制造商是'Microchip'
Microchip 射频收发器 IC
(307)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 深度 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源 | 通道数量 | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 速度 | 内存大小 | 最大电源电流 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 带宽 | 定时器/计数器的数量 | 议定书 | 核心架构 | 片上程序 ROM 宽度 | 处理器系列 | 最高频率 | 低功率模式 | 可编程I/O数 | 格式 | 功率 - 输出 | 集成缓存 | 无线电频率系列/标准 | 内存(字) | UART 通道数 | 敏感度 | 数据率（最大） | ADC通道数量 | 串行接口 | 接收电流 | 传输电流 | 串行I/O数 | 接收器数 | 定时器数量 | 调制 | 外部中断数量 | 灵敏度(dBm) | 片上数据 RAM 宽度 | 通用输入输出数量 | 发射器数量 | [医]GPIO | DMA通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | ATSAMR21G18A-MFT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 28 | 262144 | 有 | 32kB | Tin | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | FLASH | -40°C~125°C | Tape & Reel (TR) | 2015 | SMART™ SAM R21 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 0.5mm | 2.4GHz | ATSAMR21G | I2C, SPI, UART, USART, USB | 256kB Flash 32kB SRAM | 32 | YES | YES | 32b | YES | NO | 3 | ARM | 8 | CORTEX-M0 | YES | 28 | 固定点 | 4dBm | YES | General ISM > 1GHZ | 250kbps | I2C, SPI, UART, USART, USB | 11.3mA~11.8mA | 7.2mA~13.8mA | 5 | O-QPSK | 15 | -99 dBm | 8 | 12 | 1mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | ATA8520D-GHQW | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 21 Weeks | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | -40°C~85°C | Tape & Reel (TR) | 2015 | e3 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | Matte Tin (Sn) | 1.9V~3.6V 2.4V~5.5V | QUAD | 无铅 | 1 | 3V | 0.5mm | 868MHz | ATA8520D | 5.5V | SIGFOX™ | 14dBm | General ISM < 1GHz | 600bps | SPI | 10.4mA | 31.8mA~32.7mA | DBSPK, GFSK | -121.5 dBm | 0.9mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATMEGA2564RFR2-ZFR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 38 | 有 | 32kB | Tin | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48-QFN (7x7) | FLASH | -40°C~125°C | Cut Tape (CT) | 2000 | 活跃 | 3 (168 Hours) | TxRx + MCU | 125°C | -40°C | 1.8V~3.6V | 2.4GHz | ATMEGA2564RFR2 | 2-Wire, I2C, SPI, USART | 3.6V | 1.8V | 256kB Flash 8kB EEPROM 32kB SRAM | 8b | 6 | Zigbee® | AVR | 16MHz | 38 | 3.5dBm | 802.15.4 | -100dBm | 2Mbps | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | O-QPSK | -100 dBm | 33 | 32 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATMEGA2564RFR2-ZF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 33 | 131072 | 有 | 32kB | Tin | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | FLASH | -40°C~125°C | Tray | 2013 | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.8V~3.6V | QUAD | 3V | 0.5mm | 2.4GHz | ATMEGA2564RFR2 | 2/3.3V | 2-Wire, I2C, SPI, USART | 256kB Flash 8kB EEPROM 32kB SRAM | 8 | YES | NO | 8b | YES | NO | 6 | Zigbee® | AVR | 3.5dBm | 802.15.4 | 2Mbps | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | O-QPSK | -100 dBm | 33 | 32 | 0.9mm | 7mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | MRF24J40T-I/ML | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 40-VFQFN Exposed Pad | 40 | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 3 (168 Hours) | 40 | TxRx + MCU | Matte Tin (Sn) | 2.4V~3.6V | QUAD | 260 | 1 | 3.3V | 0.5mm | 2.4GHz | 40 | MRF24J40 | 40 | 3.3V | 22mA | Zigbee®, MiWi® | 0dBm | 802.15.4 | 625kbps | SPI | 19mA | 23mA | 1 | O-QPSK | -95 dBm | 6 | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMR21E19A-MFT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | 32 | 16 | -40°C~125°C | Tape & Reel (TR) | 2014 | e3 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | Matte Tin (Sn) | 2.35V~3.6V | QUAD | 无铅 | 0.5mm | 2.4GHz | ATSAMR21E | I2C, SPI, UART, USART, USB | 48 MHz | 768kB Flash 32kB SRAM | 32 | YES | YES | YES | NO | 8 | CORTEX-M0 | YES | 固定点 | 4dBm | YES | General ISM > 1GHZ | 250kbps | I2C, SPI, UART, USART, USB | 11.3mA~11.8mA | 7.2mA~13.8mA | 4 | 6 | O-QPSK | 14 | -99 dBm | 8 | 16 | 12 | 1mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| ATA8510-GHQW | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 2011 | yes | 活跃 | 1 (Unlimited) | TxRx + MCU | 1.9V~3.6V | 315MHz 433MHz 868MHz 915MHz | ATA8510 | 3.6V | SPI, UART | 20kB Flash | 14.5dBm | General ISM < 1GHz | SPI | 10.5mA | 33.5mA | ASK, FSK | -125 dBm | 2 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATMEGA1284RFR2-ZUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | 33 | 有 | 16kB | Tin | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | FLASH | -40°C~85°C | Cut Tape (CT) | 2014 | yes | Discontinued | 3 (168 Hours) | 48 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 3V | 0.5mm | ATMEGA1284RFR2 | S-XQCC-N48 | 不合格 | 2/3.3V | 2-Wire, I2C, SPI, USART | 128kB Flash 4kB EEPROM 16kB SRAM | 8 | YES | NO | 8b | YES | NO | 2.4 GHz | 6 | Zigbee® | AVR | 3.5dBm | 802.15.4 | 2Mbps | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | O-QPSK | -100 dBm | 33 | 32 | 0.9mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | AT86RF212-ZU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | 32-QFN (5x5) | -40°C~85°C | Tray | 2009 | Obsolete | 3 (168 Hours) | TxRx + MCU | 85°C | -40°C | 1.8V~3.6V | 5mm | 769MHz~935MHz | 3V | 3V | SPI | 3.6V | 1.8V | 128B SRAM | 0 | 6LoWPAN, Zigbee® | 928.5MHz | 10dBm | 802.15.4, General ISM < 1GHz | 0 | -110dBm | 1Mbps | SPI | 8.7mA~9.2mA | 13mA~25mA | 1 | DSSS, BPSK, O-QPSK | -110 dBm | 1 | 1mm | 5mm | 5mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATWINC1500A-MU-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 40-VFQFN Exposed Pad | YES | 40 | -40°C~85°C | Tape & Reel (TR) | 2014 | yes | 活跃 | 3 (168 Hours) | 40 | TxRx + MCU | 2.7V~3.6V | QUAD | 无铅 | 3.3V | 0.4mm | 2.4GHz | ATWINC1500 | I2C, SDIO, SPI, UART | 4MB Flash 128kB ROM 192kB RAM | 802.11b/g/n | 20.6dBm | WiFi | 72.2Mbps | I2C, SDIO, SPI, UART | 29mA~68mA | 29mA~230mA | CCK, DSSS, OFDM | -98 dBm | 8 | 0.9mm | 5mm | 5mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATMEGA128RFA1-ZF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 38 | 有 | 16kB | Tin | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | FLASH | -40°C~125°C | Tray | 2012 | yes | 活跃 | 3 (168 Hours) | 64 | TxRx + MCU | IT ALSO OPERATES AT 3.3 V | 1.8V~3.6V | QUAD | 无铅 | 1.8V | 0.5mm | 2.4GHz | ATMEGA128RFA1 | 不合格 | 2/3.3V | I2C, SPI, USART | 128kB Flash 4kB EEPROM 16kB SRAM | 8 | YES | NO | 8b | YES | 6 | 6LoWPAN, Zigbee® | AVR | 38 | 3.5dBm | 802.15.4 | 1 | 2Mbps | 8 | I2C, JTAG, SPI, USART | 12mA~12.5mA | 8mA~14.5mA | O-QPSK | -100 dBm | 0.9mm | 9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| ATMEGA64RFR2-ZU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 38 | 有 | 8kB | Tin | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | FLASH | -40°C~85°C | Tray | 2008 | yes | 活跃 | 3 (168 Hours) | 64 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 3V | 0.5mm | 2.4GHz | ATMEGA64RFR2 | 不合格 | 2/3.3V | I2C, SPI, USART | 64kB Flash 2kB EEPROM 8kB SRAM | 8 | YES | NO | 8b | YES | 6 | Zigbee® | AVR | 3.5dBm | 802.15.4 | 2Mbps | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | DSSS, O-QPSK | -100 dBm | 38 | 35 | 9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATBTLC1000A-MU-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 32-VFQFN Exposed Pad | YES | -40°C~85°C | Tape & Reel (TR) | 2016 | e3 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | Matte Tin (Sn) | 1.8V~4.3V | QUAD | 无铅 | 未说明 | 1 | 1.2V | 0.4mm | 2.4GHz | 未说明 | ATBTLC1000 | S-XQCC-N32 | I2C, SPI, UART | 128kB ROM 128kB RAM | Bluetooth v4.1 | 3.5dBm | Bluetooth | 3.4Mbps | I2C, SPI, UART | 4mA | 3mA | -96 dBm | 13 | 1mm | 4mm | 4mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATWINC1500B-MU-Y | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | 表面贴装 | 40-VFQFN Exposed Pad | YES | Industrial grade | -40°C~85°C | Tray | 2016 | yes | 活跃 | 3 (168 Hours) | 40 | TxRx + MCU | 2.7V~3.6V | QUAD | 无铅 | 3.3V | 0.4mm | 2.4GHz | ATWINC1500 | S-PQCC-N40 | I2C, SDIO, SPI, UART | 4MB Flash 128kB ROM 224kB RAM | 802.11b/g/n | 20.5dBm | WiFi | 72.2Mbps | I2C, SDIO, SPI, UART | 22mA~58.5mA | 22mA~294mA | CCK, DSSS, OFDM | -98 dBm | 9 | 1mm | 5mm | 5mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATBTLC1000A-UU-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | 表面贴装 | 31-UFBGA, WLCSP | YES | -40°C~85°C | Tape & Reel (TR) | 2016 | e1 | yes | 活跃 | 3 (168 Hours) | 31 | TxRx + MCU | Tin/Silver/Copper (Sn/Ag/Cu) | 1.8V~4.3V | BOTTOM | BALL | 1 | 2.4GHz | ATBTLC1000 | R-PBGA-B31 | I2C, SPI, UART | 128kB ROM 128kB RAM | Bluetooth v4.1 | 3.5dBm | Bluetooth | 3.4Mbps | I2C, SPI, UART | 4mA | 3mA | -96 dBm | 13 | 0.541mm | 2.262mm | 2.142mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT86RF231-ZUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 2008 | yes | 活跃 | 3 (168 Hours) | TxRx + MCU | 1.8V~3.6V | 2.4GHz | 3.3V | 8 | 128B SRAM | 12.3mA | 6LoWPAN, WirelessHART™, Zigbee® | 3dBm | 802.15.4, General ISM > 1GHz | 2Mbps | SPI | 10.3mA~12.3mA | 7.4mA~14mA | 1 | O-QPSK | -101 dBm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATWINC1500B-MU-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 40-VFQFN Exposed Pad | YES | 40 | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 2016 | yes | 活跃 | 3 (168 Hours) | 40 | TxRx + MCU | 2.7V~3.6V | QUAD | 无铅 | 3.3V | 0.4mm | unknown | 2.4GHz | ATWINC1500 | 3.6V | 1 | I2C, SDIO, SPI, UART | 4MB Flash 128kB ROM 224kB RAM | 802.11b/g/n | 20.5dBm | WiFi | 72.2Mbps | I2C, SDIO, SPI, UART | 22mA~58.5mA | 22mA~294mA | CCK, DSSS, OFDM | -98 dBm | 9 | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATSAMR21G17A-MU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 28 | 有 | 16kB | Tin | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | FLASH | -40°C~85°C | Tray | 2014 | SMART™ SAM R21 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 0.5mm | 2.4GHz | ATSAMR21G | I2C, SPI, UART, USART, USB | 128kB Flash 16kB SRAM | 32 | YES | YES | 32b | YES | NO | 3 | ARM | 8 | CORTEX-M0 | YES | 固定点 | 4dBm | YES | General ISM > 1GHZ | 16000 | 250kbps | I2C, SPI, UART, USART, USB | 11.3mA~11.8mA | 7.2mA~13.8mA | 5 | O-QPSK | 15 | -99 dBm | 8 | 12 | 1mm | 7mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
