制造商是'Microchip'
Microchip 射频收发器模块
(383)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 深度 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源 | 通道数量 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 电源电流 | 内存大小 | uPs/uCs/外围ICs类型 | 数据率 | 数据总线宽度 | 带宽 | 议定书 | 最高频率 | 筛选水平 | 通信IC类型 | 功率 - 输出 | 无线电频率系列/标准 | 天线类型 | 敏感度 | ADC通道数量 | 串行接口 | 接收电流 | 传输电流 | 最大结点温度（Tj） | 调制 | 灵敏度(dBm) | 通用输入输出数量 | 环境温度范围高 | 固件版本 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | BM78SPPS5MC2-0002AA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | Module | BM78SPPS5MC2-0002AA | -20°C~70°C | Tray | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 3.3V | UNSPECIFIED | 无铅 | 1 | 1.9V | 2.4GHz | BM78 | X-XXMA-N | 4MB Flash 320kB ROM 28kB SRAM | 32 kbps | Bluetooth v4.2 | 电信电路 | 10dBm | Bluetooth | Integrated, Chip | UART | 37mA | 43mA | -92 dBm | 7 | 70°C | 1.2 | 2.46mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | RN4020-V/RMBEC133 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | YES | Automotive grade | -30°C~85°C | Tray | 活跃 | 3 (168 Hours) | 24 | 1.8V~3.6V | UNSPECIFIED | 无铅 | 1 | 3.3V | 2.4GHz | RN4020 | R-XXMA-N24 | I2C, SPI, UART | 16mA | 64kB Flash | 1Mbps | Bluetooth v4.1 | TS 16949 | 电信电路 | 7.5dBm | Bluetooth | Integrated, Trace | -92.5dBm | 3 | AIO, PIO, SPI, UART | GFSK | 10 | 1.3.3 | 2.5mm | 19.5mm | 11.5mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | RN4020-V/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 24 | -30°C~85°C | Tray | 2014 | 活跃 | 1 (Unlimited) | 24 | 8542.39.00.01 | 1.8V~3.6V | UNSPECIFIED | 1 | 3.3V | 1.2mm | 2.4GHz | RN4020 | SPI, UART | 64kB Flash | 1Mbps | Bluetooth v4.1 | 电信电路 | 7.5dBm | Bluetooth | Integrated, Trace | AIO, PIO, SPI, UART | 16mA | GFSK | -92.5 dBm | 1.10.09 | 2.38mm | 19.5mm | 11.5mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
 | RN42HID-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 35 | Automotive grade | -40°C~85°C | Tray | 2010 | 活跃 | 3 (168 Hours) | 32 | 3V~3.6V | UNSPECIFIED | 1 | 3.3V | 2.4GHz | RN42 | R-XXMA-N32 | SPI, UART, USB | 300kbps | Bluetooth v2.1 +EDR, Class 2 | TS 16949 | 电信电路 | 4dBm | Bluetooth | Integrated, Trace | UART | 45mA | 30mA | -80 dBm | HID/6.11 | 2mm | 25.8mm | 13.4mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
 | RN42XVP-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 通孔 | 20-DIP Module | NO | 20 | -40°C~85°C | Bulk | 2009 | 活跃 | 3 (168 Hours) | 20 | 8542.39.00.01 | 3V~3.6V | DUAL | 1 | 3.3V | 2.4GHz | RN42XV | 3.3V | 300kbps | 78MHz | Bluetooth v2.1 + EDR, Class 2 | 电信电路 | 4dBm | Bluetooth | Integrated, Trace | -86dBm | 10 | UART | 35mA | 65mA | FHSS, GFSK | -80 dBm | 6.3 | 2mm | 24.4mm | 29.9mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | MRF24WB0MA/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | Module | 36 | -40°C~85°C | Tray | 2008 | e3 | yes | Obsolete | 1 (Unlimited) | 36 | Matte Tin (Sn) | 8542.39.00.01 | 2.7V~3.6V | UPPER | 1 | 3.3V | 21mm | 2.4GHz | MRF24WB0M | 3.3V | SPI | 154mA | 2Mbps | 802.11b | 电信电路 | 10dBm | WiFi | Integrated, Trace | JTAG, SPI | 85mA | 115mA~154mA | DSSS | -91 dBm | A0C | 2.7mm | 31mm | 21mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
