制造商是'Microchip'
Microchip 接口 - 电信
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图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 功率(瓦特) | HTS代码 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 功能 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 通道数量 | 界面 | 电路数量 | 最小电源电压 | 工作电源电流 | 端口的数量 | uPs/uCs/外围ICs类型 | 电源电流-最大值 | 电流源 | 逻辑功能 | 数据率 | 边界扫描 | 低功率模式 | 格式 | 通信IC类型 | D/A转换器数量 | 最小电源电压(DC) | 桶式移位器 | 电池供电 | 混合动力车 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
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 | LE9500CBJC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | PLCC | YES | 28-PLCC | 70°C | Tube | yes | Obsolete | 1 (Unlimited) | 28 | QUAD | J BEND | 3.3V | S-PQCC-J28 | Subscriber Line Interface Concept (SLIC) | 不合格 | 3.3V | COMMERCIAL | Parallel | 1 | 4.7mA | 4.572mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | LE9500CBJCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | PLCC | YES | 28-PLCC | 70°C | Tape & Reel (TR) | yes | Obsolete | 1 (Unlimited) | 28 | QUAD | J BEND | 3.3V | S-PQCC-J28 | Subscriber Line Interface Concept (SLIC) | 不合格 | 3.3V | COMMERCIAL | Parallel | 1 | 4.7mA | 4.572mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | LE9672WQC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 56-VFQFN Exposed Pad | 56-QFN (8x8) | -40°C~85°C | Tray | miSLIC™ | 活跃 | 3 (168 Hours) | 3.135V~3.465V | Subscriber Line Interface Concept (SLIC) | 3.3V | 4-Wire | 2 | 3.135V | 25mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | VSC8484XJP | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | -40°C | YES | 105°C | Obsolete | 4 (72 Hours) | 324 | BOTTOM | BALL | 1 | 1.2V | 1mm | compliant | S-PBGA-B324 | INDUSTRIAL | 电信电路 | 2.74mm | 18.6mm | 18.6mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE9502BTC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 44-TQFP Exposed Pad | -40°C~85°C | Tray | 2002 | e3 | Obsolete | 3 (168 Hours) | 44 | 哑光锡 | QUAD | 鸥翼 | 3.3V | 0.8mm | S-PQFP-G44 | Subscriber Line Interface Concept (SLIC) | 不合格 | 3.3V | 2-Wire | 1 | 7.5mA | CONSTANT CURRENT | 2-4 CONVERSION | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | LE9500DBJC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | PLCC | YES | 28-PLCC | 70°C | Tube | yes | Obsolete | 1 (Unlimited) | 28 | QUAD | J BEND | 3.3V | S-PQCC-J28 | Subscriber Line Interface Concept (SLIC) | 不合格 | 3.3V | COMMERCIAL | Parallel | 1 | 4.7mA | 4.572mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| LE79232BTCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tape & Reel (TR) | 2010 | Obsolete | 3 (168 Hours) | 8542.39.00.01 | 2-Wire | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ZL50061GAG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 272-BBGA | 272 | -40°C~85°C | Tray | e1 | yes | Obsolete | 3 (168 Hours) | 272 | 锡银铜 | 1.71V~1.89V | BOTTOM | BALL | 1.8V | ZL50061 | Switch | 1 | 240mA | 32 | 2.54mm | 27mm | 27mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | MT8920BP1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 1.182714g | -40°C~85°C | Tube | 2006 | e3 | yes | Obsolete | 3 (168 Hours) | 28 | 哑光锡 | 4.75V~5.25V | QUAD | J BEND | 260 | 5V | 30 | Telecom Circuit | 5V | Parallel | 1 | 10μA | 4.57mm | 12.57mm | 12.57mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | MT88L85AN1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 24-SSOP (0.209, 5.30mm Width) | 24 | 220.105698mg | -40°C~85°C | Tube | 2002 | e3 | yes | Obsolete | 3 (168 Hours) | 24 | TIN | 1W | 2.7V~3.6V | DUAL | 鸥翼 | 3V | 0.65mm | 3.58MHz | DTMF 收发器 | 3V | 1 | 3.1mA | 收发器 | DTMF信号电路 | 2mm | 8.2mm | 5.3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
