制造商是'Microchip'
Microchip 嵌入式 - FPGA（现场可编程门阵列）
(5152)
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.png) | APA300-PQ208M | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | APA300 | Obsolete | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 微芯片技术 | 158 | -55°C ~ 125°C (TC) | ProASICPLUS | 2.3V ~ 2.7V | 73728 | 300000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APA450-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | APA450 | Obsolete | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 微芯片技术 | 158 | 0°C ~ 70°C (TA) | ProASICPLUS | 2.3V ~ 2.7V | 110592 | 450000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AX1000-1LG624M | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | Non-Compliant | Tray | AX1000 | 活跃 | 表面贴装 | 表面贴装 | 624-BCLGA | 624 | 624-CLGA (32.5x32.5) | 微芯片技术 | 418 | -55°C ~ 125°C (TA) | Axcelerator | 125 °C | -55 °C | 1.425V ~ 1.575V | 20.3 kB | 12096 | 165888 | 1e+06 | 350 MHz | 18144 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX16-TQ176 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP176,1.0SQ,20 | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX16-TQ176 | 94 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | YES | 176 | LFQFP, QFP176,1.0SQ,20 | e0 | 锡铅 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 176 | S-PQFP-G176 | 140 | 不合格 | 3.3,3.3/5,5 V | COMMERCIAL | 140 | 1232 CLBS, 24000 GATES | 1.6 mm | 现场可编程门阵列 | 2.8 ns | 1232 | 1232 | 24000 | 24 mm | 24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A54SX72A-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | A54SX72A | Obsolete | PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 2.5 V | 30 | 2.25 V | 85 °C | 无 | A54SX72A-2PQ208I | 294 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.27 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 171 | -40°C ~ 85°C (TA) | SX-A | e0 | Tin/Lead (Sn/Pb) | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G208 | 171 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 171 | 6036 CLBS, 108000 GATES | 4.1 mm | 现场可编程门阵列 | 108000 | 6036 | 1.1 ns | 6036 | 6036 | 108000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A54SX72A-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | A54SX72A | Obsolete | PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 2.5 V | 30 | 2.25 V | 85 °C | 无 | A54SX72A-1PQ208I | 250 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.25 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 171 | -40°C ~ 85°C (TA) | SX-A | e0 | Tin/Lead (Sn/Pb) | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G208 | 171 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 171 | 6036 CLBS, 108000 GATES | 4.1 mm | 现场可编程门阵列 | 108000 | 6036 | 1.3 ns | 6036 | 6036 | 108000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A54SX32A-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | A54SX32A | Obsolete | PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 2.5 V | 30 | 2.25 V | 85 °C | 无 | A54SX32A-1PQ208I | 278 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.23 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 174 | -40°C ~ 85°C (TA) | SX-A | e0 | Tin/Lead (Sn/Pb) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G208 | 174 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 174 | 2880 CLBS, 48000 GATES | 4.1 mm | 现场可编程门阵列 | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A54SX16A-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | A54SX16A | Obsolete | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 微芯片技术 | 175 | -40°C ~ 85°C (TA) | SX-A | 2.25V ~ 5.25V | 24000 | 1452 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX36-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete (Last Updated: 2 months ago) | Compliant | Tray | A42MX36 | Obsolete | PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX36-2PQ208I | 91 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.24 | QFP | Lead, Tin | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | 176 | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | 5 V | INDUSTRIAL | 170 nH | 5.5 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 4.1 mm | 现场可编程门阵列 | 1184 | 20 | 2560 | 61 A | 54000 | 164 MHz | 1184 | 2 | 1822 | 2.1 ns | 2438 | 54000 | 10.4 | 8 mm | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||
