制造商是'Microchip'
Microchip 存储器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 引脚数 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 操作模式 | 电源电流-最大值 | 访问时间 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 并行/串行 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 数据轮询 | 页面尺寸 | I2C控制字节 | 反向引脚排列 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||
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![]() | 24LC04BH-I/MNY | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | HVSON, SOLCC8,.11,20 | 5.35 | 0.4 MHz | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Automotive grade | 8 | 24LC04BH-I/MNY | e4 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | 无铅 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | 不合格 | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.003 mA | 256X8 | OPEN-DRAIN | 0.8 mm | 8 | 0.000005 A | 4096 bit | ISO/TS-16949 | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | YES | 16 words | 1010XXMR | NO | 3 mm | 2 mm | ||||||||||||||||||||||
![]() | 24LC64F-I/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | HVSON, | 5.36 | 0.4 MHz | 1 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | 40 | 8 | 24LC64F-I/MNY | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | 不合格 | 5.5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 8KX8 | 0.8 mm | 8 | 65536 bit | SERIAL | EEPROM | I2C | 5 ms | 2 mm | 3 mm | |||||||||||||||||||||||||||||||
![]() | 24AA64F-I/MNY | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | HVSON, | 5.5 | 0.4 MHz | 1 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | 40 | 8 | 24AA64F-I/MNY | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | 不合格 | 5.5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 8KX8 | 0.8 mm | 8 | 65536 bit | SERIAL | EEPROM | I2C | 5 ms | 2 mm | 3 mm | |||||||||||||||||||||||||||||||
![]() | 24VL024H/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | 5.41 | 0.1 MHz | 256 words | 256 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | 小概要 | 1.8 V | 未说明 | 8 | 24VL024H/MNY | e4 | EAR99 | 8542.32.00.51 | DUAL | 无铅 | 未说明 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | 不合格 | 3.6 V | 1.8/3.3 V | OTHER | 1.5 V | SYNCHRONOUS | 0.003 mA | 256X8 | 0.8 mm | 8 | 0.000001 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | 3 mm | 2 mm | ||||||||||||||||||||||||||
![]() | 24LC64-I/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | VSON, SOLCC8,.11,20 | 5.36 | 0.4 MHz | 1 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | VSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | 5 V | 40 | Compliant | 8 | 8 | 24LC64-I/MNY | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 85 °C | -40 °C | 8542.32.00.51 | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | 不合格 | 5 V | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | I2C, Serial | 5.5 V | 2.5 V | 8 kB | SYNCHRONOUS | 0.003 mA | 900 ns | 8KX8 | 0.8 mm | 8 | 64 kb | 0.000001 A | 65536 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | 3 mm | 2 mm | 无 | ||||||||||
![]() | 24AA04-I/MNY | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | HVSON, SOLCC8,.11,20 | 5.39 | 0.1 MHz | 1 | 512 words | 512 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 40 | 8 | 24AA04-I/MNY | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | 不合格 | 5.5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.003 mA | 512X8 | 0.8 mm | 8 | 0.000001 A | 4096 bit | SERIAL | EEPROM | I2C | 5 ms | 200 | HARDWARE | NO | 3 mm | 2 mm | ||||||||||||||||||||||||||
![]() | 24AA64-I/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | VSON, SOLCC8,.11,20 | 5.36 | 0.4 MHz | 1 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | VSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | 2.5 V | 40 | 8 | 24AA64-I/MNY | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.003 mA | 8KX8 | 0.8 mm | 8 | 0.000001 A | 65536 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | 3 mm | 2 mm | |||||||||||||||||||||||
![]() | 24VL025/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | 5.6 | 0.4 MHz | 1 | 256 words | 256 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 1.8 V | 40 | 8 | 24VL025/MNY | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | 不合格 | 3.6 V | 1.8/3.3 V | OTHER | 1.5 V | SYNCHRONOUS | 0.003 mA | 256X8 | 0.8 mm | 8 | 0.000001 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | SOFTWARE | 1010DDDR | 3 mm | 2 mm | |||||||||||||||||||||||
