制造商是'Microchip'
Microchip 射频收发器模块
(383)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | 深度 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 工作电源电压 | 通道数量 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 电源电流 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 位元大小 | 有ADC | DMA 通道 | 数据率 | 脉宽调制通道 | 数模转换器通道 | 使用的 IC/零件 | 评估套件 | 议定书 | 最高频率 | 筛选水平 | 通信IC类型 | 功率 - 输出 | 无线电频率系列/标准 | 天线类型 | 敏感度 | 串行接口 | 接收电流 | 传输电流 | 调制 | 灵敏度(dBm) | 固件版本 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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![]() | BM70BLE01FC2-0B03AA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | Module | YES | -40°C~85°C | Tray | 2017 | yes | 活跃 | 1 (Unlimited) | 30 | 1.9V~3.6V | UNSPECIFIED | 无铅 | 1 | 3V | 2.4GHz | BM70 | R-XXMA-N30 | 256kB Flash 32kB ROM 24kB SRAM | 8.6 Mbps | Bluetooth v5.0 | 电信电路 | 0dBm | Bluetooth | 不包括天线 | -90dBm | I2C, SPI, UART | 13mA | 1.06 | 1.6mm | 15mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | ATZB-A24-UFLR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8kB | 表面贴装 | 表面贴装 | PCB模块 | 57 | -20°C~70°C | Tape & Reel (TR) | 2009 | ZigBit™ | Obsolete | 3 (168 Hours) | 85°C | -40°C | 3V~3.6V | 2.4GHz | 16 | I2C, SPI, UART | 3.6V | 3V | 128kB Flash 4kB EEPROM 8kB RAM | 250kbps | AT86RF230 | Zigbee® | 2.4835GHz | 20dBm | 802.15.4 | Antenna Not Included, U.FL | -104dBm | I2C, JTAG, SPI, UART, USART | 23mA | 50mA | -104 dBm | 2mm | 38mm | 13.5mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
![]() | ATWINC1510-MR210UB | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 40 | Industrial grade | -40°C~85°C | Tray | 2015 | yes | 活跃 | 3 (168 Hours) | 28 | SEATED HGT-NOM | 3V~4.2V | UNSPECIFIED | 无铅 | 3.6V | 2.4GHz | R-XXMA-N28 | 3.6V | 1 | I2C, SPI, UART | 8MB Flash 128kB RAM | 微处理器电路 | 72.2Mbps | 802.11b/g/n | 19.5dBm | WiFi | Antenna Not Included, U.FL | I2C, SPI, UART | 52.5mA~70.1mA | 132mA~294mA | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | -98 dBm | 19.4.4 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
![]() | ATWINC3400-MR210UA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | Module | 48 | -40°C~85°C | Tray | 2015 | yes | 活跃 | 3 (168 Hours) | 3.3V | 2.4GHz~2.48GHz | ATWINC3400 | 3.6V | 1 | I2C, SPI, UART | 256kB ROM 708kB RAM | 72.2Mbps | 802.11b/g/n | 20dBm | WiFi | Antenna Not Included, U.FL | I2C, SPI, UART | -98 dBm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ATWINC1510-MR210PB1944 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | YES | -40°C~85°C | Tray | 2017 | 活跃 | 3 (168 Hours) | 28 | 2.7V~3.6V | UNSPECIFIED | 无铅 | 3.3V | 2.4GHz | R-XXMA-N28 | 8MB Flash 128kB RAM | 微处理器电路 | 72.2Mbps | 802.11b/g/n | 18.5dBm | WiFi | Integrated, Trace | -95dBm | I2C, SPI, UART | 61mA | 265mA | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | 19.4.4 | 2.113mm | 21.72mm | 14.73mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | ATWINC1510-MR210UB1140 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | Tray | 2017 | 活跃 | 3 (168 Hours) | 3V~4.2V | 2.4GHz | 4MB Flash | 72.2Mbps | ATWINC1500 | 802.11b/g/n | 700mW | WiFi | Integrated, Trace + U.FL | -90dBm | SPI, UART | 70mA | 170mA | CCK, DSSS, OFDM | 19.4.4 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ATZB-A24-UFLBR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | Module | 57 | -20°C~70°C | Cut Tape (CT) | ZigBit™ | Obsolete | 3 (168 Hours) | 85°C | -40°C | 3V~3.6V | 2.4GHz | 16 | I2C, SPI, UART | 128kB Flash 4kB EEPROM 8kB RAM | 250kbps | AT86RF230 | Zigbee® | 20dBm | 802.15.4 | Antenna Not Included, U.FL | -101dBm | I2C, JTAG, SPI, UART, USART | 39.5mA | 183.5mA | -107 dBm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RN4870-I/RM128 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | Module | NO | -40°C~85°C | Tray | 2018 | 活跃 | 2 (1 Year) | 33 | 8542.39.00.01 | 3.3V | UNSPECIFIED | 无铅 | 1 | 3.3V | 1.1mm | 2.4GHz | RN4870 | R-XXMA-N33 | 10kbps | Bluetooth v5.0 | 电信电路 | 0dBm | Bluetooth | Integrated, Chip | -90dBm | UART | 10mA~13mA | 13mA | GFSK | 1.2.8 | 2.4mm | 22mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
