制造商是'Microsemi'
Microsemi 嵌入式 - FPGA（现场可编程门阵列）
(5267)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出的数量 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 传播延迟 | 接通延迟时间 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 高度 | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
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 | M7A3P1000-1PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | e3 | 不用于新设计 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 272MHz | 40 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 1 | 24576 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
 | A42MX09-PQG160 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 160-BQFP | 160 | 160-PQFP (28x28) | 5.566797g | 101 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX09 | 5V | 5.25V | 3V | 336 | 14000 | 215MHz | 336 | 516 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | M7A3P1000-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2000 | ProASIC3 | 不用于新设计 | 3 (168 Hours) | 484 | 1.425V~1.575V | BOTTOM | BALL | 1.5V | 272MHz | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 1 | 24576 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| M7A3P1000-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | e3 | 不用于新设计 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 231MHz | 40 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 24576 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
 | A40MX04-FPQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Tin | 表面贴装 | 表面贴装 | 100-BQFP | 100 | 100-PQFP (20x14) | 1.758804g | 69 | 0°C~70°C TA | Tray | 2015 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A40MX04 | 5V | 5.25V | 3V | 547 | 6000 | 83MHz | 547 | 273 | 2.7mm | 20mm | 14mm | 无 | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||||||||
| A40MX02-PQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-BQFP | 100 | 100-PQFP (20x14) | 1.758804g | 57 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A40MX02 | 5V | 5.25V | 3V | 295 | 3000 | 139MHz | 295 | 147 | 2.7mm | 20mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| A42MX16-FPQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 100-BQFP | 100 | 100-PQFP (20x14) | 1.758804g | 83 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX16 | 5V | 5.25V | 3V | 608 | 24000 | 103MHz | 608 | 928 | 2.7mm | 20mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | A40MX02-2VQG80 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 80-TQFP | 80 | 80-VQFP (14x14) | 57 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A40MX02 | 5V | 5.25V | 3V | 295 | 3000 | 175MHz | 295 | 2 | 147 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | A54SX16A-1TQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 657.000198mg | 81 | 0°C~70°C TA | Tray | 2003 | SX-A | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 2.25V~5.25V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 263MHz | 40 | A54SX16A | 172 | 2.5V | 2.53.3/5V | 1.2 ns | 1.2 ns | 现场可编程门阵列 | 1452 | 24000 | 1 | 990 | 1.4mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
| A40MX04-1VQG80I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 80-TQFP | 80 | 69 | -40°C~85°C TA | Tray | 2009 | MX | e3 | 活跃 | 3 (168 Hours) | 80 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 260 | 3.3V | 0.65mm | 40 | A40MX04 | 5V | 现场可编程门阵列 | 6000 | 160MHz | 547 | 1 | 273 | 2.3 ns | 547 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| A40MX02-2VQG80I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 80-TQFP | 80 | 57 | -40°C~85°C TA | Tray | 2009 | MX | e3 | 活跃 | 3 (168 Hours) | 80 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 260 | 3.3V | 0.65mm | 40 | A40MX02 | 5V | 现场可编程门阵列 | 3000 | 175MHz | 295 | 2 | 147 | 295 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
 | A42MX16-FTQG176 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 176-LQFP | 176 | 176-TQFP (24x24) | 140 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX16 | 5V | 5.25V | 3V | 24000 | 103MHz | 928 | 1.4mm | 24mm | 24mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| A54SX16A-1TQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 657.000198mg | 81 | -40°C~85°C TA | Tray | 2007 | SX-A | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 2.25V~5.25V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 263MHz | 40 | A54SX16A | 172 | 2.5V | 2.53.3/5V | 1.2 ns | 1.2 ns | 现场可编程门阵列 | 1452 | 24000 | 1 | 990 | 1.4mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
