N/A

-

Production (Last Updated: 2 months ago)

N

3000 LE

114 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

90

Fusion

0.014110 oz

Tray

AFS250

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

AFS250-1FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

AFS250

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

OTHER

1.575 V

1.425 V

4.5 kB

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

1.28205 GHz

1

6144

6144

250000

1.2 mm

17 mm

17 mm

无

N/A

-

N

213 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

250 MHz

有

1

Actel

Tray

A54SX72

活跃

2.75 V

QFF, TPAK256,3SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK256,3SQ,20

-55 °C

2.5 V

20

125 °C

无

A54SX72A-1CQ256B

250 MHz

QFF

SQUARE

活跃

MICROSEMI CORP

5.24

Military grade

表面贴装

CQFP-256

YES

256-CQFP (75x75)

256

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

A54SX72A

e0

3A001.A.2.C

锡铅

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F256

213

不合格

2.5 V

2.5,3.3/5 V

MILITARY

213

6036 CLBS, 108000 GATES

3.3 mm

现场可编程门阵列

108000

6036

MIL-STD-883 Class B

1.3 ns

6036

6036

108000

36 mm

36 mm

N/A

-

174 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

313 MHz

有

24

Actel

2.75 V

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

40

70 °C

有

A54SX32A-2PQG208

313 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.25

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

Details

0°C ~ 70°C (TA)

Tray

A54SX32A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

174

2880 CLBS, 48000 GATES

4.1 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

317 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

763 MHz

有

60

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

40

85 °C

有

AX1000-1FGG484I

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 85°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

763 MHz

S-PBGA-B484

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

20.3 kB

850 ps

850 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

12096

1

12096

0.84 ns

12096

18144

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

N

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

AFS1500

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

1.28205 GHz

1

38400

1.2 mm

17 mm

17 mm

无

含铅

N/A

-

Details

113 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

278 MHz

有

60

Actel

0.046530 oz

2.75 V

Tray

A54SX32

活跃

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-55 °C

2.5 V

40

125 °C

有

A54SX32A-1TQG144M

278 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TC)

Tray

A54SX32A

e3

3A001.A.2.C

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5 V

2.5,3.3/5 V

MILITARY

113

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.4 mm

20 mm

20 mm

N/A

-

360 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

294 MHz

有

40

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

表面贴装

FBGA

484-FPBGA (27X27)

微芯片技术

Details

-40°C ~ 85°C (TA)

Tray

A54SX72A

2.25V ~ 5.25V

2.5 V

108000

6036

1.73 mm

23 mm

23 mm

N/A

-

203 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

278 MHz

有

90

Actel

0.014110 oz

2.75 V

Tray

A54SX32

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

2.5 V

30

85 °C

无

A54SX32A-1FG256I

278 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

N

-40°C ~ 85°C (TA)

Tray

A54SX32A

TIN LEAD/TIN LEAD SILVER

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

203

不合格

2.5 V

2.5,2.5/5 V

INDUSTRIAL

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.2 mm

17 mm

17 mm

N/A

-

Details

81 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

263 MHz

有

90

Actel

0.023175 oz

2.75 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-100

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

-55 °C

2.5 V

40

125 °C

有

A54SX16A-1TQG100M

263 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TC)

Tray

A54SX16A

e3

3A001.A.2.C

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

172

不合格

2.5 V

2.5,3.3/5 V

MILITARY

172

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

1.4 mm

14 mm

14 mm

N/A

-

66 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

90

36864 bit

ProASICPLUS

0.023175 oz

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA150

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

2.5 V

40

70 °C

有

APA150-TQG100

180 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

1.58

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

Details

0 to 70 °C

Tray

APA150

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

66

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

5 mA

66

150000 GATES

1.6 mm

现场可编程门阵列

36864

150000

STD

6144

150000

1.4 mm

14 mm

14 mm

N/A

-

171 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

250 MHz

有

24

Actel

2.75 V

Tray

A54SX72

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

40

70 °C

有

A54SX72A-1PQG208

250 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

Details

0°C ~ 70°C (TA)