![]() | ATSAMW25H18-MR510UB | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 51 | -40°C~85°C | Tray | 2015 | Xplained Pro | 活跃 | 3 (168 Hours) | 51 | 2.7V~4.2V | UNSPECIFIED | 无铅 | 1 | 3.3V | 1.2mm | 2.4GHz | ATSAMW25 | SPI, UART | 256kB Flash 32kB SRAM | 65Mbps | ATWINC1500 | 802.11b/g/n | 电信电路 | 17dBm | WiFi | Antenna Not Included, U.FL | SPI, UART | -95.5 dBm | 19.4.4 | 2.138mm | 33.864mm | 14.908mm | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
![]() | ATZB-X0-256-3-0-C | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 16kB | 表面贴装 | 表面贴装 | Module | 42 | Industrial grade | -40°C~85°C | Tray | 1999 | ZigBit™ | yes | 活跃 | 1 (Unlimited) | 1.8V~3.6V | 2.4GHz | 3V | 16 | SPI, UART, USART | 256kB Flash 4kB EEPROM 16kB SRAM | 2Mbps | AT86RF233 | Zigbee® | 4dBm | 802.15.4 | Integrated, Chip | ISP, JTAG, SPI, UART, USART | 6.1mA~17mA | 5.6mA~20.5mA | -96 dBm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | ATWILC1000-MR110PB-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | 2016 | 活跃 | 3 (168 Hours) | 28 | 1.8V~3.6V | 3.3V | 2.412GHz~2.472GHz | ATWILC1000 | 微处理器电路 | 54Mbps | 802.11b/g/n | 18.7dBm | WiFi | Integrated, Trace | -94dBm | I2C, SDIO, SPI, UART | 63mA | CCK, DSSS, OFDM | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ATZB-RF-212B-0-CN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | Module | 42 | -40°C~85°C | Bulk | 2015 | ZigBit™ | yes | 活跃 | 1 (Unlimited) | 1.8V~3.6V | 900MHz | 1Mbps | AT86RF212B | Zigbee® | 11dBm | 802.15.4 | Integrated, Chip | SPI | 9.3mA | 5mA~26.9mA | -103 dBm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MRF24J40MB-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | Module | 12 | -40°C~85°C | Tray | 2009 | yes | Obsolete | 1 (Unlimited) | 2.4V~3.6V | 22.86mm | unknown | 2.4GHz | MRF24J40M | 3.3V | 130mA | 250kbps | 有 | Zigbee® | 20dBm | 802.15.4 | Integrated, Trace | SPI | 25mA | -102 dBm | 1.73mm | 33.02mm | 22.86mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | BM78SPP05MC2-0004AA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | Module | YES | Automotive grade | -20°C~70°C | Tray | 活跃 | 1 (Unlimited) | 30 | 3.3V~4.2V | UNSPECIFIED | 无铅 | 1 | unknown | 2.4GHz | BM78 | R-XXMA-N30 | Bluetooth v4.2 | TS 16949 | 电信电路 | 1.5dBm | Bluetooth | Antenna Not Included, Castellation | -92dBm | I2C, UART | 37mA | 43mA | 1.35 | 1.8mm | 15mm | 12mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | ATZB-A24-U0 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | PCB模块 | 57 | -20°C~70°C | Bulk | ZigBit™ | Obsolete | 1 (Unlimited) | 70°C | -20°C | 3V~3.6V | 2.4GHz | 3.6V | I2C, SPI, UART | 128kB Flash 4kB EEPROM 8kB RAM | 250kbps | AT86RF230 | Zigbee® | 20dBm | 802.15.4 | 不包括天线 | -104dBm | I2C, JTAG, SPI, UART, USART | 23mA | 50mA | -104 dBm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | RN2483-I/RM101 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | -40°C~85°C | Tray | 2015 | Obsolete | 1 (Unlimited) | 47 | 8542.31.00.01 | 2.1V~3.6V | 无铅 | 1 | 3.3V | 1.27mm | 433MHz 868MHz | RN2483 | R-XXMA-N47 | I2C, SPI, UART | 38.9mA | 300kbps | LoRa™ | 以太网收发器 | 14dBm | General ISM < 1GHz | 不包括天线 | I2C, SPI, UART | 14.3mA | 39mA | -146 dBm | 1.0.1 | 3.34mm | 26.67mm | 17.78mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
![]() | MRF24J40MA-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Tin | 表面贴装 | 表面贴装 | Module | 12 | Industrial grade | -40°C~85°C | Tray | 2008 | 活跃 | 3 (168 Hours) | 12 | 2.4V~3.6V | 3.3V | 17.78mm | 2.4GHz | MRF24J40M | 3.3V | 23mA | 250kbps | Zigbee® | 0dBm | 802.15.4 | Integrated, Trace | SPI | 19mA | -94 dBm | 890μm | 27.9mm | 17.78mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