![]() | 24VL014/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | 5.58 | 0.4 MHz | 1 | 128 words | 128 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 1.8 V | 40 | 8 | 24VL014/MNY | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | 不合格 | 3.6 V | 1.8/3.3 V | OTHER | 1.5 V | SYNCHRONOUS | 0.003 mA | 128X8 | 0.8 mm | 8 | 0.000001 A | 1024 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | 3 mm | 2 mm | |||||||||||||||||||||||
![]() | 24VL024/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | 5.41 | 0.4 MHz | 1 | 256 words | 256 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 1.8 V | 40 | 8 | 24VL024/MNY | e4 | 有 | EAR99 | 镍钯金 | 8542.32.00.51 | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | 不合格 | 3.6 V | 1.8/3.3 V | OTHER | 1.5 V | SYNCHRONOUS | 0.003 mA | 256X8 | 0.8 mm | 8 | 0.000001 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 3 mm | 2 mm | |||||||||||||||||||||||
![]() | 25LC080AT-E/MSG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 不推荐 | MICROCHIP TECHNOLOGY INC | MSOP | ROHS COMPLIANT, PLASTIC, MSOP-8 | 5.26 | 10 MHz | 1 | 1024 words | 1000 | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5 V | 40 | 8 | 25LC080AT-E/MSG | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | 不合格 | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | SYNCHRONOUS | 0.006 mA | 1KX8 | 1.1 mm | 8 | 0.000005 A | 8192 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 3 mm | 3 mm | ||||||||||||||||||||||||
![]() | 25LC160AT-I/MSG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 不推荐 | MICROCHIP TECHNOLOGY INC | MSOP | 3 X 3 MM, PLASTIC, MSOP-8 | 5.25 | 10 MHz | 1 | 2048 words | 2000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5 V | 40 | 8 | 25LC160AT-I/MSG | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | 不合格 | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.006 mA | 2KX8 | 1.1 mm | 8 | 0.000005 A | 16384 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 3 mm | 3 mm | ||||||||||||||||||||||||
![]() | 25LC1024T-I/SMG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | SOIC | SOP, SOP8,.3 | 5.42 | 20 MHz | 1 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | 小概要 | 5 V | 40 | 8 | 25LC1024T-I/SMG | e3 | 有 | EAR99 | NOR型号 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.01 mA | 128KX8 | 2.03 mm | 8 | 0.000001 A | 1048576 bit | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | 5 ms | HARDWARE/SOFTWARE | 5.28 mm | 5.21 mm | |||||||||||||||||||||||
![]() | 25LC080AT-E/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 不推荐 | MICROCHIP TECHNOLOGY INC | SOIC | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 5.23 | 10 MHz | 1 | 1024 words | 1000 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 5 V | 40 | 8 | 25LC080AT-E/SNG | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | SYNCHRONOUS | 0.006 mA | 1KX8 | 1.75 mm | 8 | 0.000005 A | 8192 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 4.9 mm | 3.91 mm | ||||||||||||||||||||||||
![]() | 25AA1024-I/SMG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | SOIC | SOP, SOP8,.3 | 5.41 | 20 MHz | 1 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | 小概要 | 40 | 2.5 V | 8 | 25AA1024-I/SMG | e3 | 有 | EAR99 | NOR型号 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 1.8 V | SYNCHRONOUS | 0.01 mA | 128KX8 | 2.03 mm | 8 | 0.000001 A | 1048576 bit | SERIAL | FLASH | 1.8 V | SPI | 100000 Write/Erase Cycles | 5 ms | HARDWARE/SOFTWARE | 5.28 mm | 5.21 mm | |||||||||||||||||||||||
![]() | 24LC16BT-E/MSG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | TSSOP | ROHS COMPLIANT, PLASTIC, MO-187, MSOP-8 | 5.13 | 0.4 MHz | 1 | 2048 words | 2000 | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5 V | 40 | 8 | 24LC16BT-E/MSG | e3 | 有 | EAR99 | Matte Tin (Sn) | 1 MILLION ERASE/WRITE CYCLES | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | 不合格 | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | SYNCHRONOUS | 0.003 mA | 2KX8 | 1.1 mm | 8 | 0.000005 A | 16384 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010MMMR | 3 mm | 3 mm | ||||||||||||||||||||||
