N/A

-

+ 70 C

4.2 V

- 20 C

88

3.3 V

SMD/SMT

UART, I2C

- 90 dBm, -92 dBm

Microchip

Microchip Technology / Atmel

Internal Antenna

Class 2

Tray

BM78

活跃

Bluetooth Modules - 802.15.1

表面贴装

33-SMD Module

微芯片技术

-

-20°C ~ 70°C

Tray

-

Wireless & RF Modules

3.3V ~ 4.2V

Unshielded

2.44 GHz

3.8 V

4MB Flash, 320kB ROM, 28kB SRAM

1.5 dBm

115.2kBaud

-

Bluetooth 5.0 + EDR

2.402 GHz to 2.48 GHz

2dBm

Bluetooth

Integrated, Chip

-92dBm

I²C, UART

37mA

43mA

-

蓝牙模块

蓝牙模块

N/A

-

921.6 Kbps

表面贴装

15 I/O

+ 70 C

3.6 V

- 20 C

5000

1.9 V

SMD/SMT

10 mA

I2C, SPI, UART

10 mA

Microchip

微芯片技术

SRAM

24 kB

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

RF System on a Chip - SoC

表面贴装

QFN-32

微芯片技术

QFN

-40°C ~ 85°C

Reel

IS1871

Bluetooth

Wireless & RF Integrated Circuits

Si

1.9V ~ 3.6V

2.402GHz ~ 2.48GHz

32

2.4 GHz

14.7000, 15.3000 V

256kB Flash, 32kB ROM, 24kB SRAM

0.013 A

Flash, ROM

256 kB, 32 kB

0 dBm

921.6kbps

8 bit

8051

Bluetooth v4.2

0dBm

Bluetooth

PCB Trace

- 90 dBm

6 Channel

ADC, I²C, PWM, SPI, UART

13mA

13mA

-

RF System on a Chip - SoC

0.9 mm

4 mm

4 mm

N/A

-

RN52

Obsolete

表面贴装

50-SMD Module

微芯片技术

Bulk

-40°C ~ 85°C

RN52

-

2.4GHz

16MB Flash

3Mbps

-

Bluetooth v3.0, Class 2

4dBm

Bluetooth

PCB Trace

-85dBm

AIO, I²S, SPI, UART, USB

-

-

DPSK, DQPSK, GFSK

N/A

-

11000@b/54000@g Kbps

Commercial grade

SMD模块

0 to 70 °C

44

Commercial

CCK/DBPSK/DQPSK/DSSS/OFDM

N/A

-

活跃

表面贴装

35-SMD Module

Knowles Syfer

Tape & Reel (TR)

-40°C ~ 85°C

*

3V ~ 3.6V

2.402GHz ~ 2.48GHz

-

3Mbps

-

Bluetooth v2.1 +EDR, Class 1

18.4dBm

Bluetooth

Integrated, Chip

-80dBm

SPI, UART, USB

35mA

65mA

FHSS, GFSK

N/A

-

浅灰色

Tape & Reel (TR)

Obsolete

微芯片技术

(W x H x D) 750 x 780 x 500 mm

*

Basic Design

500mm

780mm

750mm

N/A

-

Obsolete

表面贴装

49-LFLGA Module

微芯片技术

Tape & Reel (TR)

-40°C ~ 85°C

-

1.8V ~ 4.3V

2.402GHz ~ 2.48GHz

128kB ROM, 128kB RAM

1Mbps

-

Bluetooth v5.0

3.5dBm

Bluetooth

Antenna Not Included, Wire Antenna

-90dBm

ADC, GPIO, I²C, PWM, SPI, UART

5.66mA

4.33mA ~ 6.2mA

GFSK

N/A

-

-90dBm

0dBm

+ 85 C

3.6 V

- 40 C

136

1.9 V

SMD/SMT

10 mA

ADC, GPIO, I2C, SPI, UART

10 mA

Microchip

Microchip Technology / Atmel

Details

Bluetooth Low Energy (BLE)

Tray

BM70

活跃

15 mm x 12 mm x 1.6 mm

Bluetooth Modules - 802.15.1

表面贴装

30-SMD Module

微芯片技术

板对板连接器

-40°C ~ 85°C (TA)