| A54SX32-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Compliant | PLASTIC, MO-143, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A54SX32-PQ208I | 240 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 7.76 | 表面贴装 | YES | 208 | 208 | 174 | e0 | 3A991.D | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 2 uF | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | 240 MHz | S-PQFP-G208 | 不合格 | 5 V | INDUSTRIAL | 5.5 V | 4.5 V | 900 ps | 900 ps | 2880 CLBS, 32000 GATES | 4.1 mm | 现场可编程门阵列 | 2880 | 48000 | 240 MHz | 2880 | 1080 | 0.9 ns | 2880 | 2880 | 32000 | 1.6 | 1.6 x 0.8 x 0.63 | 3.4 mm | 28 mm | 28 mm | 无 | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX16-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | A42MX16 | Obsolete | PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX16-PQ208I | 94 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 7.88 | QFP | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 140 | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | INDUSTRIAL | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.8 ns | 1232 | 1232 | 24000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX24-PQ160I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete (Last Updated: 2 months ago) | Compliant | Tray | A42MX24 | Obsolete | PLASTIC, QFP-160 | FLATPACK | 3 | PLASTIC/EPOXY | QFP160,1.2SQ | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX24-PQ160I | 91.8 MHz | QFP | SQUARE | Actel Corporation | Transferred | ACTEL CORP | 3.6 V | 5.84 | 表面贴装 | 表面贴装 | 160-BQFP | YES | 160 | 160-PQFP (28x28) | 5.566797 g | 160 | 微芯片技术 | 125 | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | ALSO OPERATE AT 5.0V SUPPLY | 现场可编程门阵列 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | S-PQFP-G160 | 125 | 不合格 | 5 V | 3.3,3.3/5,5 V | INDUSTRIAL | 5.5 V | 3 V | 125 | 912 CLBS, 36000 GATES | 4.1 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 1410 | 2.5 ns | 912 | 1866 | 36000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||
| M1AGL600V5-FG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete (Last Updated: 2 months ago) | Siemens Building Technologies | 235 | Non-Compliant | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 100 °C | 无 | 108 MHz | BGA | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 5.86 | 表面贴装 | YES | 400.011771 mg | 484 | 283-05970 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | 现场可编程门阵列 | 13824 | 600000 | 13824 | 600000 | Flanged | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A54SX08A-TQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | A54SX08A | Obsolete | 表面贴装 | 100-LQFP | 100-TQFP (14x14) | 微芯片技术 | 81 | 0°C ~ 70°C (TA) | SX-A | 2.25V ~ 5.25V | 12000 | 768 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3PN030-Z1QNG48I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | A3PN030 | Obsolete | 表面贴装 | 48-VFQFN Exposed Pad | 48-QFN (6x6) | 微芯片技术 | 34 | -40°C ~ 100°C (TJ) | ProASIC3 nano | 1.425V ~ 1.575V | 30000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APA1000-FG1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | Compliant | Tray | APA1000 | 活跃 | BGA, BGA1152,34X34,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 2.5 V | 20 | 2.3 V | 85 °C | 无 | APA1000-FG1152I | 180 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 5.26 | 表面贴装 | 表面贴装 | 1152-BGA | YES | 1152 | 1152-FPBGA (35x35) | 400.011771 mg | 1152 | 微芯片技术 | 712 | -40°C ~ 85°C (TA) | ProASICPLUS | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | 180 MHz | S-PBGA-B1152 | 712 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 2.7 V | 2.3 V | 24.8 kB | 712 | 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 202752 | 1e+06 | 180 MHz | 56320 | 56320 | 1000000 | 1.73 mm | 35 mm | 35 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||