![]() | 25LC080A-E/STG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 不推荐 | MICROCHIP TECHNOLOGY INC | SOIC | 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 | 5.26 | 10 MHz | 1 | 1024 words | 1000 | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5 V | 40 | 8 | 25LC080A-E/STG | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | SYNCHRONOUS | 0.006 mA | 1KX8 | 1.2 mm | 8 | 0.000005 A | 8192 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 4.4 mm | 3 mm | ||||||||||||||||||||||||
![]() | 25AA256T-I/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | SOIC | 0.150 INCH, PLASTIC, MS-012, SOIC-8 | 5.23 | 10 MHz | 1 | 32768 words | 32000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 2.5 V | 40 | 8 | 25AA256T-I/SNG | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 1.8 V | SYNCHRONOUS | 0.005 mA | 32KX8 | 1.75 mm | 8 | 0.000001 A | 262144 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 4.9 mm | 3.91 mm | ||||||||||||||||||||||||
![]() | 24LC04BT-E/MSG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | MSOP | TSSOP, TSSOP8,.19 | 5.18 | 0.4 MHz | 1 | 512 words | 512 | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 40 | Compliant | 8 | 24LC04BT-E/MSG | e3 | 有 | EAR99 | Matte Tin (Sn) | 125 °C | -40 °C | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | 不合格 | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | I2C | 5.5 V | 2.5 V | 512 B | SYNCHRONOUS | 0.003 mA | 900 ns | 512X8 | 1.1 mm | 8 | 0.000005 A | 4096 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010XXMR | NO | 3 mm | 3 mm | ||||||||||||||
![]() | 24AA01T-I/MSG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | MSOP | TSSOP, TSSOP8,.19 | 5.33 | 0.1 MHz | 1 | 128 words | 128 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 40 | 8 | 24AA01T-I/MSG | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.003 mA | 128X8 | 1.1 mm | 8 | 0.000001 A | 1024 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010XXXR | NO | 3 mm | 3 mm | |||||||||||||||||||||||
![]() | 25AA080B-I/PG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | 有 | 不推荐 | MICROCHIP TECHNOLOGY INC | DIP | DIP, DIP8,.3 | 5.38 | 10 MHz | 1024 words | 1000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | 2.5 V | 未说明 | 8 | 25AA080B-I/PG | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 1.8 V | SYNCHRONOUS | 0.006 mA | 1KX8 | 5.33 mm | 8 | 0.000001 A | 8192 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 9.271 mm | 7.62 mm | |||||||||||||||||||||||||
![]() | 24AA00T-I/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | SOIC | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 5.47 | 0.4 MHz | 1 | 16 words | 16 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 2.5 V | 40 | 8 | 24AA00T-I/SNG | e3 | 有 | Matte Tin (Sn) | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.003 mA | 16X8 | 1.75 mm | 8 | 0.000001 A | 128 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 4 ms | 200 | 1010XXXR | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||
![]() | 25LC080B-I/PG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | 有 | 不推荐 | MICROCHIP TECHNOLOGY INC | DIP | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | 5.37 | 10 MHz | 1024 words | 1000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | 5 V | 未说明 | 8 | 25LC080B-I/PG | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | 不合格 | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.006 mA | 1KX8 | 5.33 mm | 8 | 0.000001 A | 8192 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 9.271 mm | 7.62 mm | |||||||||||||||||||||||||
![]() | 24AA52T-I/MSG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | 5.52 | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 8 | 24AA52T-I/MSG | e3 | Matte Tin (Sn) | DUAL | 鸥翼 | 0.635 mm | compliant | R-PDSO-G8 | 不合格 | 2/5 V | INDUSTRIAL | 0.003 mA | 256X8 | 8 | 0.000001 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 200 | HARDWARE/SOFTWARE | 1010DDDR | ||||||||||||||||||||||||||||||||||||||||||
![]() | 24AA64T-I/SMG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | SOIC | SOP, SOP8,.3 | 5.2 | 0.4 MHz | 1 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | 小概要 | 2.5 V | 40 | 8 | 24AA64T-I/SMG | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.003 mA | 8KX8 | 2.03 mm | 8 | 0.000001 A | 65536 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | 5.245 mm | 5.23 mm |