制造商是'Microchip'
Microchip 嵌入式 - FPGA（现场可编程门阵列）
(5152)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 系列 | JESD-609代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | Reach合规守则 | 频率 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 传播延迟 | 接通延迟时间 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 高度 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png) | A40MX02-3VQ80I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | A40MX02 | Obsolete | TQFP, | FLATPACK, THIN PROFILE | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A40MX02-3VQ80I | 109 MHz | TQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.26 | QFP | 表面贴装 | 80-TQFP | YES | 80-VQFP (14x14) | 80 | 微芯片技术 | 57 | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 80 | S-PQFP-G80 | 不合格 | INDUSTRIAL | 295 CLBS, 3000 GATES | 1.2 mm | 现场可编程门阵列 | 3000 | 1.7 ns | 295 | 3000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||
| AGL125V2-FGG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | AGL125 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.2 V | 40 | 1.14 V | 85 °C | 有 | AGL125V2-FGG144 | 108 MHz | LBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.25 | 表面贴装 | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | 微芯片技术 | 97 | 0°C ~ 70°C (TA) | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 不合格 | OTHER | 3072 CLBS, 125000 GATES | 1.55 mm | 现场可编程门阵列 | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||
| A3P1000-PQ208M | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | A3P1000 | Obsolete | QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -55 °C | 1.5 V | 30 | 1.425 V | 125 °C | 无 | A3P1000-PQ208M | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.24 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 154 | -55°C ~ 125°C (TJ) | ProASIC3 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.5,1.5/3.3 V | MILITARY | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | 现场可编程门阵列 | 147456 | 1000000 | 24576 | 24576 | 1000000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||
| A42MX09-1PQ100M | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | A42MX09 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A42MX09-1PQ100M | 135 MHz | QFP | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | 表面贴装 | 100-BQFP | YES | 100-PQFP (20x14) | 100 | 微芯片技术 | 83 | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 100 | R-PQFP-G100 | 不合格 | MILITARY | 684 CLBS, 14000 GATES | 3.4 mm | 现场可编程门阵列 | 14000 | 2.1 ns | 684 | 14000 | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||
| M1A3P250-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | M1A3P250 | Obsolete | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 100 °C | 无 | M1A3P250-2PQ208I | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 151 | -40°C ~ 100°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | INDUSTRIAL | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 36864 | 250000 | 6144 | 250000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||
| APA300-PQ208A | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | APA300 | Obsolete | 表面贴装 | 208-BFQFP | 208-PQFP (28x28) | 微芯片技术 | 158 | -40°C ~ 125°C (TJ) | ProASICPLUS | 2.375V ~ 2.625V | 73728 | 300000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX09-1PQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | A42MX09 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX09-1PQ100 | 135 MHz | QFP | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | 表面贴装 | 100-BQFP | YES | 100-PQFP (20x14) | 100 | 微芯片技术 | 83 | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 100 | R-PQFP-G100 | 不合格 | COMMERCIAL | 684 CLBS, 14000 GATES | 3.4 mm | 现场可编程门阵列 | 14000 | 2.1 ns | 684 | 14000 | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||
| RT4G150-1LGG1657R | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 表面贴装 | 1657-BCLGA | 1657-CLGA (42.5x42.5) | 微芯片技术 | Bulk | -55°C ~ 125°C (TJ) | RTG4™ | 1.14V ~ 1.26V | 151824 | 5325 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL060TS-VFG784 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 56500 LE | + 85 C | 0 C | SMD/SMT | 表面贴装 | 784-FBGA | 784-VFBGA (23x23) | 微芯片技术 | 395 | 0°C ~ 85°C (TJ) | IGLOO2 | 1.14V ~ 1.26V | 56520 | 1869824 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX09-VQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | A42MX09 | Obsolete | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 未说明 | 3 V | 85 °C | 无 | A42MX09-VQ100I | 117 MHz | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.22 | QFP | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 83 | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | 100 | S-PQFP-G100 | 不合格 | INDUSTRIAL | 684 CLBS, 14000 GATES | 1.2 mm | 现场可编程门阵列 | 14000 | 2.5 ns | 684 | 14000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||
