制造商是'Microchip'
Microchip 射频收发器 IC
(307)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 深度 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源 | 通道数量 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 电源电流 | 速度 | 内存大小 | 最大电源电流 | 位元大小 | 访问时间 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 带宽 | 定时器/计数器的数量 | 议定书 | 增益 | 核心架构 | 片上程序 ROM 宽度 | 处理器系列 | 最高频率 | 低功率模式 | 可编程I/O数 | 格式 | 功率 - 输出 | 集成缓存 | 无线电频率系列/标准 | 内存(字) | 敏感度 | 数据率（最大） | 串行接口 | 接收电流 | 传输电流 | 串行I/O数 | 接收器数 | 定时器数量 | 调制 | P1dB | 外部中断数量 | 灵敏度(dBm) | 片上数据 RAM 宽度 | 通用输入输出数量 | [医]GPIO | DMA通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||
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 | ATMEGA1284RZAP-AU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 44-QFN, 32-QFN | -40°C~85°C | Tray | 2015 | 活跃 | 3 (168 Hours) | TxRx + MCU | 85°C | -40°C | 1.8V~3.6V | 2.4GHz | ATMEGA1284 | I2C, SPI | 128kB Flash 4kB EEPROM 16kB SRAM | 8b | 6LoWPAN, Zigbee® | 3dBm | 802.15.4 | -101dBm | 250kbps | I2C, JTAG, SPI, USART | 15.5mA | 9.5mA~16.5mA | O-QPSK | -101 dBm | 32 | 32 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATMEGA128RFR2-ZFR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 38 | 有 | 16kB | Tin | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | FLASH | -40°C~125°C | Tape & Reel (TR) | 2012 | yes | 活跃 | 3 (168 Hours) | 64 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 3V | 0.5mm | ATMEGA128RFR2 | 不合格 | 2/3.3V | 2-Wire, I2C, SPI, USART | 128kB Flash 4kB EEPROM 16kB SRAM | 8 | YES | NO | 8b | YES | 2.4 GHz | 6 | Zigbee® | AVR | 38 | 3.5dBm | 802.15.4 | 2Mbps | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | DSSS, O-QPSK | -100 dBm | 35 | 9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMR21E18A-MFTA7 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | 32 | 16 | -40°C~125°C | Tape & Reel (TR) | 2016 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 3.3V | 0.5mm | 2.4GHz | ATSAMR21E | I2C, SPI, UART, USART, USB | 48 MHz | 256kB Flash 32kB SRAM | 32 | YES | YES | YES | 8 | 4dBm | General ISM > 1GHZ | 250kbps | I2C, SPI, UART, USART, USB | 11.3mA~11.8mA | 7.2mA~13.8mA | O-QPSK | -99 dBm | 16 | 1mm | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMR21E17A-MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 16 | 有 | 16kB | Tin | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | FLASH | -40°C~125°C | Tray | 2014 | SMART™ SAM R21 | e3 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 0.5mm | 2.4GHz | ATSAMR21E | I2C, SPI, UART, USART, USB | 48 MHz | 128kB Flash 16kB SRAM | 32 | YES | YES | 32b | YES | NO | 3 | ARM | 8 | CORTEX-M0 | YES | 16 | 固定点 | 4dBm | YES | 802.15.4, General ISM > 1GHz | 250kbps | I2C, SPI, UART, USART, USB | 11.3mA~11.8mA | 7.2mA~13.8mA | 4 | O-QPSK | 14 | -99 dBm | 8 | 12 | 1mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMB11G18A-MU-Y | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | YES | Industrial grade | -40°C~85°C | Tray | 2008 | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 2.3V~4.3V | QUAD | 无铅 | 未说明 | 1 | 3V | 0.4mm | 2.4GHz | 未说明 | ATSAMB11 | S-XQCC-N48 | I2C, SPI, UART | 256kB Flash 128kB ROM 128kB RAM | Bluetooth v4.1 | 3.5dBm | Bluetooth | I2C, SPI, UART | 4.2mA | 3mA~4mA | -96 dBm | 30 | 1mm | 6mm | 6mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATMEGA1284RFR2-ZF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 