 | RN171-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 表面贴装 | Module | 49 | Industrial grade | -40°C~85°C | Tray | 2004 | e3 | 活跃 | 3 (168 Hours) | 49 | Matte Tin (Sn) | 8542.39.00.01 | 3V~3.7V | QUAD | 245 | 1 | 3.3V | 17.78mm | 2.4GHz | 40 | RN171 | 3.3V | SPI, UART | 2MB ROM 128kB RAM | 54Mbps | 802.11b/g | LAN 交换电路 | 12dBm | WiFi | 不包括天线 | SDIO, SPI, UART | 40mA | 120mA~190mA | CCK, DBPSK, DQPSK, DSSS, OFDM | -83 dBm | 4.41 | 3.1mm | 27mm | 18mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||
 | RN4020-V/RM123 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 24 | -30°C~85°C | Tray | 2017 | yes | 活跃 | 1 (Unlimited) | 24 | 1.8V~3.6V | UNSPECIFIED | 无铅 | 未说明 | 1 | 3.3V | 2.4GHz | 未说明 | RN4020 | UART | 12mA | 64kB Flash | 1Mbps | Bluetooth v4.1 | 电信电路 | 7.5dBm | Bluetooth | Integrated, Trace | 1 | AIO, PIO, SPI, UART | 16mA | GFSK | -92.5 dBm | 8 | 1.23 | 2.38mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | MRF24J40MAT-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 12 | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 2008 | 活跃 | 3 (168 Hours) | 12 | 2.4V~3.6V | 3.3V | 17.78mm | 2.4GHz | MRF24J40M | 不合格 | 3.3V | 23mA | 250kbps | Zigbee® | 0dBm | 802.15.4 | Integrated, Trace | SPI | 19mA | -94 dBm | 27.9mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | ATWILC1000-MR110PB | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | 28-SMD Module, Exposed Pad | 40 | Industrial grade | -40°C~85°C | Tray | 2015 | yes | 活跃 | 3 (168 Hours) | 28 | 3.3V~4.3V | UNSPECIFIED | 无铅 | 1 | 3.6V | 2.4GHz | ATWILC1000 | R-XXMA-N28 | I2C, SPI, UART | 22mA | 72.2Mbps | 802.11b/g/n | 电信电路 | 19dBm | WiFi | Integrated, Trace | I2C, SDIO, SPI, UART | 29mA~68mA | 29mA~230mA | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | -98 dBm | 5 | 2.113mm | 21.72mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
 | RN4871-V/RM118 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | 表面贴装 | 16-SMD Module | -20°C~70°C | Tray | 2017 | 活跃 | 1 (Unlimited) | 1.9V~3.6V | 2.4GHz | RN4871 | I2C, UART | 10 kbps | Bluetooth v5.0 | 电信电路 | 0dBm | Bluetooth | Integrated, Chip | -90dBm | UART | 13mA | GFSK | 9 | 1.1.8 | 2.1mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | RN131G-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 44 | -30°C~85°C | Tray | 2012 | 活跃 | 1 (Unlimited) | 44 | UNSPECIFIED | 1 | 3.3V | 2mm | 20mm | 2.4GHz | RN131 | 3.3V | 14 | SPI, UART | 8MB Flash 2MB ROM 128kB RAM | 54Mbps | 802.11b/g | LAN 交换电路 | 18dBm | WiFi | Integrated, Chip + U.FL | -85dBm | SPI, UART | 40mA | 140mA | CDK, DBPSK, DQPSK, DSSS, OFDM | -85 dBm | 4 | 3.5mm | 37mm | 20mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
