制造商是'Microchip'
Microchip 存储器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 页面尺寸 | 引导模块 | I2C控制字节 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||||||||||||||||||||||||||
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 | 24LC128-I/PG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2010 | e3 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS | 2.5V~5.5V | DUAL | 1 | 4.5V | 2.54mm | 24LC128 | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 128Kb 16K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 128 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 5.334mm | 9.271mm | 7.62mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | AT24C04U3-10UU-1.8 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1 | 512 | PLASTIC/EPOXY | BGA8,2X4,40/20 | -40 °C | 40 | 85 °C | 有 | AT24C04U3-10UU-1.8 | 0.1 MHz | 512 words | 2.5 V | VFBGA | RECTANGULAR | Atmel Corporation | Obsolete | ATMEL CORP | 5.67 | BGA | YES | 8 | 1.50 X 2 MM, 0.50 MM PITCH, GREEN, DBGA2-8 | e1 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | DATA RETENTION 100 YEARS; 1 MILLION ENDURANCE WRITE CYCLES | 8542.32.00.51 | EEPROMs | CMOS | BOTTOM | BALL | 260 | 1 | 0.5 mm | unknown | 8 | R-PBGA-B8 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 1.8 V | SYNCHRONOUS | 0.003 mA | 512X8 | 0.91 mm | 8 | 0.000003 A | 4096 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 100 | HARDWARE | 1010DDMR | 2 mm | 1.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC16BT-I/OTG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | 表面贴装 | 表面贴装 | SC-74A, SOT-753 | 5 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2000 | e3 | yes | Obsolete | 1 (Unlimited) | 5 | EAR99 | Matte Tin (Sn) | 1 MILLION ERASE/WRITE CYCLES | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 40 | 24LC16B | 5 | I2C, Serial | 16Kb 2K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 2KX8 | 8 | 5ms | 16 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 200 | HARDWARE | 1010MMMR | 1.63mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39WF800A-90-4C-B3KE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-TFBGA | 48 | 48-TFBGA | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2000 | SST39 MPF™ | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.65V~1.95V | SST39WF800A | 1.8V | Parallel | 1.95V | 1.65V | 8Mb 512K x 16 | 90ns | FLASH | Parallel | 16b | 40μs | 19b | 8 Mb | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SST39WF400A-90-4I-B3KE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-TFBGA | 48 | 48-TFBGA | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2000 | SST39 MPF™ | Obsolete | 3 (168 Hours) | 85°C | -40°C | 1.65V~1.95V | SST39WF400A | 1.8V | Parallel | 1.95V | 1.65V | 4Mb 256K x 16 | 90ns | FLASH | Parallel | 16b | 40μs | 18b | 4 Mb | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT25HP256-10PI-2.7 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 8-DIP (0.300, 7.62mm) | 8-PDIP | Non-Volatile | -40°C~85°C TA | Tube | Obsolete | 1 (Unlimited) | 85°C | -40°C | 2.7V~5.5V | 10MHz | AT25HP256 | SPI, Serial | 256Kb 32K x 8 | 10MHz | 10 μs | EEPROM | SPI | 10ms | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST25VF016B-75-4I-QAF-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | SST25 | Obsolete | 1 (Unlimited) | 8 | 2.7V~3.6V | DUAL | 1.27mm | SST25VF016B | 3.3V | SPI, Serial | 16Mb 2M x 8 | 20mA | 80MHz | 6 ns | FLASH | SPI | 8b | 10μs | 1b | 16 Mb | 0.00002A | Synchronous | 8b | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 750μm | 6mm | 5mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24FC64F-I/MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 2-Wire, I2C | 200 Year | 60 | 0.001319 oz | DFN-8 | Details | Tube | 24FC64F | 64 kbit | 8 k x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24FC64F-I/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 2-Wire, I2C | 200 Year | 有 | 150 | 0.001764 oz | TDFN-8 | Details | Tube | 24FC64F | 64 kbit | 8 k x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24MAC602-MAHM-E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Gold | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | yes | 活跃 | 3 (168 Hours) | 8 | 1.7V~5.5V | DUAL | 未说明 | 1 | 2.5V | 0.5mm | 未说明 | AT24MAC602 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | SYNCHRONOUS | 1MHz | 550ns | EEPROM | I2C | 8 | 5ms | I2C | 5ms | 0.6mm | 3mm | 2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST26VF016BA-104I/SM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | Automotive grade | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tube | SST26 SQI® | Obsolete | 1 (Unlimited) | 8 | 3A991.B.1.A | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | SST26VF016B | 3.6V | 2.7V | SPI, Serial | 16Mb 2M x 8 | 104MHz | FLASH | SPI - Quad I/O | 16MX1 | 1 | 1.5ms | 16 Mb | TS 16949 | 2.7V | 256B | BOTTOM/TOP | 2.03mm | 5.26mm | 5.25mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST26VF016BAT-104I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Automotive grade | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | SST26 SQI® | Obsolete | 1 (Unlimited) | 