33 | 有 | 16kB | Tin | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | FLASH | -40°C~125°C | Tray | 2014 | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 3V | 0.5mm | 2.4GHz | ATMEGA1284RFR2 | S-XQCC-N48 | 不合格 | 2/3.3V | 2-Wire, I2C, SPI, USART | 128kB Flash 4kB EEPROM 16kB SRAM | 8 | YES | NO | 8b | YES | NO | 6 | Zigbee® | AVR | 3.5dBm | 802.15.4 | 2Mbps | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | O-QPSK | -100 dBm | 33 | 32 | 0.9mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATWILC1000A-MU-Y | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 40-VFQFN Exposed Pad | -40°C~85°C | Tray | 2014 | 活跃 | 3 (168 Hours) | TxRx + MCU | 85°C | -40°C | 1.62V~3.6V | 2.4GHz | ATWILC1000 | 1.3V | 1 | I2C, SDIO, SPI, UART | 128kB ROM 192kB RAM | 802.11b/g/n | 48MHz | 20.6dBm | WiFi | -98dBm | 72.2Mbps | I2C, SDIO, SPI, UART | 68mA | 230mA | CCK, DSSS, OFDM | -98 dBm | 9 | 9 | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATWINC3400A-MU-Y | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | 48-QFN (6x6) | -40°C~85°C | Tray | 2015 | 活跃 | 3 (168 Hours) | TxRx + MCU | 85°C | -40°C | 2.7V~3.6V | 2.4GHz | ATWINC3400 | I2C, SDIO, SPI, UART | 256kB ROM 708kB RAM | 802.11b/g/n, Bluetooth v4.0 | 20dBm | Bluetooth, WiFi | -98dBm | 72.2Mbps | I2C, SDIO, SPI, UART | 83.7mA~91.8mA | 276mA~325mA | 8PSK, GFSK, QPSK | -98 dBm | 18 | 18 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATSAMR21G17A-MFT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 28 | 有 | 16kB | Tin | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | FLASH | -40°C~125°C | Tape & Reel (TR) | 2015 | SMART™ SAM R21 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 0.5mm | 2.4GHz | ATSAMR21G | S-XQCC-N48 | I2C, SPI, UART, USART, USB | 48 MHz | 128kB Flash 16kB SRAM | 32 | YES | YES | 32b | YES | NO | 3 | ARM | 8 | CORTEX-M0 | YES | 28 | 固定点 | 4dBm | YES | General ISM > 1GHZ | 16000 | 250kbps | I2C, SPI, UART, USART, USB | 11.3mA~11.8mA | 7.2mA~13.8mA | 5 | O-QPSK | 15 | -99 dBm | 8 | 12 | 1mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| ATA5830N-PNQW | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-VFQFN Exposed Pad | 32-VQFN (5x5) | -40°C~105°C | Tape & Reel (TR) | 1997 | Obsolete | 2 (1 Year) | TxRx + MCU | 105°C | -40°C | 1.9V~3.6V | 315MHz 434MHz 868MHz 915MHz | SPI | 5.5V | 4.5V | 6kB Flash 512B EEPROM 24kB ROM 768B SRAM | 14.5dBm | General ISM < 1GHz | -121dBm | 80kbps | SPI | 9.3mA | 9.1mA~13.8mA | ASK, FSK | -121 dBm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATWINC1500A-MU-Y | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 40-VFQFN Exposed Pad | YES | -40°C~85°C | Tray | 2014 | yes | 活跃 | 3 (168 Hours) | 40 | TxRx + MCU | 2.7V~3.6V | QUAD | 3.3V | 0.4mm | 2.4GHz | ATWINC1500 | S-XQCC-N40 | 1.3V | 1 | I2C, SDIO, SPI, UART | 4MB Flash 128kB ROM 192kB RAM | 802.11b/g/n | 20.6dBm | WiFi | 72.2Mbps | I2C, SDIO, SPI, UART | 29mA~68mA | 29mA~230mA | CCK, DSSS, OFDM | -98 dBm | 8 | 0.9mm | 5mm | 5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATSAMR21G16A-MUT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 28 | 有 | 8kB | Tin | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | FLASH | -40°C~85°C | Tape & Reel (TR) | 2015 | SMART™ SAM R21 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 0.5mm | 2.4GHz | ATSAMR21G | S-XQCC-N48 | I2C, SPI, UART, USART, USB | 48 MHz | 64kB Flash 8kB SRAM | 32 | YES | YES | 32b | YES | NO | 3 | ARM | 8 | CORTEX-M0 | YES | 28 | 固定点 | 4dBm | YES | General ISM > 1GHZ | 8000 | 250kbps | I2C, SPI, UART, USART, USB | 11.3mA~11.8mA | 7.2mA~13.8mA | 5 | O-QPSK | 15 | -99 dBm | 8 | 12 | 1mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| ATMEGA64RFR2-ZFR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 38 | 有 | 8kB | Tin | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | FLASH | -40°C~125°C | Tape & Reel (TR) | 2014 | yes | 活跃 | 3 (168 Hours) | 64 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 3V | 0.5mm | 2.4GHz | ATMEGA64RFR2 | 不合格 | 2/3.3V | 2-Wire, I2C, SPI, USART | 64kB Flash 2kB EEPROM 8kB SRAM | 8 | YES | NO | 8b | YES | 6 | Zigbee® | AVR | 38 | 3.5dBm | 802.15.4 | 2Mbps | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | DSSS, O-QPSK | -100 dBm | 35 | 9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATA5429-PLSW | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | 48 | 48-VQFN (7x7) | -40°C~85°C | Tube | 1997 | Obsolete | 3 (168 Hours) | 仅TxRx | 85°C | -40°C | 2.4V~3.6V | 7mm | 915MHz | 5V | SPI | 5.25V | 2.4V | 10.5mA | 917.5MHz | 10dBm | General ISM < 1GHz | -116.5dBm | 20kBaud | SPI | 10.3mA~10.5mA | 6.5mA~17.3mA | ASK, FSK | -116.5 dBm | 7mm | 7mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATMEGA256RFR2-ZF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 38 | 131072 | 有 | 32kB | Tin | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | 206.29948mg | FLASH | -40°C~125°C | Tray | 2004 | yes | 活跃 | 3 (168 Hours) | 64 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 3V | 0.5mm | 2.4GHz | ATMEGA256RFR2 | 不合格 | 2/3.3V | I2C, SPI, UART, USART | 256kB Flash 8kB EEPROM 32kB SRAM | 8 | YES | NO | 8b | YES | 6 | Zigbee® | AVR | 38 | 3.5dBm | 802.15.4 | 2Mbps | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | DSSS, O-QPSK | -100 dBm | 35 | 9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MICRF507YML-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 32-VFQFN Exposed Pad, 32-MLF® | 32 | 32-MLF (5x5) | -40°C~85°C | Tape & Reel (TR) | 2006 | 活跃 | 3 (168 Hours) | 仅TxRx | 85°C | -40°C | 2V~2.5V | 5mm | 470MHz~510MHz | SPI | 2.5V | 2V | 12mA | 23 dB | 10dBm | General ISM < 1GHz | -113dBm | 200kbps | SPI | 8mA~12mA | 8mA~21.5mA | FSK | 10 dBm | -113 dBm | 5mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATMEGA1284PR212-AU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16kB | 表面贴装 | 44-TQFP | 44-TQFP (10x10) | FLASH | -40°C~85°C | Tray | 2010 | 活跃 | 3 (168 Hours) | TxRx + MCU | 85°C | -40°C | 1.8V~3.6V | 769MHz~935MHz | ATMEGA1284P | I2C, SPI | 128kB Flash 4kB EEPROM 16kB SRAM | 8b | 6LoWPAN, Zigbee® | AVR | 10dBm | 802.15.4, General ISM < 1GHz | -110dBm | 1Mbps | SPI | 8.7mA~9.2mA | 13mA~25mA | DSSS, BPSK, O-QPSK | -110 dBm | 32 | 32 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | U3600BM-NFNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-BSOP (0.295, 7.50mm Width) | 44 | 44-SSO | -25°C~75°C | Tube | 1997 | Obsolete | 1 (Unlimited) | 仅TxRx | 75°C | -25°C | 3.1V~5.2V | 20MHz~50MHz | Non-Standard | SPI | 8.5mA | 2.35mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATMEGA256RZBV-8AU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 8kB | 表面贴装 | 100-TQFP | 100 | 100-TQFP (14x14) | 657.000198mg | 