Tray

-

Through Hole Sockets Headers

Wireless & RF Modules

1.9V ~ 3.6V

Unshielded

2.44 GHz

1.9 V to 3.6 V

256kB Flash, 32kB ROM, 24kB SRAM

0 dBm

8.6Kbps

-

Bluetooth 5.0

2.402 GHz to 2.48 GHz

0dBm

Bluetooth

不包括天线

- 90 dBm

ADC, GPIO, I²C, PWM, SPI, UART

10mA

10mA

PWM

蓝牙模块

Through Hole Sockets Headers

1.6 mm

15 mm

12 mm

N/A

-

802.11 b/g/n, WiFi

+ 85 C

3.6 V

- 40 C

50

2.7 V

22 mA

ISM

Microchip Technology / Atmel

Microchip

22 mA

SPI

Tray

活跃

21.7 mm x 14.7 mm x 2.1 mm

WiFi Modules - 802.11

表面贴装

28-SMD Module

微芯片技术

BGA Socketing Systems

-40°C ~ 85°C

Tray

-

Socket Adapter Systems

Wireless & RF Modules

1.27mm Pitch

2.7V ~ 3.6V

2.412 GHz to 2.484 GHz

3.3 V

4MB Flash, 128kB RAM

1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps

ATWINC1500

802.11b/g/n

18.9dBm

WiFi

Integrated, Trace

-95dBm

I²C, SPI, UART

61mA

264mA ~ 269mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, OFDM, QPSK

Socket Adapter Systems

N/A

-

Metal

活跃

Copper Alloy

Gold

Panel Mount, Through Hole

49-LFLGA Module

Flange

不锈钢

Glenair

零售包装

-65°C ~ 175°C

806

Solder

Plug, Male Pins

Silver

Threaded

2.3V ~ 3.6V

D

2.402GHz ~ 2.48GHz

Passivated

19-1

256kB Flash, 128kB ROM, 128kB RAM

1Mbps

-

Bluetooth v4.2

3.5dBm

Bluetooth

Antenna Not Included, Wire Antenna

-91.9dBm

ADC, GPIO, I²C, PWM, SPI, UART

5.26mA

3.71mA ~ 5.69mA

GFSK

Ground

N/A

-

Bulk

Obsolete

Gold

Cable, Free Hanging

微芯片技术

Compliant

Bulk

-

Crimp

Plug

26

200 °C

-65 °C

Male

Threaded

Straight

26

Pin

化学镍

Shielded

31.34 mm

无

抗环境干扰

N/A

-

800V

--

32A

u.FL

802.11 b/g/n

+ 85 C

3.6 V

- 40 C

50

2.7 V

265 mA

I2C, SPI, UART

61 mA

Microchip

Microchip Technology / Atmel

WEP, WPA, WPA2

802.11 b/g/n

Tray

活跃

21.7 mm x 14.7 mm x 2.1 mm

WiFi Modules - 802.11

表面贴装

28-SMD Module

Polyamide (PA66), Nylon 6/6

微芯片技术

--

-40°C ~ 85°C

Tray

ATG

活跃

--

Ground, Earth

2

Green, Yellow

Wireless & RF Modules

3V ~ 4.2V

2.4 GHz

Screw

8MB Flash, 128kB RAM

1

18.5 dBm

72.2 Mb/s

10-22 AWG

--

-

0.5-4mm²

802.11b/g/n

9mm

18.5dBm

WiFi

Antenna Not Included, U.FL

-95dBm

I²C, SPI, UART

61mA

264mA ~ 269mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, OFDM, QPSK

--

--

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK

WiFi模块

6.0mm

--

N/A

-

最后一次购买

79lm (61lm ~ 97lm)

表面贴装

1108 (2720 Metric)

1108

OSRAM Opto (ams OSRAM)

Tape & Reel (TR)

-40°C ~ 85°C

SYNIOS® P2720

0.108 L x 0.079 W (2.75mm x 2.00mm)

Red

2.8V ~ 3.6V

2.4GHz

-

2.225V

120°

350mA

54Mbps

101 lm/W

-

500mA

802.11b/g

618nm (612nm ~ 624nm)

18dBm

WiFi

Integrated, Trace

-95dBm

SPI

156mA

226mA ~ 237mA

DSSS, OFDM

0.028 (0.70mm)

N/A

-

Production (Last Updated: 2 years ago)

+ 70 C

3.6 V

- 20 C

490

1.9 V

SMD/SMT

10 mA

I2C, SPI, UART

10 mA

Microchip

微芯片技术

SRAM

24 kB

Non-Compliant

Tray

活跃

HVQCCN, LCC48,.24SQ,16

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

UNSPECIFIED

LCC48,.24SQ,16

-20 °C

3 V

70 °C

IS1870SF-102-TRAY

HVQCCN

SQUARE

活跃

MICROCHIP TECHNOLOGY INC

5.05

Automotive grade

RF System on a Chip - SoC

表面贴装

QFN-48

YES

48

微芯片技术

31 I/O

-40°C ~ 85°C

Tray

IS1870

Bluetooth

Wireless & RF Integrated Circuits

Si

1.9V ~ 3.6V

QUAD

无铅

1

0.4 mm

compliant

2.402GHz ~ 2.48GHz

S-XQCC-N48

2.4 GHz

COMMERCIAL

256kB Flash, 32kB ROM, 24kB SRAM

Flash, ROM

256 kB, 32 kB

0 dBm

921.6kbps

8 bit

0.9 mm

8051

Bluetooth v4.2

TS 16949

电信电路

0dBm

Bluetooth

PCB Trace

- 90 dBm

16 Channel

ADC, I²C, PWM, SPI, UART

13mA

13mA

-

RF System on a Chip - SoC

0.9 mm

6 mm

6 mm

N/A

-

Tray

活跃

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

151

0°C ~ 85°C (TJ)