![]() | ATWINC1500-MR210PB1140 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Module | YES | -40°C~85°C | Tray | 2017 | yes | 活跃 | 3 (168 Hours) | 28 | SEATED HGT-NOM | 2.7V~3.6V | UNSPECIFIED | 无铅 | 3.6V | 2.4GHz | ATWINC1500 | R-XXMA-N28 | 4MB Flash 128kB RAM | 微处理器电路 | 72.2Mbps | 802.11b/g/n | 18.5dBm | WiFi | Integrated, Trace | -95dBm | I2C, SPI, UART | 61mA | 265mA | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | 19.4.4 | 2.113mm | 21.72mm | 14.73mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
![]() | RN1810-I/RM110 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 37-SMD Module | YES | Automotive grade | -40°C~85°C | Tray | 2001 | yes | 活跃 | 1 (Unlimited) | 37 | 3.3V | UNSPECIFIED | 无铅 | 1 | 3.3V | 1.27mm | 2.4GHz | RN1810 | R-XXMA-N37 | 54Mbps | 802.11b/g/n | TS 16949 | 电信电路 | 18dBm | WiFi | Integrated, Trace | -94dBm | UART | 64mA | 211mA~263mA | 16QAM, 64QAM, BPSK, CCK, DSSS, QPSK | 1.1.0 | 2.159mm | 26.67mm | 17.78mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
![]() | RN171-I/RM480 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 49-SMD Module | YES | Automotive grade | -40°C~85°C | Tray | 2012 | Obsolete | 1 (Unlimited) | 49 | 3.3V | QUAD | 无铅 | 1 | 3.3V | 2.4GHz | RN171 | R-XQMA-N49 | 8MB Flash 128kB RAM | 54Mbps | 802.11b/g | TS 16949 | 无线局域网电路 | 0dBm | WiFi | 不包括天线 | -83dBm | UART | 40mA | 120mA | 4.8 | 3.175mm | 26.67mm | 17.78mm | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
![]() | ATSAMR21G18-MR210UAT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | YES | 18 | -40°C~85°C | Cut Tape (CT) | 2015 | 活跃 | 3 (168 Hours) | 42 | 8542.31.00.01 | 1.8V~3.6V | UNSPECIFIED | 无铅 | 3.3V | 1mm | 2.4GHz | ATSAMR21G | R-XXMA-N42 | 48 MHz | 4MB Flash | MICROCONTROLLER, RISC | 32 | YES | NO | NO | NO | Zigbee® | 3.5dBm | 802.15.4 | Antenna Not Included, U.FL | -98dBm | I2C, SPI, UART | 10mA | 20mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
![]() | RN41APL-I/RM550 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | Automotive grade | -40°C~85°C | Tray | 2012 | yes | 活跃 | 3 (168 Hours) | 32 | 3V~3.6V | UNSPECIFIED | 无铅 | 1 | 3.3V | 2.4GHz | RN41 | R-XXMA-N32 | SPI, UART, USB | 3Mbps | Bluetooth v2.1 + EDR | TS 16949 | 电信电路 | 18dBm | Bluetooth | Integrated, Chip | SPI, UART, USB | 35mA | 65mA | -86 dBm | 5.5 | 2.1mm | 25.8mm | 13.2mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
![]() | RN2903-I/RM095 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | Module | Automotive grade | -40°C~85°C | Tray | 2017 | Obsolete | 1 (Unlimited) | 47 | 2.1V~3.6V | UNSPECIFIED | 无铅 | 3.3V | 1.27mm | 915MHz | RN2903 | R-XXMA-N47 | I2C, SPI, UART | 微处理器电路 | 300kbps | LoRa™ | TS 16949 | 18.5dBm | General ISM < 1GHz | Antenna Not Included, SMA | I2C, SPI, UART | 13.5mA | 125mA | FSK, GFSK | -146 dBm | 0.9.5 | 3.34mm | 26.67mm | 17.78mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
![]() | ATSAMR21B18-MZ210PAT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | -40°C~125°C | Tape & Reel (TR) | 2015 | 活跃 | 3 (168 Hours) | 125°C | -40°C | 2.7V~3.6V | 2.4GHz | I2C, SPI, UART | 256kB Flash | Zigbee® | -1dBm | 802.15.4 | Integrated, Trace | I2C, SPI, UART | 11.8mA | 13.8mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RN41HID-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 35-SMD Module | -40°C~85°C | Bulk | 2012 | e3 | 活跃 | 3 (168 Hours) | 32 | Matte Tin (Sn) | 8542.39.00.01 | 3V~3.6V | UNSPECIFIED | 无铅 | 250 | 1 | 3.3V | 2.4GHz | 40 | RN41 | R-XXMA-N32 | UART | 3Mbps | Bluetooth v2.1 +EDR, Class 1 | 电信电路 | 16dBm | Bluetooth | Integrated, Chip | SPI, UART, USB | 35mA | 65mA | FHSS, GFSK | -80 dBm | HID/6.11 | 2.2mm | 25.8mm | 13.2mm | ROHS3 Compliant |