制造商是'Microchip'
Microchip 接口 - 电信
(986)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 功能 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 界面 | 电路数量 | 工作电源电流 | 电源电流 | 电源电流-最大值 | 电流源 | 逻辑功能 | 数据率 | 通信IC类型 | 收发器数量 | 发射器数量 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | VSC7429XJG-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 672-BGA | YES | 672 | Caracal™-2 | 活跃 | 4 (72 Hours) | 672 | 125°C | -40°C | BOTTOM | BALL | 1 | 1V | 1mm | AUTOMOTIVE | 以太网收发器 | 2.44mm | 27mm | 27mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
 | MT8870DSR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 18-SOIC (0.295, 7.50mm Width) | 18 | -40°C~85°C | Tape & Reel (TR) | 2006 | e3 | yes | 活跃 | 3 (168 Hours) | 18 | Matte Tin (Sn) | 500mW | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 3.58MHz | 30 | DTMF接收器 | 5V | 5V | 1 | 3mA | 3mA | Receiver | DTMF信号电路 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||
 | VSC8504XKS-05 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 256-BGA | 256-PBGA (17x17) | Tray | 活跃 | 4 (72 Hours) | 1V | Ethernet | 1 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC8512XJG-03 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 672-BGA | 672-HSBGA (27x27) | Tray | 活跃 | 4 (72 Hours) | 125°C | -40°C | 1V | Ethernet | 1 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8514XMK-11 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | QFN | YES | 138-QFN (12x12) | 125°C | Tray | 活跃 | 3 (168 Hours) | 138 | BOTTOM | 无铅 | 1 | 1V | S-PBCC-N138 | OTHER | 以太网收发器 | 0.85mm | 12mm | 12mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
| VSC7428XJG-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 672-BGA | YES | 2010 | Caracal™-1 | 活跃 | 4 (72 Hours) | 672 | 125°C | -40°C | BOTTOM | BALL | 1 | 1V | 1mm | unknown | S-PBGA-B672 | AUTOMOTIVE | 以太网收发器 | 2.44mm | 27mm | 27mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
| VSC8514XMK-14 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 表面贴装 | QFN | 138-QFN (12x12) | Tray | 活跃 | 3 (168 Hours) | 125°C | -40°C | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ZL50232QCG1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-LQFP | 100 | -40°C~85°C | Tray | e3 | yes | 活跃 | 3 (168 Hours) | 100 | 哑光锡 | 1.6V~2V | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 30 | 回声消除 | 1 | 10mA | ISDN回音消除器 | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
| VSC7425XJG-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 672-BGA | YES | Tray | 2011 | SparX™-III-18 | 活跃 | 4 (72 Hours) | 672 | 1V | BOTTOM | BALL | 1V | S-PBGA-B672 | 以太网交换机 | OTHER | Serial | 1 | 1 Gbps | 电信电路 | 2.44mm | 27mm | 27mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||
| MT8870DS1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 18-SOIC (0.295, 7.50mm Width) | 18 | -40°C~85°C | Tube | e3 | yes | 活跃 | 3 (168 Hours) | 18 | 哑光锡 | 500mW | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 3.58MHz | 30 | DTMF接收器 | 5V | 5V | 1 | 3mA | 3mA | Receiver | DTMF信号电路 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||
 | MT9172AP1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | -40°C~85°C | Tube | e3 | 活跃 | 3 (168 Hours) | 28 | 哑光锡 | 4.75V~5.25V | QUAD | J BEND | 5V | Subscriber Line Interface Concept (SLIC) | 5V | 1 | 10mA | 160 kbps | 数码单反 | 4.57mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