APEX-20KE®

Obsolete

1.71 V ~ 1.89 V

2.4GHz

EP20K100

1MB Flash, 256kB SRAM

54Mbps

WFI32E01

4160

802.11b/g/n

53248

263000

416

20.5dBm

WiFi

PCB Trace

-99dBm

I²C, JTAG, SPI, UART, USB

216mA

340mA ~ 414mA

-

N/A

-

RN42

最后一次购买

表面贴装

35-SMD Module

微芯片技术

Bulk

-40°C ~ 85°C

RN42

3V ~ 3.6V

2.4GHz

-

3Mbps

-

Bluetooth v2.1 + EDR, Class 2

4dBm

Bluetooth

PCB Trace

-86dBm

SPI, UART

-

-

-

N/A

-

Obsolete

表面贴装

45-PowerFLGA Module

微芯片技术

Tray

-40°C ~ 85°C

-

2.1V ~ 3.3V

2.4GHz

-

-

-

-

-

WiFi

不包括天线

-

I²S, SPI, UART

-

-

-

N/A

-

Royalohm

Royalohm

5000

Reel

General Purpose Thick Film

Royalohm

N/A

-

RN42

Obsolete

表面贴装

35-SMD Module

微芯片技术

Bulk

-40°C ~ 85°C

RN42

3V ~ 3.6V

2.4GHz

-

3Mbps

-

Bluetooth v2.1 + EDR, Class 2

4dBm

Bluetooth

PCB Trace

-86dBm

SPI, UART

-

-

-

N/A

-

Tray

Obsolete

表面贴装

35-SMD Module

微芯片技术

Non-Compliant

-40°C ~ 85°C

Bulk

RN41

5 %

Axial

350 ppm/°C

3 kΩ

235 °C

-55 °C

3 W

3V ~ 3.6V

2.402GHz ~ 2.48GHz

-

3Mbps

-

Bluetooth v2.1 +EDR, Class 1

18.4dBm

Bluetooth

Integrated, Chip

-80dBm

SPI, UART, USB

35mA

65mA

FHSS, GFSK

N/A

-

Tray

Obsolete

表面贴装

35-SMD Module

微芯片技术

Non-Compliant

-40°C ~ 85°C

RN41

0.01 %

2

2 ppm/°C

9.2 kΩ

150 °C

-55 °C

金属箔

200 mW

3V ~ 3.6V

2.402GHz ~ 2.48GHz

-

3Mbps

-

Bluetooth v2.1 +EDR, Class 1

18.4dBm

Bluetooth

Integrated, Chip

-80dBm

SPI, UART, USB

35mA

65mA

FHSS, GFSK

Moisture Resistant

635 µm

3.81 mm

1.5748 mm

N/A

-

Obsolete

表面贴装

36-SMD Module

微芯片技术

Tape & Reel (TR)

-40°C ~ 85°C

-

2.8V ~ 3.6V

2.4GHz

-

54Mbps

-

802.11b/g

18dBm

WiFi

Integrated, Trace

-95dBm

SPI

156mA

226mA ~ 237mA

DSSS, OFDM

N/A

-

Tape & Reel (TR)

Obsolete

,

微电子组件

UNSPECIFIED

-40 °C

3.3 V

85 °C

MRF24WG0MAR-I/RM110

RECTANGULAR

Microchip Technology Inc

不推荐

MICROCHIP TECHNOLOGY INC

5.07

Automotive grade

表面贴装

36-SMD Module

NO

36

微芯片技术

Non-Compliant

-40°C ~ 85°C (TA)

-

25 %

SMD/SMT

125 °C

-55 °C

2.8V ~ 3.6V

DUAL

无铅

1

compliant

2.4GHz

R-XDMA-N36

INDUSTRIAL

-

15 mΩ

30 Ω

6 A

54Mbps

2.7 mm

-

802.11b/g

TS 16949

电信电路

18dBm

WiFi

Integrated, Trace

-95dBm

SPI

156mA

226mA ~ 237mA

DSSS, OFDM

900 µm

2 mm

1.25 mm

N/A

-

Obsolete

表面贴装

45-PowerFLGA Module

微芯片技术

Tray

-20°C ~ 70°C

-

2.1V ~ 3.3V

2.4GHz

-

-

-

-

-

WiFi

不包括天线

-

I²C, I²S, SPI, UART

-

-

-

N/A

-

Obsolete

表面贴装

36-SMD Module

微芯片技术

Tape & Reel (TR)

-40°C ~ 85°C

-

2.8V ~ 3.6V

2.4GHz

-

54Mbps

-

802.11b/g

18dBm

WiFi

Integrated, Trace

-95dBm

SPI

156mA

226mA ~ 237mA

DSSS, OFDM