 | MICRF506YML-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad, 32-MLF® | 32 | 32-MLF (5x5) | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 活跃 | 2 (1 Year) | 仅TxRx | 85°C | -40°C | 2V~2.5V | 5mm | 410MHz~450MHz | SPI | 2.5V | 2V | 11dBm | General ISM < 1GHz | -113dBm | 200kbps | SPI | 8mA~12mA | 8mA~21.5mA | FSK | -113 dBm | 840μm | 5mm | 5mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMR21E16A-MFT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 16 | 有 | 8kB | Tin | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | FLASH | -40°C~125°C | Tape & Reel (TR) | 2014 | SMART™ SAM R21 | e3 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 0.5mm | 2.4GHz | ATSAMR21E | I2C, SPI, UART, USART, USB | 48 MHz | 64kB Flash 8kB SRAM | 32 | YES | YES | 32b | YES | NO | 3 | ARM | 8 | CORTEX-M0 | YES | 16 | 固定点 | 4dBm | YES | General ISM > 1GHZ | 8000 | 250kbps | I2C, SPI, UART, USART, USB | 11.3mA~11.8mA | 7.2mA~13.8mA | 4 | O-QPSK | 14 | -99 dBm | 8 | 12 | 1mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| ATWINC3400A-MU-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | 48-QFN (6x6) | -40°C~85°C | Tape & Reel (TR) | 2015 | 活跃 | 3 (168 Hours) | TxRx + MCU | 85°C | -40°C | 2.7V~3.6V | 2.4GHz | ATWINC3400 | I2C, SDIO, SPI, UART | 256kB ROM 708kB RAM | 802.11b/g/n, Bluetooth v4.0 | 20dBm | Bluetooth, WiFi | -98dBm | 72.2Mbps | I2C, SDIO, SPI, UART | 83.7mA~91.8mA | 276mA~325mA | 8PSK, GFSK, QPSK | -98 dBm | 18 | 18 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATA5428C-PLQW-1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | Industrial grade | -40°C~85°C | Cut Tape (CT) | 2002 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | 仅TxRx | Matte Tin (Sn) | 2.4V~3.6V 4.4V~6.6V | QUAD | 无铅 | 1 | 3V | 0.5mm | 433MHz 868MHz | ATA5428 | S-XQCC-N48 | 10dBm | General ISM < 1GHz | 20kbps | SPI | 10.3mA~10.5mA | 6.5mA~17.3mA | ASK, FSK | -116.5 dBm | 0.9mm | 7mm | 7mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATMEGA644RFR2-ZFR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 33 | 8kB | Tin | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | FLASH | -40°C~125°C | Tape & Reel (TR) | 2014 | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 3V | 0.5mm | ATMEGA644RFR2 | S-XQCC-N48 | 不合格 | 2/3.3V | 2-Wire, I2C, SPI, USART | 64kB Flash 2kB EEPROM 8kB SRAM | 8 | YES | NO | 8b | YES | NO | 2.4 GHz | 6 | Zigbee® | AVR | 3.5dBm | 802.15.4 | 2Mbps | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | O-QPSK | -100 dBm | 33 | 32 | 0.9mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| ATSAMR21G18A-MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 28 | 262144 | 有 | 32kB | Tin | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | FLASH | -40°C~125°C | Tray | 2014 | SMART™ SAM R21 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 0.5mm | 2.4GHz | ATSAMR21G | I2C, SPI, UART, USART, USB | 256kB Flash 32kB SRAM | 32 | YES | YES | 32b | YES | NO | 3 | ARM | 8 | CORTEX-M0 | YES | 28 | 固定点 | 4dBm | YES | General ISM < 1GHz | 250kbps | I2C, SPI, UART, USART, USB | 11.3mA~11.8mA | 7.2mA~13.8mA | 5 | O-QPSK | 15 | -99 dBm | 8 | 12 | 1mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| ATMEGA1284RFR2-ZU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 33 | 有 | 16kB | Tin | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | FLASH | -40°C~85°C | Tray | 2014 | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 3V | 0.5mm | ATMEGA1284RFR2 | S-XQCC-N48 | 不合格 | 2/3.3V | 2-Wire, I2C, SPI, USART | 128kB Flash 4kB EEPROM 16kB SRAM | 8 | YES | NO | 8b | YES | NO | 2.4 GHz | 6 | Zigbee® | AVR | 3.5dBm | 802.15.4 | 2Mbps | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | O-QPSK | -100 dBm | 33 | 32 | 0.9mm | 7mm | ROHS3 Compliant |