8 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | SST26VF016B | R-PDSO-G8 | 3.6V | 2.7V | SPI, Serial | 16Mb 2M x 8 | 104MHz | FLASH | SPI - Quad I/O | 16MX1 | 1 | 1.5ms | 16 Mb | TS 16949 | 2.7V | 256B | BOTTOM/TOP | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT21CS01-SSHM11-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 2005 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.7V~3.6V | DUAL | 260 | 1 | 1.8V | 1.27mm | 40 | AT21CS01 | 3.6V | 1.7V | 1Kb 128 x 8 | SYNCHRONOUS | 125kHz | EEPROM | I2C, Single Wire | 8 | 5ms | 1024 bit | SERIAL | 1-WIRE | 5ms | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39LF010-55-4C-NHE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 32-LCC (J-Lead) | YES | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2011 | SST39 MPF™ | 活跃 | 3 (168 Hours) | 32 | 3V~3.6V | QUAD | 1 | 3.3V | 1.27mm | R-PQCC-J32 | 3.6V | 3V | 1Mb 128K x 8 | ASYNCHRONOUS | 55ns | FLASH | Parallel | 128KX8 | 8 | 20μs | 1048576 bit | 3V | 3.556mm | 13.97mm | 11.43mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA1026-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2012 | e3 | Obsolete | 1 (Unlimited) | 8 | Matte Tin (Sn) | 1.7V~5.5V | DUAL | 260 | 1 | 0.65mm | 40 | 24AA1026 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 1Mb 128K x 8 | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDMR | NO | 1.2mm | 4.4mm | 3mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25AA160T/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 40 | 25AA160 | 8 | 5.5V | SPI, Serial | 16Kb 2K x 8 | 5mA | 1MHz | 475 ns | EEPROM | SPI | 8 | 5ms | 16 kb | SPI | 5ms | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST25VF064C-80-4C-Q2AE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | SST25 | Obsolete | 3 (168 Hours) | 8 | 2.7V~3.6V | 1 | 1.27mm | SST25VF064C | 3.3V | 3.6V | 2.7V | SPI, Serial | 64Mb 8M x 8 | 12mA | 80MHz | 6 ns | FLASH | SPI - Dual I/O | 8b | 64MX1 | 1 | 2.5ms | 1b | 64 Mb | 0.00002A | Synchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 256B | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF512-70-4I-WHE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-TFSOP (0.488, 12.40mm Width) | 32 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2000 | SST39 MPF™ | Obsolete | 3 (168 Hours) | 2.7V~3.6V | SST39VF512 | 512Kb 64K x 8 | 70ns | FLASH | Parallel | 8b | 20μs | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT24C128C-UUM0B-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-XFBGA, WLCSP | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 1.7V~5.5V | UPPER | 未说明 | 1 | 2.5V | 未说明 | AT24C128C | X-XUUC-N | 5.5V | 1.7V | 128Kb 16K x 8 | SYNCHRONOUS | 1MHz | 550ns | EEPROM | I2C | 16KX8 | 8 | 5ms | 131072 bit | SERIAL | I2C | 5ms | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28HC256E-12PI | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 通孔 | 28-DIP (0.600, 15.24mm) | 28 | 28-PDIP | Non-Volatile | -40°C~85°C TC | Tube | 1997 | Obsolete | 1 (Unlimited) | 85°C | -40°C | 4.5V~5.5V | AT28HC256 | 5V | Parallel, SPI | 5.5V | 4.5V | 256Kb 32K x 8 | 120ns | EEPROM | Parallel | 10ms | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28HC64B-90JI | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-LCC (J-Lead) | 32-PLCC (13.97x11.43) | Non-Volatile | -40°C~85°C TC | Tube | 1997 | Obsolete | 2 (1 Year) | 4.5V~5.5V | AT28HC64 | 64Kb 8K x 8 | 90ns | EEPROM | Parallel | 10ms | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SST39WF800A-90-4I-B3KE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-TFBGA | 48 | 48-TFBGA | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2000 | SST39 MPF™ | Obsolete | 3 (168 Hours) | 85°C | -40°C | 1.65V~1.95V | SST39WF800A | 1.8V | Parallel | 1.95V | 1.65V | 8Mb 512K x 16 | 90ns | FLASH | Parallel | 16b | 40μs | 19b | 8 Mb | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39WF400A-90-4I-ZKE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-VFBGA | YES | 48 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2000 | SST39 MPF™ | e1 | Obsolete | 3 (168 Hours) | 48 | EAR99 | 锡银铜 | 8542.32.00.51 | 1.65V~1.95V | BOTTOM | 1 | 1.8V | SST39WF400A | 48 | 1.8V | 1.95V | 1.7V | 4Mb 256K x 16 | 90ns | FLASH | Parallel | 16b | 256KX16 | 16 | 40μs | 18b | 4 Mb | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA01T-I/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | Tin | 表面贴装 | 表面贴装 | SC-74A, SOT-753 | 5 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1995 | e3 | yes | 活跃 | 1 (Unlimited) | 5 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 40 | 24AA01 | 5 | 1.7V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 3500ns | EEPROM | I2C | 128X8 | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 200 | HARDWARE | 1010XXXR | NO | 1.3mm | 3.1mm | 1.8mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA02-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Industrial grade | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 24AA02 | 8 | 5.5V | 2/5V | 1.7V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXXR | 1.5mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 |