| A42MX16-1TQ176I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | QFP | LFQFP, QFP176,1.0SQ,20 | 5.23 | 108 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | QFP176,1.0SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 3.6 V | 3.3 V | 30 | 3 V | YES | 176 | A42MX16-1TQ176I | e0 | 锡铅 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 176 | S-PQFP-G176 | 140 | 不合格 | 3.3,3.3/5,5 V | INDUSTRIAL | 140 | 1232 CLBS, 24000 GATES | 1.6 mm | 现场可编程门阵列 | 2.4 ns | 1232 | 1232 | 24000 | 24 mm | 24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX24-2TQ176I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | QFP | 1.40 MM HEIGHT, PLASTIC, TQFP-176 | 5.25 | 114.75 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | QFP176,1.0SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 3.6 V | 3.3 V | 30 | 3 V | YES | 176 | A42MX24-2TQ176I | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | 176 | S-PQFP-G176 | 150 | 不合格 | 3.3,3.3/5,5 V | INDUSTRIAL | 150 | 1890 CLBS, 36000 GATES | 1.6 mm | 现场可编程门阵列 | 1.8 ns | 1890 | 1866 | 36000 | 24 mm | 24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A54SX08A-2PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | FQFP, QFP208,1.2SQ,20 | 5.31 | 313 MHz | 3 | 70 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 2.75 V | 2.5 V | 30 | 2.25 V | YES | 208 | A54SX08A-2PQ208 | e0 | Tin/Lead (Sn/Pb) | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 130 | 不合格 | 2.5,3.3/5 V | COMMERCIAL | 130 | 768 CLBS, 12000 GATES | 4.1 mm | 现场可编程门阵列 | 0.9 ns | 768 | 768 | 12000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A54SX32-1TQG176 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | MICROSEMI CORP | LFQFP, | 5.59 | 280 MHz | 3 | 70 °C | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 3.6 V | 3 V | 3.3 V | 40 | YES | 176 | A54SX32-1TQG176 | e3 | 哑光锡 | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 不合格 | COMMERCIAL | 2880 CLBS, 32000 GATES | 1.6 mm | 现场可编程门阵列 | 0.8 ns | 2880 | 32000 | 24 mm | 24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGL015V5-QNG68I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | MICROSEMI CORP | HVQCCN, | 5.31 | 100 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.575 V | 1.5 V | 未说明 | 1.425 V | YES | 68 | AGL015V5-QNG68I | 8542.39.00.01 | QUAD | 无铅 | 未说明 | 0.4 mm | compliant | S-XQCC-N68 | 不合格 | INDUSTRIAL | 384 CLBS, 15000 GATES | 1 mm | 现场可编程门阵列 | 384 | 15000 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A54SX32A-TQ144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | 1.40 MM, TQFP-144 | 5.18 | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 2.75 V | 2.5 V | 30 | SX-A | 85C | INDUSTRIALC | TQFP | 48000 | -40C to 85C | 113 | 32000 | 2880 | 0.25um | 2.75(V) | 2.5(V) | 无 | 2.25(V) | -40C | 有 | 1800 | 1980 | 表面贴装 | 113 | Tray | A54SX32A | Obsolete | 2.25 V | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | A54SX32A-TQ144I | -40°C ~ 85°C (TA) | Tray | SX-A | e0 | Tin/Lead (Sn/Pb) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 2.25V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | 238(MHz) | 144 | S-PQFP-G144 | 不合格 | INDUSTRIAL | 2880 CLBS, 48000 GATES | 1.6 mm | 现场可编程门阵列 | 48000 | 2880 | 1.2 ns | 2880 | 48000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||
| A42MX24-2PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete (Last Updated: 1 month ago) | 无 | Obsolete | MICROSEMI CORP | QFP | FQFP, | 5.25 | 105 MHz | 3 | 70 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 3.6 V | 3.3 V | 30 | 176 | Compliant | Tray | A42MX24 | Obsolete | 3 V | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | A42MX24-2PQ208 | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | 5 V | COMMERCIAL | 5.25 V | 3 V | 1890 CLBS, 36000 GATES | 4.1 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 2 | 1410 | 1.8 ns | 1890 | 36000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||
| A54SX32-1CQ256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | CERAMIC, QFP-256 | 5.24 | 240 MHz | 70 °C | CERAMIC, METAL-SEALED COFIRED | QFF | TPAK256,3SQ,20 | SQUARE | FLATPACK | 3.63 V | 3.3 V | 20 | 2.97 V | YES | 256 | A54SX32-1CQ256 | e0 | 锡铅 | 48000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F256 | 246 | 不合格 | 3.3,5 V | COMMERCIAL | 246 | 2880 CLBS, 32000 GATES | 3.06 mm | 现场可编程门阵列 | 0.9 ns | 2880 | 2880 | 32000 | 36 mm | 36 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX16-3PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete (Last Updated: 2 months ago) | 无 | Obsolete | MICROSEMI CORP | QFP | FQFP, | 5.24 | 129 MHz | 3 | 70 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 3.6 V | 3.3 V | 30 | 140 | Compliant | Tray | A42MX16 | Obsolete | 3 V | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | A42MX16-3PQ208 | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | 5 V | COMMERCIAL | 5.25 V | 3 V | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 608 | 24000 | 237 MHz | 608 | 3 | 928 | 1.9 ns | 1232 | 24000 | 3.4 mm | 28 mm | 28 mm | 无 |