| LE87611NQC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | -40°C | 表面贴装 | YES | 16-QFN | 85°C | Tray | 活跃 | 3 (168 Hours) | 16 | QUAD | 无铅 | 12V | 0.65mm | unknown | 线路驱动器 | INDUSTRIAL | 1 | SLIC | 4mm | 4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | MT8889CE1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 通孔 | 通孔 | 20-DIP (0.300, 7.62mm) | 20 | 2.259996g | -40°C~85°C | Tube | 2001 | e3 | yes | Obsolete | 1 (Unlimited) | 20 | 哑光锡 | 1W | 4.75V~5.25V | DUAL | 5V | 2.54mm | 3.58MHz | DTMF 收发器 | 5V | 5V | 1 | 7mA | 收发器 | DTMF信号电路 | 5.33mm | 25.905mm | 7.62mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
| ZL79128GDG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | -40°C | YES | 85°C | 2011 | Voice Edge™ | 活跃 | 1 (Unlimited) | 144 | BOTTOM | BALL | 1.8V | CODEC | INDUSTRIAL | 2-Wire | 1 | DIGITAL SIGNAL PROCESSOR, OTHER | NO | YES | 固定点 | NO | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| PM5329-FEI | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | FCBGA | YES | 活跃 | 3 (168 Hours) | 672 | BOTTOM | BALL | 1 | 1.2V | S-PBGA-B672 | 2.488 Gbps | ATM/SONET/SDH SUPPORT CIRCUIT | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PM5326H-FI | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 表面贴装 | 1292-FCBGA | Tray | 1997 | Obsolete | 1 (Unlimited) | 1.2V | SONET/SDH | SFI-4 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT88L89AS1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 20 | 800.987426mg | -40°C~85°C | Tube | e3 | yes | Obsolete | 3 (168 Hours) | 20 | 哑光锡 | 1W | 2.7V~3.6V | DUAL | 鸥翼 | 260 | 3V | 3.58MHz | 30 | DTMF 收发器 | 3V | 1 | 3.1mA | 收发器 | DTMF信号电路 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
| LE9661WQCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 56-VFQFN Exposed Pad | 56-QFN (8x8) | -40°C~85°C | Tape & Reel (TR) | miSLIC™ | 活跃 | 3 (168 Hours) | 3.135V~3.465V | Subscriber Line Interface Concept (SLIC) | 3.3V | 4-Wire | 1 | 25mA | 3.135V | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC7449YIH-01 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 672-FCBGA (27x27) | -40°C~110°C | Tray | SparX™-IV-90 | Discontinued | 4 (72 Hours) | 以太网交换机 | PCI | 1 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT88E46ASR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 20 | -40°C~85°C | Tape & Reel (TR) | e3 | yes | Obsolete | 3 (168 Hours) | 20 | 哑光锡 | 2.7V~5.5V | DUAL | 鸥翼 | 3V | 3.58MHz | Telecom Circuit | 3/5V | 3-Wire | 1 | 4.3mA | 8mA | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
| PM5370-FEI | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | YES | 672-FCBGA (27x27) | 2008 | 活跃 | 4 (72 Hours) | 672 | 1.2V | BOTTOM | BALL | 1.2V | S-PBGA-B672 | SONET/SDH | Serial | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ZL49020DAA1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 8-DIP (0.300, 7.62mm) | NO | -40°C~85°C | Tube | e3 | Obsolete | 1 (Unlimited) | 8 | 哑光锡 | 500mW | 4.75V~5.25V | DUAL | 5V | 2.54mm | 3.579MHz | R-PDIP-T8 | DTMF接收器 | 5V | 5V | 1 | 3mA | DTMF信号电路 | 5.33mm | 9.59mm | 7.62mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| LE9661WQC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 56-VFQFN Exposed Pad | 56-QFN (8x8) | -40°C~85°C | Tray | miSLIC™ | 活跃 | 3 (168 Hours) | 3.135V~3.465V | Subscriber Line Interface Concept (SLIC) | 3.3V | 4-Wire | 1 | 25mA | 3.135V | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ZL38001DGE1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 36-BSOP (0.295, 7.50mm Width) | 36 | 723.394782mg | -40°C~85°C | Tray | 2010 | e3 | yes | Obsolete | 3 (168 Hours) | 36 | 哑光锡 | 90mW | 2.7V~3.6V | DUAL | 鸥翼 | 260 | 3.3V | 0.8mm | 20MHz | 30 | Telecom Circuit | 3.3V | 2 | Serial | 1 | 20mA | ISDN回音消除器 | 7.5mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
| PM7382-PGI | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 不用于新设计 | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT8963AE1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 通孔 | 通孔 | 20-DIP (0.300, 7.62mm) | 20 | 0°C~70°C | Tube | 2008 | e3 | yes | Obsolete | 1 (Unlimited) | 20 | 哑光锡 | 4.75V~5.25V | DUAL | 260 | 30 | PCM 编解码器 | 5V | PCM | 3mA | 1 | 无 | ROHS3 Compliant |