 | M7A3P1000-1FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | e1 | 不用于新设计 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 272MHz | 40 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 1 | 24576 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
 | A54SX08A-2TQG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 1.319103g | 113 | -40°C~85°C TA | Tray | 2007 | SX-A | e3 | 活跃 | 3 (168 Hours) | 144 | Matte Tin (Sn) | 8000 TYPICAL GATES AVAILABLE | 2.25V~5.25V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 313MHz | 40 | A54SX08A | 113 | 2.5V | 900 ps | 900 ps | 现场可编程门阵列 | 768 | 12000 | 2 | 512 | 0.9 ns | 768 | 768 | 1.4mm | 20mm | 20mm | 无 | 符合RoHS标准 | |||||||||||||||||||
| A42MX09-FTQG176 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 176-LQFP | 176 | 176-TQFP (24x24) | 104 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX09 | 5V | 5.25V | 3V | 336 | 14000 | 129MHz | 336 | 516 | 1.4mm | 24mm | 24mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | M7A3P1000-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | 0°C~85°C TJ | Tray | ProASIC3 | e1 | 不用于新设计 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 272MHz | 40 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 1 | 24576 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
| M7A3P1000-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2000 | ProASIC3 | e1 | 不用于新设计 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 231MHz | 40 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 24576 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| A40MX02-3VQG80 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 80-TQFP | 80 | 80-VQFP (14x14) | 57 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A40MX02 | 5V | 5.25V | 3V | 295 | 3000 | 188MHz | 295 | 3 | 147 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| A54SX32A-1TQG100M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 657.000198mg | 81 | -55°C~125°C TC | Tray | SX-A | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 32000 TYPICAL GATES AVAILABLE | 2.25V~5.25V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 278MHz | 40 | A54SX32A | 81 | 2.5V | 2.52.5/5V | 1.1 ns | 1.1 ns | 现场可编程门阵列 | 2880 | 48000 | 1 | 1980 | 1.4mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
| A54SX32A-1TQG144M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 1.319103g | 113 | -55°C~125°C TC | Tray | SX-A | e3 | 活跃 | 3 (168 Hours) | 144 | Matte Tin (Sn) | 32000 TYPICAL GATES AVAILABLE | 2.25V~5.25V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 278MHz | 40 | A54SX32A | 113 | 2.5V | 2.53.3/5V | 1.1 ns | 1.1 ns | 现场可编程门阵列 | 2880 | 48000 | 1 | 1980 | 1.4mm | 20mm | 20mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
| A54SX32A-1FGG256M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 203 | -55°C~125°C TC | Tray | SX-A | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 32000 TYPICAL GATES AVAILABLE | 2.25V~5.25V | BOTTOM | BALL | 260 | 2.5V | 40 | A54SX32A | 203 | 2.5V | 2.52.5/5V | 1.1 ns | 现场可编程门阵列 | 48000 | 278MHz | 2880 | 1 | 1980 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| AX250-FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | Military grade | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 248 | -55°C~125°C TA | Tray | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 649MHz | 40 | AX250 | 248 | 1.5V | 1.51.5/3.32.5/3.3V | 6.8kB | 990 ps | 990 ps | 现场可编程门阵列 | 55296 | 250000 | 4224 | MIL-STD-883 Class B | 2816 | 0.99 ns | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||
| A54SX32-TQG144M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 1.319103g | 113 | -55°C~125°C TC | Tray | SX | e3 | 不用于新设计 | 3 (168 Hours) | 144 | 3A001.A.2.C | Matte Tin (Sn) | 8542.39.00.01 | 3V~3.6V 4.75V~5.25V | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 240MHz | 40 | A54SX32 | 113 | 5V | 900 ps | 900 ps | 现场可编程门阵列 | 2880 | 48000 | 1080 | 0.9 ns | 32000 | 1.4mm | 20mm | 20mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
| M1AFS1500-FG256K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 119 | -55°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | M1AFS1500 | 33.8kB | 276480 | 1500000 | Non-RoHS Compliant |