3V | 0.65mm | 30 | A42MX16 | 160 | 5V | 现场可编程门阵列 | 24000 | 198MHz | 608 | 1 | 928 | 2.4 ns | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | A1460A-PQ160I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 160-BQFP | 160 | 131 | -40°C~85°C TA | Tray | 2012 | ACT™ 3 | e0 | Obsolete | 3 (168 Hours) | 160 | 锡铅 | 8542.39.00.01 | 4.5V~5.5V | QUAD | 鸥翼 | 225 | 5V | 0.65mm | 100MHz | 30 | A1460 | 5V | 3 ns | 3 ns | 现场可编程门阵列 | 848 | 6000 | 768 | 848 | 4.1mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
.png) | A1425A-1CQ132M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 132-BCQFP with Tie Bar | 132 | 100 | -55°C~125°C TC | Tray | ACT™ 3 | e0 | Obsolete | 3 (168 Hours) | 132 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 6250 PLD EQUIVALENT GATES AVAILABLE | 8542.39.00.01 | 4.5V~5.5V | QUAD | FLAT | 225 | 5V | 0.635mm | not_compliant | 150MHz | 30 | A1425 | 100 | 不合格 | 5V | 5V | 2.6 ns | 现场可编程门阵列 | 310 | 2500 | 310 | 310 | 2.9464mm | 24.13mm | 24.13mm | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | A3PE600-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 147 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3PE600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 231MHz | 13824 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
 | AX2000-FGG1152 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 1152-BGA | 1152 | 400.011771mg | 684 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | Obsolete | 3 (168 Hours) | 锡银铜 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 245 | 1.5V | 1mm | 649MHz | 40 | AX2000 | 684 | 1.5V | 1.51.5/3.32.5/3.3V | 36kB | 990 ps | 990 ps | 现场可编程门阵列 | 294912 | 2000000 | 32256 | 21504 | 0.99 ns | 1.73mm | 35mm | 35mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
| AX2000-FGG1152I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 1152-BGA | 1152 | 400.011771mg | 684 | -40°C~85°C TA | Tray | 2005 | Axcelerator | e1 | Discontinued | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 245 | 1.5V | 1mm | 649MHz | 40 | AX2000 | 684 | 1.5V | 1.51.5/3.32.5/3.3V | 36kB | 990 ps | 990 ps | 现场可编程门阵列 | 294912 | 2000000 | 32256 | 21504 | 0.99 ns | 1.73mm | 35mm | 35mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
 | AX2000-2FGG1152 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 1152-BGA | 1152 | 1152-FPBGA (35x35) | 400.011771mg | 684 | 0°C~70°C TA | Tray | 2005 | Axcelerator | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 870MHz | AX2000 | 1.5V | 1.575V | 1.425V | 36kB | 740 ps | 740 ps | 21504 | 294912 | 2000000 | 870MHz | 32256 | 21504 | 2 | 21504 | 1.73mm | 35mm | 35mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| A3PE600-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 147 | -40°C~100°C TJ | Tray | 2015 | ProASIC3E | e3 | Obsolete | 3 (168 Hours) | 208 | 哑光锡 | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 40 | A3PE600 | 147 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 272MHz | 1 | 13824 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| AX2000-2FGG1152I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 1152-BGA | 1152 | 400.011771mg | 684 | -40°C~85°C TA | Tray | Axcelerator | e1 | Discontinued | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 245 | 1.5V | 1mm | 870MHz | 40 | AX2000 | 684 | 1.5V | 36kB | 740 ps | 740 ps | 现场可编程门阵列 | 294912 | 2000000 | 32256 | 2 | 21504 | 0.74 ns | 1.73mm | 35mm | 35mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
| A3PE3000-1PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 147 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 40 | A3PE3000 | 147 | 1.5V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 272MHz | 1 | 75264 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | A1440A-1PQ160C | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 160-BQFP | 160 | 100 | 0°C~70°C TA | Tray | 2012 | ACT™ 3 | e0 | Obsolete | 3 (168 Hours) | 160 | 锡铅 | MAX 131 I/OS | 4.5V~5.5V | QUAD | 鸥翼 | 225 | 5V | 0.65mm | 150MHz | 30 | A1440 | 131 | 不合格 | 5V | 5V | 2.6 ns | 现场可编程门阵列 | 564 | 4000 | 564 | 564 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | M2GL010-1TQ144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | Obsolete | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 240 | 1.2V | 0.5mm | 20 | S-PQFP-G144 | 现场可编程门阵列 | 12084 | 933888 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
 | AGL125V2-VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | 100-VQFP (14x14) | 71 | -40°C~85°C TA | Tray | 2012 | IGLOO | 活跃 | 3 (168 Hours) | 1.14V~1.575V | AGL125 | 3072 | 36864 | 125000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P125-QNG132 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 132-WFQFN | 132 | 132-QFN (8x8) | 84 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 231MHz | A3P125 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 125000 | 3072 | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | M1AGL600V2-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 400.011771mg | 235 | 0°C~70°C TA | Tray | 2015 | IGLOO | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | M1AGL600 | 1.5V | 1.575V | 1.14V | 13.5kB | 13824 | 110592 | 600000 | 1.73mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| A3P250-PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 151 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | Obsolete | 3 (168 Hours) | 1.425V~1.575V | A3P250 | 36864 | 250000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | AGL400V5-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~85°C TA | Tray | 2013 | IGLOO | e1 | Obsolete | 3 (168 Hours) | 144 | 锡银铜 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | AGL400 | 不合格 | 1.5V | 27μA | 6.8kB | 现场可编程门阵列 | 9216 | 55296 | 400000 | 250MHz | 1.05mm | 13mm | 13mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | A40MX02-PLG68M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Tin | 表面贴装 | 表面贴装 | 68-LCC (J-Lead) | 68 | 4.869796g | 57 | -55°C~125°C TC | Tray | 2009 | MX | e3 | 活跃 | 3 (168 Hours) | 68 | 3A001.A.2.C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | QUAD | J BEND | 245 | 3.3V | 1.27mm | 40 | A40MX02 | 5V | 现场可编程门阵列 | 3000 | 139MHz | 295 | 147 | 2.7 ns | 295 | 3.68mm | 24.23mm | 24.23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
 | A40MX02-1PQG100M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-BQFP | 100 | 1.758804g | 57 | -55°C~125°C TC | Tray | 2009 | MX | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 245 | 3.3V | 0.65mm | 40 | A40MX02 | 5V | 现场可编程门阵列 | 3000 | 160MHz | 295 | 1 | 147 | 2.3 ns | 295 | 2.7mm | 20mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
| M2GL150TS-1FCVG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BFBGA | YES | 248 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B484 | 现场可编程门阵列 | 146124 | 5120000 | 3.15mm | 19mm | 19mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
 | A3PE3000-2FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 341 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3PE3000 | 1.5V | 1.575V | 1.425V | 63kB | 516096 | 3000000 | 310MHz | 2 | 75264 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | MPF200TS-FCG784I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 364 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 |