86 | -40°C~85°C | Tray | 2009 | 活跃 | 3 (168 Hours) | TxRx + MCU | 85°C | -40°C | 1.8V~3.6V | 2.4GHz | 5.5V | SPI | 256kB Flash 4kB EEPROM 8kB SRAM | 8 μs | 8b | 6 | 6LoWPAN, Zigbee® | AVR | 8MHz | 3dBm | 802.15.4 | -101dBm | 250kbps | I2C, JTAG, SPI, USART | 15.5mA | 9.5mA~16.5mA | O-QPSK | -101 dBm | 86 | 86 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATMEGA64RFR2-ZF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 38 | 有 | 8kB | Tin | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | FLASH | -40°C~125°C | Tray | 2014 | yes | 活跃 | 3 (168 Hours) | 64 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 3V | 0.5mm | ATMEGA64RFR2 | 不合格 | 2/3.3V | 2-Wire, I2C, SPI, USART | 64kB Flash 2kB EEPROM 8kB SRAM | 8 | YES | NO | 8b | YES | 6 | Zigbee® | AVR | 38 | 3.5dBm | 802.15.4 | 2Mbps | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | DSSS, O-QPSK | -100 dBm | 35 | 9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATMEGA2560R231-AU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8kB | 表面贴装 | 100-TQFP | 100-TQFP (14x14) | FLASH | -40°C~85°C | Tube | 2015 | 活跃 | 3 (168 Hours) | TxRx + MCU | 85°C | -40°C | 1.8V~3.6V | 2.4GHz | ATMEGA2560 | I2C, SPI | 256kB Flash 4kB EEPROM 8kB RAM | 8b | 6LoWPAN, WirelessHART™, Zigbee® | AVR | 3dBm | 802.15.4, General ISM > 1GHz | -101dBm | 2Mbps | SPI | 10.3mA~12.3mA | 7.4mA~14mA | O-QPSK | -101 dBm | 86 | 86 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMR34J16BT-I/7JX | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 8192 | 16384 | 表面贴装 | 64-TFBGA | YES | 27 | -40°C~85°C | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 64 | TxRx + MCU | 1.8V~3.63V | BOTTOM | BALL | 3.3V | 0.65mm | 137MHz~175MHz 410MHz~525MHz 862MHz~1.02GHz | S-XBGA-B64 | 64kB Flash 8kB SRAM | 32 | YES | YES | LoRa™ | 32 | YES | 20dBm | YES | 802.15.4 | 2048 | -148dBm | I2S, SPI, USART, USB | 14.8mA~15.8mA | 32.5mA~94.5mA | 3 | FSK, GFSK, GMSK, MSK, OOK | 15 | 32 | 27 | 16 | 6mm | 6mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MRF89XA-I/MQ | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-WFQFN Exposed Pad | 32 | -40°C~85°C | Tray | 2010 | e3 | Obsolete | 3 (168 Hours) | EAR99 | 仅TxRx | Matte Tin (Sn) | 2.1V~3.6V | 863MHz~870MHz 902MHz~928MHz 950MHz~960MHz | MRF89XA | 32 | 25mA | 12.5dBm | General ISM < 1GHz | 200kbps | SPI | 3mA | 16mA~25mA | 1 | FSK, OOK | -113 dBm | 800μm | 5.1mm | 5.1mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATMEGA1284PR231-MU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16kB | 44-QFN, 32-QFN | FLASH | -40°C~85°C | Tray | 2007 | 活跃 | 3 (168 Hours) | TxRx + MCU | 85°C | -40°C | 1.8V~3.6V | 2.4GHz | ATMEGA1284P | I2C, SPI | 128kB Flash 4kB EEPROM 16kB SRAM | 8b | 6LoWPAN, WirelessHART™, Zigbee® | AVR | 3dBm | 802.15.4, General ISM > 1GHz | -101dBm | 2Mbps | SPI | 10.3mA~12.3mA | 7.4mA~14mA | O-QPSK | -101 dBm | 32 | 32 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATWINC1510B-MU-Y | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | 表面贴装 | 40-VFQFN Exposed Pad | YES | -40°C~85°C | Tray | 2015 | yes | 活跃 | 3 (168 Hours) | 40 | TxRx + MCU | 2.7V~3.6V | QUAD | 无铅 | 3.3V | 0.4mm | 2.4GHz | S-PQCC-N40 | I2C, SPI, UART | 8MB Flash 128kB ROM | 802.11b/g/n | 20.5dBm | WiFi | 72.2Mbps | I2C, SPI, UART | 70.1mA | 294mA | CCK, DSSS, OFDM | -89 dBm | 7 | 1mm | 5mm | 5mm | ROHS3 Compliant | 无铅 |