 | RN4678-V/RM100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 表面贴装 | Module | YES | Automotive grade | -20°C~70°C | Tray | 2018 | 活跃 | 1 (Unlimited) | 33 | 8542.39.00.01 | 3.3V~4.2V | UNSPECIFIED | 无铅 | 1 | 1.9V | 2.4GHz | RN4678 | R-XXMA-N33 | 4MB Flash 320kB ROM 28kB SRAM | 1Mbps | Bluetooth v5.0 | TS 16949 | 电信电路 | 1.5dBm | Bluetooth | Integrated, Chip | -92dBm | UART | 37mA | 43mA | 70°C | 1.0.0 | 2.4mm | 22mm | 12mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | RN42-I/RM630 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | Automotive grade | -40°C~85°C | Tray | 2010 | yes | 活跃 | 3 (168 Hours) | 32 | 3V~3.6V | UNSPECIFIED | 无铅 | 1 | 3.3V | 2.4GHz | RN42 | SPI, UART, USB | 3Mbps | Bluetooth v2.1 + EDR | TS 16949 | 电信电路 | 4dBm | Bluetooth | Integrated, Trace | 2 | SPI, UART, USB | 40mA | 45mA | -80 dBm | 10 | 6.3 | 2.5mm | 13.4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | ATWILC3000-MR110CA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 48 | ATWILC3000-MR110CA | Industrial grade | -40°C~85°C | Tray | 2016 | yes | 活跃 | 3 (168 Hours) | 36 | SEATED HGT-CALCULATED | 3.3V | UNSPECIFIED | 无铅 | 250 | 3.6V | 2.4GHz | 未说明 | ATWILC3000 | R-XXMA-N36 | 3.6V | 1 | I2C, SPI, UART | 微处理器电路 | 65Mbps | 802.11b/g/n, Bluetooth v4.0 | 19dBm | Bluetooth, WiFi | Integrated, Chip | I2C, SPI, UART | 68mA | 230mA | 125°C | -98 dBm | 10 | 150°C | 2.087mm | 22.428mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
 | RN131C/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 44 | Commercial grade | 0°C~70°C | Tray | 2012 | e4 | 活跃 | 1 (Unlimited) | 44 | 5A002.A.1 | 镍镀金 | 8529.90.22.00 | UNSPECIFIED | 1 | 3.3V | 2mm | 20mm | 2.4GHz | RN131 | 3.3V | SPI, UART | 8MB Flash 2MB ROM 128kB RAM | 54Mbps | 802.11b/g | LAN 交换电路 | 18dBm | WiFi | Integrated, Chip + U.FL | -85dBm | SPI, UART | 40mA | 210mA | CDK, DBPSK, DQPSK, DSSS, OFDM | -85 dBm | 4 | 3.5mm | 37mm | 20mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||
 | ATWINC3400-MR210CA122 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 表面贴装 | Module | YES | Automotive grade | -40°C~85°C | Tray | 活跃 | 3 (168 Hours) | 37 | 8542.31.00.01 | 2.5V~4.2V | UNSPECIFIED | 无铅 | 260 | 3.6V | 1.204mm | 2.4GHz | 30 | ATWINC3400 | R-XXMA-N37 | I2C, SPI, UART | 微处理器电路 | 54Mbps | 60MHz | 802.11b/g/n | TS 16949 | 18.3dBm | WiFi | Integrated, Chip | -92.5dBm | I2C, SPI, UART | 64mA | 265mA | 125°C | 21 | 1.2.2 | 2.087mm | 22.428mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | MRF24WG0MB-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 36-SMD Module | 36 | -40°C~85°C | Tray | 2011 | e3 | 活跃 | 1 (Unlimited) | 36 | 哑光锡 | 8542.39.00.01 | 2.8V~3.6V | DUAL | 1 | 3.3V | 1.27mm | 21mm | 2.4GHz | MRF24WG0M | 3.3V | 11 | 54Mbps | 802.11b/g | 电信电路 | 18dBm | WiFi | Antenna Not Included, U.FL | SPI | 156mA | 226mA~237mA | DSSS, OFDM | -95 dBm | 310C | 2.7mm | 31mm | 21mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
 | ATWINC1500-MR210PB | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 40 | Industrial grade | -40°C~85°C | Tray | 2015 | yes | 活跃 | 3 (168 Hours) | 28 | SEATED HGT-NOM | 2.7V~3.6V | UNSPECIFIED | 无铅 | 3.6V | 2.4GHz | ATWINC1500 | R-XXMA-N28 | 3.6V | 1 | I2C, SPI, UART | 4MB Flash 128kB RAM | 微处理器电路 | 72.2Mbps | 802.11b/g/n | 18.5dBm | WiFi | Integrated, Trace | -95dBm | I2C, SPI, UART | 61mA | 265mA | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | -98 dBm | 19.4.4 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