Tray

A54SX72A

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

171

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

171

6036 CLBS, 108000 GATES

4.1 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

3.4 mm

28 mm

28 mm

N/A

-

203 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

313 MHz

有

90

Actel

0.014110 oz

2.75 V

Tray

A54SX32

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

2.5 V

30

85 °C

无

A54SX32A-2FG256I

313 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

N

-40°C ~ 85°C (TA)

Tray

A54SX32A

TIN LEAD/TIN LEAD SILVER

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

203

不合格

2.5 V

2.5,2.5/5 V

INDUSTRIAL

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

1.2 mm

17 mm

17 mm

N/A

-

Details

154 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

24

ProASIC3

1.5000 V

1.425 V

1.575 V

Tray

M7A3P1000

活跃

1.575 V

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

M7A3P1000

85 °C

-40 °C

1.425V ~ 1.575V

231 MHz

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

231 MHz

STD

24576

3.4 mm

28 mm

28 mm

无

N/A

-

71 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

90

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P125-1VQG100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.23

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

Details

0 to 70 °C

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

1

3072

125000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 1 month ago)

176 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

有

24

Actel

5.5 V

Tray

A42MX24

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX24-1PQG208I

105.57 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.29

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

Details

-40°C ~ 85°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

250 MHz

912

1

1410

2.1 ns

1890

36000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 1 month ago)

Details

356 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

24

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA600

活跃

Copper, Silver, Tin

表面贴装

表面贴装

BGA-456

456

456-PBGA (35x35)

微芯片技术

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

APA600

70 °C

0 °C

2.3V ~ 2.7V

180 MHz

456

2.5 V

2.7 V

2.3 V

15.8 kB

129024

600000

180 MHz

STD

21504

1.73 mm

35 mm

35 mm

无

N/A

-

1800 LE

81 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

有

2880 LAB

90

Actel

0.023175 oz

5.25 V

Tray

A54SX32

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

-40 °C

2.5 V

40

85 °C

有

A54SX32A-2TQG100I

313 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

Details

-40°C ~ 85°C (TA)

Tray

A54SX32A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.25 V to 5.25 V

2.5,2.5/5 V

INDUSTRIAL

-

81

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

-

0.9 ns

2880

2880

48000

1.4 mm

14 mm

14 mm

N/A

-

113 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

294 MHz

有

60

Actel

0.046530 oz

2.75 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-40 °C

2.5 V

40

85 °C

有

A54SX16A-2TQG144I

294 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

微芯片技术

Details

-40°C ~ 85°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

113

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1 ns

1452

1452

24000

1.4 mm

20 mm

20 mm

N/A

-

Details

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

160

ProASIC3

0.014110 oz

Tray

M7A3P1000

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M7A3P1000-FGG144I

350 MHz

LBGA

SQUARE

不推荐

MICROSEMI CORP

5.25

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

231 MHz

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

231 MHz

STD

24576

24576

1000000

1.05 mm

13 mm

13 mm

无

N/A

-

113 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

263 MHz

有

60

Actel

0.046530 oz

2.75 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

40

70 °C

有

A54SX16A-1TQG144

263 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

微芯片技术

Details

0°C ~ 70°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

113

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

1.4 mm

20 mm

20 mm

N/A

-

Details

138 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

763 MHz

有

90

Actel

0.014110 oz

1.575 V

Tray

AX250

活跃

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 70°C (TA)

Tray

AX250

1.425V ~ 1.575V

1.5 V

55296

250000

4224

1.2 mm

17 mm

17 mm

N/A

-

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P125-1FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

Details

-40 to 85 °C

Tray

A3P125

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

36864

125000

1

3072

125000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

3000 LE

114 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS250

活跃

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

AFS250

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

4.5 kB

36864

250000

1.47059 GHz

2

6144

1.2 mm

17 mm

17 mm

无

N/A

-

Details

113 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

240 MHz

有

60

Actel

0.046530 oz

3.6 V

Tray

A54SX32

活跃

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-55 °C

3.3 V

40

125 °C

有

A54SX32-TQG144M

240 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TC)

Tray

A54SX32

e3

3A001.A.2.C

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

3.3 V, 5 V

3.3,5 V

MILITARY

113

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

32000

1.4 mm

20 mm

20 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

178 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

A3P400

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P400-1FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

6.8 kB

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

272 MHz

1

9216

9216

400000

1.2 mm

17 mm

17 mm

无