 | VSC8512XJG-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 672-BGA | 672-HSBGA (27x27) | Tray | 活跃 | 4 (72 Hours) | 125°C | 0°C | 1V | Ethernet | 1 | 1 Gbps | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8479YYY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 244-BBGA, FCBGA | YES | Industrial grade | -5°C~90°C | Tray | 活跃 | 4 (72 Hours) | 1.8V | BOTTOM | BALL | 1.8V | S-PBGA-B244 | 收发器 | I2C, SPI | 1 | 11.3 Gbps | 16 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | VSC8664XIC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | BGA | 256-BGA (17x17) | Tray | 活跃 | 3 (168 Hours) | 90°C | 0°C | Ethernet | 1 | 1.25 Gbps | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | MT88L70ANR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 20-SSOP (0.209, 5.30mm Width) | 20 | 453.59237mg | -40°C~85°C | Tape & Reel (TR) | 2006 | e3 | yes | 活跃 | 3 (168 Hours) | 20 | 哑光锡 | 500mW | 2.7V~3.6V | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 3.58MHz | 30 | DTMF接收器 | 3V | 3V | 1 | 2mA | 5.5mA | Receiver | DTMF信号电路 | 2mm | 7.2mm | 5.3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||
 | VSC8662XIC-03 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-BGA | YES | Tray | 活跃 | 3 (168 Hours) | 256 | 100°C | -40°C | BOTTOM | BALL | 1.2V | S-PBGA-B256 | Ethernet | INDUSTRIAL | 1 | 1.25 Gbps | 2 | 2mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
.png) | ZL50110GAG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 552-BGA | 552 | -40°C~85°C | Tray | 2009 | yes | 活跃 | 3 (168 Hours) | 552 | 1.65V~1.95V | BOTTOM | BALL | 1.8V | ZL50110 | Telecom Circuit | 1.8V | TDM | 1 | 950mA | 1 Gbps | 2.53mm | 35mm | 35mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
 | MT8888CSR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | YES | -40°C~85°C | Tape & Reel (TR) | e3 | yes | 活跃 | 3 (168 Hours) | 20 | EAR99 | 哑光锡 | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 30 | R-PDSO-G20 | DTMF 收发器 | 不合格 | 5V | 1 | 7mA | DTMF信号电路 | 2.65mm | 7.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
 | ZL50114GAG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 552-BGA | 552 | -40°C~85°C | Tray | 2009 | e1 | 活跃 | 3 (168 Hours) | 552 | 锡银铜 | 1.65V~1.95V | BOTTOM | BALL | 1.8V | ZL50114 | Telecom Circuit | 1.8V | TDM | 1 | 950mA | 1 Gbps | 2.53mm | 35mm | 35mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
| VSC7423XJG-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | -40°C | IN PRODUCTION (Last Updated: 1 month ago) | 672-BGA | YES | 125°C | Caracal™ Lite | 活跃 | 4 (72 Hours) | 672 | BOTTOM | BALL | 1 | 1V | 1mm | S-PBGA-B672 | AUTOMOTIVE | 以太网收发器 | 2.36mm | 27mm | 27mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
| MT88L70AS1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 18-SOIC (0.295, 7.50mm Width) | 18 | -40°C~85°C | Tube | e3 | yes | 活跃 | 3 (168 Hours) | 18 | 哑光锡 | 500mW | 2.7V~3.6V | DUAL | 鸥翼 | 260 | 3V | 3.58MHz | 30 | DTMF接收器 | 3V | 3V | 1 | 2mA | Receiver | DTMF信号电路 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||
| VSC7424XJG-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 672-BGA | 672-HSBGA (27x27) | Tray | SparX™-III-10 | 活跃 | 4 (72 Hours) | 1V | 以太网交换机 | Serial | 1 | 1 Gbps | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | MT88E39ASR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | -40°C~85°C | Tape & Reel (TR) | 2006 | e3 | yes | 活跃 | 3 (168 Hours) | 16 | 哑光锡 | IT CAN ALSO OPERATE WITH 5V NOMINAL VOLTAGE | 2.7V~5.5V | DUAL | 鸥翼 | 260 | 3V | 30 | Telecom Circuit | 不合格 | 3-Wire | 1 | 1.9mA | 电话呼叫无识别电路 | 2.65mm | 7.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
 | MT9074AP1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 68-LCC (J-Lead) | 68 | -40°C~85°C | Tube | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 68 | 哑光锡 | 4.75V~5.25V | QUAD | J BEND | 260 | 5V | 30 | 收发器 | 5V | 1 | 200mA | FRAMER | 4.57mm | 24.23mm | 24.23mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
 | MT9171AP1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | PLCC | 28 | 28-PLCC | -40°C~85°C | Tube | e3 | 活跃 | 1 (Unlimited) | 28 | 哑光锡 | 4.75V~5.25V | QUAD | J BEND | 260 | 5V | 30 | Subscriber Line Interface Concept (SLIC) | 5V | 1 | 10mA | 160 kbps | 数码单反 | 4.57mm | 无 | ROHS3 Compliant | 无铅 |