| RN4020-V/RM120 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | RN4020-V/RM120 | -30°C~85°C | Tray | 2014 | 活跃 | 1 (Unlimited) | 85°C | -30°C | 1.8V~3.6V | 2.4GHz | RN4020 | SPI, UART | 3.6V | 1.8V | 12mA | 64kB Flash | 1Mbps | Bluetooth v4.1 | 2.48GHz | 7.5dBm | Bluetooth | Integrated, Trace | -92.5dBm | 3 | AIO, PIO, SPI, UART | 16mA | 16mA | GFSK | -92.5 dBm | 10 | 1.2 | 2.3mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
 | ATWINC1500-MR210PA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 8 | 64kB | 表面贴装 | 表面贴装 | 28-SMD Module | 117.310327mg | FLASH | -40°C~85°C | Tray | 2015 | yes | Discontinued | 3 (168 Hours) | 28 | SEATED HGT-NOM | 2.7V~3.6V | UNSPECIFIED | 无铅 | 3.3V | 1.016mm | 2.4GHz | ATWINC1500 | I2C, SDIO, SPI, UART | 4MB Flash 128kB ROM 64kB RAM | 微处理器电路 | 72.2Mbps | 32b | 802.11b/g/n | 19dBm | WiFi | Integrated, Trace | I2C, SPI, UART | 29mA~68mA | 29mA~230mA | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | -98 dBm | 19.4.4 | 900μm | 5mm | 5mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
 | BM78SPPS5NC2-0002AA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | Module | YES | Commercial grade | -20°C~70°C | Bulk | 活跃 | 1 (Unlimited) | 8542.39.00.01 | 3.3V~4.2V | UNSPECIFIED | 无铅 | 1 | 1.9V | 2.4GHz | BM78 | X-XXMA-N | I2C, UART | 1.5Gbps | Bluetooth v4.2 | 电信电路 | 1.5dBm | Bluetooth | Integrated, Chip | -92dBm | UART | 37mA | 43mA | 7 | 70°C | 2.2mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | MRF24J40MD-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | Industrial grade | -40°C~85°C | Tray | 2015 | e3 | 活跃 | 1 (Unlimited) | 12 | 哑光锡 | 8542.39.00.01 | 3V~3.6V | DUAL | 无铅 | 未说明 | 1 | 3.3V | 2.4GHz | 未说明 | MRF24J40M | R-XDMA-N12 | 10μA | 250kbps | 75MHz | Zigbee® | 电信电路 | 19dBm | 802.15.4 | Integrated, Trace | SPI | 32mA | 140mA | -104 dBm | 85°C | 2.54mm | 33.02mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
 | RN4871U-V/RM118 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 17-SMD Module | Commercial grade | -20°C~70°C | Tray | 2017 | 活跃 | 1 (Unlimited) | 8542.39.00.01 | 1.9V~3.6V | 2.4GHz | RN4871 | 10 kbps | Bluetooth v5.0 | 电信电路 | 0dBm | Bluetooth | 不包括天线 | -90dBm | UART | 13mA | GFSK | 1.1.8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MRF89XAM8A-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tin | 表面贴装 | 表面贴装 | Module | 12 | Industrial grade | -40°C~85°C | Tray | 2001 | e3 | 活跃 | 1 (Unlimited) | 12 | EAR99 | 8542.39.00.01 | 2.1V~3.6V | DUAL | UNSPECIFIED | 1 | 3.3V | 2.54mm | 17.78mm | 868MHz | MRF89XAM8A | 12 | 3.3V | 59 | 1.3mA | 40kbps | 7MHz | 以太网收发器 | 12.5dBm | General ISM < 1GHz | Integrated, Trace | SPI | 3mA | 16mA~25mA | FSK, OOK | -113 dBm | 85°C | 1.905mm | 27.94mm | 17.78mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 |