制造商是'Microchip'
Microchip 射频收发器 IC
(307)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 深度 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源 | 通道数量 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 速度 | 内存大小 | 最大电源电流 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 带宽 | 定时器/计数器的数量 | 议定书 | 核心架构 | 片上程序 ROM 宽度 | 处理器系列 | 最高频率 | 边界扫描 | 低功率模式 | 可编程I/O数 | 格式 | 功率 - 输出 | 集成缓存 | 无线电频率系列/标准 | 内存(字) | UART 通道数 | 敏感度 | 数据率（最大） | ADC通道数量 | 串行接口 | 接收电流 | 传输电流 | 串行I/O数 | 接收器数 | 定时器数量 | 调制 | 外部中断数量 | 灵敏度(dBm) | I2C通道数 | 片上数据 RAM 宽度 | 通用输入输出数量 | 发射器数量 | [医]GPIO | 时间-最小值 | DMA通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||
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 | AT86RF233-ZU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 32-VFQFN Exposed Pad | YES | 32 | 188.609377mg | 32QN2 | -40°C~85°C | Tray | 1999 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | 1.8V~3.6V | QUAD | 1 | 3V | 2.4GHz | AT86RF233 | 1.83V | 128B SRAM | 6LoWPAN, Zigbee® | 4dBm | 802.15.4, General ISM > 1GHz | 2Mbps | SPI | 11.3mA~11.8mA | 7.2mA~13.8mA | O-QPSK | -101 dBm | 1mm | 5mm | 5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATMEGA256RFR2-ZU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 有 | FLASH | 32kB | Tin | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | 206.29948mg | 131072 | -40°C~85°C | Tray | 2004 | yes | 活跃 | 3 (168 Hours) | 64 | TxRx + MCU | 1.8V~3.6V | QUAD | 0.5mm | 2.4GHz | ATMEGA256RFR2 | 2/3.3V | I2C, SPI, UART, USART | 256kB Flash 8kB EEPROM 32kB SRAM | 8 | 8b | 6 | Zigbee® | AVR | 38 | 3.5dBm | 802.15.4 | 2Mbps | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | DSSS, O-QPSK | -100 dBm | 35 | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT86RF233-ZUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | Tin | 表面贴装 | 32-VFQFN Exposed Pad | 32 | Industrial grade | -40°C~85°C | Cut Tape (CT) | 2009 | yes | 活跃 | 3 (168 Hours) | TxRx + MCU | 1.8V~3.6V | 2.4GHz | AT86RF233 | 3V | 16 | 128B SRAM | 6LoWPAN, Zigbee® | 4dBm | 802.15.4, General ISM > 1GHz | 2Mbps | SPI | 11.3mA~11.8mA | 7.2mA~13.8mA | O-QPSK | -101 dBm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT86RF231-ZU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | 69.399633mg | Industrial grade | -40°C~85°C | Tray | 2009 | yes | 活跃 | 3 (168 Hours) | SMD/SMT | TxRx + MCU | 1.8V~3.6V | 2.4GHz | 3.3V | 8 | 128B SRAM | 12.3mA | 0 | 6LoWPAN, WirelessHART™, Zigbee® | 3dBm | 802.15.4, General ISM > 1GHz | 2Mbps | SPI | 10.3mA~12.3mA | 7.4mA~14mA | 1 | O-QPSK | -101 dBm | 1mm | 5mm | 5mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MRF24J40-I/ML | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 40-VFQFN Exposed Pad | 40 | Industrial grade | -40°C~85°C | Tube | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 40 | TxRx + MCU | Matte Tin (Sn) - annealed | 2.4V~3.6V | QUAD | 260 | 1 | 3.3V | 0.5mm | 2.4GHz | 40 | MRF24J40 | 40 | 3.3V | Zigbee®, MiWi® | 0dBm | 802.15.4 | 625kbps | SPI | 19mA | 23mA | 1 | O-QPSK | -95 dBm | 6 | 950μm | 6mm | 6mm | 900μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATMEGA256RFR2-ZUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 38 | 131072 | 有 | 32kB | Tin | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | FLASH | -40°C~85°C | Tape & Reel (TR) | 2004 | yes | 活跃 | 3 (168 Hours) | 64 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 3V | 0.5mm | 2.4GHz | ATMEGA256RFR2 | 不合格 | 2/3.3V | I2C, SPI, USART | 256kB Flash 8kB EEPROM 32kB SRAM | 8 | YES | NO | 8b | YES | 6 | Zigbee® | AVR | 3.5dBm | 802.15.4 | 2Mbps | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | DSSS, O-QPSK | -100 dBm | 38 | 35 | 9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMR21G18A-MU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 28 | 有 | 32kB | Tin | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | FLASH | -40°C~85°C | Tray | 2014 | SMART™ SAM R21 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 未说明 | 0.5mm | 2.4GHz | 未说明 | ATSAMR21G | I2C, SPI, UART, USART, USB | 256kB Flash 32kB SRAM | 32 | YES | YES | 32b | YES | NO | 6 | ARM | 8 | CORTEX-M0 | YES | 固定点 | 4dBm | YES | General ISM > 1GHZ | 32000 | 250kbps | I2C, SPI, UART, USART, USB | 11.3mA~11.8mA | 7.2mA~13.8mA | 5 | O-QPSK | 15 | -99 dBm | 8 | 12 | 1mm | 7mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
| AT86RF231-ZFR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | -40°C~125°C | Tape & Reel (TR) | 2001 | yes | 活跃 | 3 (168 Hours) | TxRx + MCU | 1.8V~3.6V | 2.4GHz | 128B SRAM | 12.3mA | 0 | 6LoWPAN, WirelessHART™, Zigbee® | 3dBm | 802.15.4, General ISM > 1GHz | 2Mbps | SPI | 10.3mA~12.3mA | 7.4mA~14mA | 1 | O-QPSK | -101 dBm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT86RF212B-ZUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 2013 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | 1.8V~3.6V | QUAD | 1 | 3V | 0.5mm | 769MHz~935MHz | AT86RF212B | 3V | 128B SRAM | 6LoWPAN, Zigbee® | 10dBm | 802.15.4, General ISM < 1GHz | 1Mbps | SPI | 8.7mA~9.2mA | 9.5mA~26.5mA | 1 | BPSK, O-QPSK | -110 dBm | 5mm | 5mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT86RF212B-ZU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | Industrial grade | -40°C~85°C | Tray | 2013 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | 1.8V~3.6V | QUAD | 1 | 3V | 0.5mm | 769MHz~935MHz | AT86RF212B | 3V | 128B SRAM | 6LoWPAN, Zigbee® | 10dBm | 802.15.4, General ISM < 1GHz | 1Mbps | SPI | 8.7mA~9.2mA | 9.5mA~26.5mA | 1 | BPSK, O-QPSK | -110 dBm | 5mm | 5mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT86RF215-ZU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | Industrial grade | -40°C~85°C | Tray | 2006 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | 仅TxRx | Matte Tin (Sn) | 1.8V~3.6V | QUAD | 无铅 | 1 | 3V | 0.5mm | 389.5MHz~510MHz 779MHz~1.02GHz 2.4GHz | AT86RF215 | S-PQCC-N48 | 16dBm | 802.15.4, General ISM < 1GHz | 2.4Mbps | SPI | 5mA~33mA | 62mA~64mA | FSK, OFDM, O-QPSK | -123 dBm | 0.9mm | 7mm | 7mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT86RF232-ZX | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | Commercial grade | 0°C~70°C | Tray | 2011 | yes | 活跃 | 3 (168 Hours) | TxRx + MCU | 1.8V~3.6V | 2.4GHz | 128B SRAM | 13.8mA | 0 | 6LoWPAN, Zigbee® | 3dBm | 802.15.4, General ISM > 1GHz | 250kbps | SPI | 11.3mA~11.8mA | 7.2mA~13.8mA | 1 | O-QPSK | -100 dBm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT86RF215M-ZUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | 仅TxRx | Matte Tin (Sn) | 1.8V~3.6V | QUAD | 无铅 | 1 | 3V | 0.5mm | 389.5MHz~510MHz 779MHz~1.02GHz | AT86RF215M | 16dBm | General ISM < 1GHz | 2.4Mbps | SPI | 5mA~33mA | 62mA~64mA | FSK, OFDM, O-QPSK | -123 dBm | 0.9mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMR30E18A-MUT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 65536 | 32kB | 表面贴装 | 32-VFQFN Exposed Pad | YES | 16 | -40°C~85°C | Tape & Reel (TR) | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 3.3V | 0.5mm | 700MHz 800MHz 900MHz | ATSAMR30 | S-XQCC-N32 | 48 MHz | 256kB Flash 40kB SRAM | 32 | YES | YES | NO | NO | 32 | CORTEX-M0 | YES | YES | FIXED-POINT | 11dBm | YES | 802.15.4 | 8192 | -110dBm | 1Mbps | I2C, SPI | 9.2mA | 26.5mA | 3 | BPSK, O-QPSK | 14 | 32 | 16 | SECONDS | 12 | 1mm | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MRF49XA-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | 16 | 172.98879mg | -40°C~85°C | Tube | 2009 | e3 | yes | Obsolete | 1 (Unlimited) | EAR99 | 仅TxRx | Matte Tin (Sn) | 2.2V~3.8V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 4.4mm | 433MHz 868MHz 915MHz | 40 | MRF49XA | 16 | 3.3V | 7dbm | General ISM < 1GHz | -112dBm | 256kbps | SPI | 11mA~13mA | 15mA~24mA | 1 | FHSS, FSK | -110 dBm | 2 | 1.05mm | 5mm | 4.5mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT86RF230-ZU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | 32-QFN (5x5) | -40°C~85°C | Tray | 2007 | Obsolete | 3 (168 Hours) | SMD/SMT | TxRx + MCU | 85°C | -40°C | 1.8V~3.6V | 5mm | 2.4GHz | 3V | SPI | 3.6V | 1.8V | 128B SRAM | 0 | 6LoWPAN, WirelessHART™, Zigbee® | 2.48GHz | 3dBm | 802.15.4, General ISM > 1GHz | 0 | -101dBm | 250kbps | SPI | 15.5mA | 9.5mA~16.5mA | 1 | O-QPSK | -101 dBm | 1 | 1mm | 5mm | 5mm | 900μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MRF89XAT-I/MQ | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 32-WFQFN Exposed Pad | 32 | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 2010 | e3 | 活跃 | 3 (168 Hours) | EAR99 | 仅TxRx | Matte Tin (Sn) | 8542.39.00.01 | 2.1V~3.6V | 5mm | 863MHz~870MHz 902MHz~928MHz 950MHz~960MHz | MRF89XA | 32 | 3.3V | 59 | 12.5dBm | General ISM < 1GHz | 200kbps | SPI | 3mA | 16mA~25mA | FSK, OOK | -113 dBm | 750μm | 5mm | 5mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMR21E18A-MFT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 262144 | 表面贴装 | 32-VFQFN Exposed Pad | YES | 32 | 16 | -40°C~125°C | Tape & Reel (TR) | 2015 | SMART™ SAM R21 | e3 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | Matte Tin (Sn) | 1.8V~3.6V | QUAD | 无铅 | 0.5mm | 2.4GHz | ATSAMR21E | I2C, SPI, UART, USART, USB | 48 MHz | 256kB Flash 32kB SRAM | 32 | YES | YES | YES | NO | 8 | CORTEX-M0 | YES | 固定点 | 4dBm | YES | General ISM > 1GHZ | 250kbps | I2C, SPI, UART, USART, USB | 11.3mA~11.8mA | 7.2mA~13.8mA | 4 | 6 | O-QPSK | 14 | -99 dBm | 8 | 16 | 12 | 1mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| ATSAMR21E18A-MU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 16 | 262144 | 有 | 32kB | Tin | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | FLASH | -40°C~85°C | Tray | 2014 | SMART™ SAM R21 | e3 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 0.5mm | 2.4GHz | ATSAMR21E | I2C, SPI, UART, USART, USB | 48 MHz | 256kB Flash 32kB SRAM | 32 | YES | YES | 32b | YES | NO | 3 | ARM | 8 | CORTEX-M0 | YES | 固定点 | 4dBm | YES | General ISM > 1GHZ | 250kbps | I2C, SPI, UART, USART, USB | 11.3mA~11.8mA | 7.2mA~13.8mA | 4 | O-QPSK | 14 | -99 dBm | 8 | 12 | 1mm | 5mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| ATMEGA2564RFR2-ZU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 33 | 131072 | 有 | 32kB | Tin | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | FLASH | -40°C~85°C | Tray | 2014 | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 3V | 0.5mm | ATMEGA2564RFR2 | S-XQCC-N48 | 不合格 | 2/3.3V | 2-Wire, I2C, SPI, USART | 256kB Flash 8kB EEPROM 32kB SRAM | 8 | YES | NO | 8b | YES | NO | 2.4 GHz | 6 | Zigbee® | AVR | 3.5dBm | 802.15.4 | 2Mbps | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | O-QPSK | -100 dBm | 33 | 32 | 0.9mm | 7mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT86RF215-ZUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 21 Weeks | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 2006 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | 仅TxRx | Matte Tin (Sn) | 1.8V~3.6V | QUAD | 无铅 | 1 | 3V | 0.5mm | 389.5MHz~510MHz 779MHz~1.02GHz 2.4GHz | AT86RF215 | 16dBm | 802.15.4, General ISM < 1GHz | 2.4Mbps | SPI | 5mA~33mA | 62mA~64mA | FSK, OFDM, O-QPSK | -123 dBm | 0.9mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMR30G18A-MUT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 65536 | 32kB | 表面贴装 | 48-VFQFN Exposed Pad | YES | 28 | -40°C~85°C | Tape & Reel (TR) | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 3.3V | 0.5mm | 700MHz 800MHz 900MHz | ATSAMR30 | S-XQCC-N48 | 48 MHz | 256kB Flash 40kB SRAM | 32 | YES | YES | NO | NO | 32 | CORTEX-M0 | YES | YES | FIXED-POINT | 11dBm | YES | 802.15.4 | 8192 | -110dBm | 1Mbps | I2C, SPI | 9.2mA | 26.5mA | 3 | BPSK, O-QPSK | 15 | 32 | 28 | SECONDS | 12 | 0.9mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATMEGA128RFR2-ZU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 有 | 16kB | Tin | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | FLASH | -40°C~85°C | Tray | 2003 | yes | 活跃 | 3 (168 Hours) | 64 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 0.5mm | 2.4GHz | ATMEGA128RFR2 | 不合格 | 2/3.3V | SPI, USART | 128kB Flash 4kB EEPROM 16kB SRAM | 8 | 8b | 6 | Zigbee® | AVR | 38 | 3.5dBm | 802.15.4 | 2Mbps | 8 | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | DSSS, O-QPSK | -100 dBm | 1 | 35 | 850μm | 9mm | 9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATMEGA2564RFR2-ZUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 33 | 131072 | 有 | 32kB | Tin | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | FLASH | -40°C~85°C | Tape & Reel (TR) | 2014 | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 3V | 0.5mm | 2.4GHz | ATMEGA2564RFR2 | 不合格 | 3V | I2C, SPI, UART, USART | 256kB Flash 8kB EEPROM 32kB SRAM | 8 | YES | NO | 8b | YES | NO | 6 | Zigbee® | AVR | 38 | 3.5dBm | 802.15.4 | 2Mbps | I2C, JTAG, SPI, USART | 5mA~12.5mA | 8mA~14.5mA | O-QPSK | -100 dBm | 32 | 0.9mm | 7mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT86RF215M-ZU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | -40°C~85°C | Tray | 2014 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | 仅TxRx | Matte Tin (Sn) | 1.8V~3.6V | QUAD | 无铅 | 1 | 3V | 0.5mm | 389.5MHz~510MHz 779MHz~1.02GHz | AT86RF215M | 16dBm | General ISM < 1GHz | 2.4Mbps | SPI | 5mA~33mA | 62mA~64mA | FSK, OFDM, O-QPSK | -123 dBm | 0.9mm | 7mm | 7mm | ROHS3 Compliant |