| RT4G150L-CQG352V | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 表面贴装 | 352-BFCQFP Exposed Pad | 352-QFP (48x48) | 微芯片技术 | Bulk | -55°C ~ 125°C (TJ) | RTG4™ | 1.14V ~ 1.26V | 151824 | 5325 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P125-2TQ144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | A3P125 | Obsolete | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 100 °C | 无 | A3P125-2TQ144I | 350 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.25 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | 100 | -40°C ~ 100°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G144 | 不合格 | INDUSTRIAL | 3072 CLBS, 125000 GATES | 1.6 mm | 现场可编程门阵列 | 36864 | 125000 | 3072 | 125000 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||
| M2GL060T-1VFG784 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | 56500 LE | + 100 C | - 40 C | 表面贴装 | 784-FBGA | 784-VFBGA (23x23) | 微芯片技术 | 395 | 0°C ~ 85°C (TJ) | IGLOO2 | 1.14V ~ 1.26V | 56520 | 1869824 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX16-PQ160A | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | A42MX16 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 5 V | 30 | 4.75 V | 125 °C | 无 | A42MX16-PQ160A | QFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.25 V | 5.53 | 表面贴装 | 160-BQFP | YES | 160-PQFP (28x28) | 160 | 微芯片技术 | 125 | -40°C ~ 125°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | AUTOMOTIVE | 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.4 ns | 24000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||
| A54SX08-1TQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Compliant | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A54SX08-1TQ144 | 280 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.31 | 表面贴装 | YES | 144 | 1.319103 g | 144 | 113 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 280 MHz | S-PQFP-G144 | 不合格 | 5 V | COMMERCIAL | 5.25 V | 4.75 V | 800 ps | 800 ps | 768 CLBS, 8000 GATES | 1.6 mm | 现场可编程门阵列 | 768 | 12000 | 280 MHz | 768 | 1 | 256 | 0.8 ns | 768 | 8000 | 1.4 mm | 20 mm | 20 mm | 无 | ||||||||||||||||||||||||||||
| AGL600V2-FG256T | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Non-Compliant | 3 | 20 | 无 | AGL600V2-FG256T | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.8 | 表面贴装 | 256 | 110592 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | 225 | unknown | 13.5 kB | 现场可编程门阵列 | 13824 | 600000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| RT4G150-CGG1657R | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 通孔 | 1657-BFCPGA | 1657-CCGA (42.5x42.5) | 微芯片技术 | Bulk | -55°C ~ 125°C (TJ) | RTG4™ | 1.14V ~ 1.26V | 151824 | 5325 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| RT4G150L-CBG1657PROTO | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Bulk | 活跃 | 表面贴装 | 1657-BCBGA | 1657-CBGA (42.5x42.5) | 微芯片技术 | 720 | -55°C ~ 125°C | RTG4™ | 1.2V | 151824 | 5200000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A54SX08-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Compliant | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A54SX08-1PQ208I | 280 MHz | FQFP | SQUARE | Microsemi Corporation | 5.31 | 3.6 V | MICROSEMI CORP | Obsolete | PLASTIC/EPOXY | 3 | FLATPACK, FINE PITCH | FQFP, | 表面贴装 | YES | 208 | 208 | 130 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 280 MHz | S-PQFP-G208 | 不合格 | 5 V | INDUSTRIAL | 5.5 V | 4.5 V | 800 ps | 800 ps | 768 CLBS, 8000 GATES | 4.1 mm | 现场可编程门阵列 | 768 | 12000 | 280 MHz | 768 | 1 | 256 | 0.8 ns | 768 | 8000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||
| M2GL010S-1TQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | Obsolete | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 1.2 V | 20 | 1.14 V | 85 °C | 无 | M2GL010S-1TQ144 | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.26 V | 5.57 | 表面贴装 | YES | 144 | 微芯片技术 | 84 | 0°C ~ 85°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | QUAD | 鸥翼 | 240 | 0.5 mm | compliant | S-PQFP-G144 | OTHER | 1.6 mm | 现场可编程门阵列 | 12084 | 933888 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| AGL600V2-FG144T | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Non-Compliant | 3 | 20 | 无 | AGL600V2-FG144T | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.25 | 144 | 97 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | 235 | unknown | 1.5 V | 13.5 kB | 现场可编程门阵列 | 13824 | 600000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A1020B-VQG80I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Compliant | 表面贴装 | 80 | 69 | 85 °C | -40 °C | 48 MHz | 5 V | 5.5 V | 4.5 V | 4.5 ns | 547 | 2000 | 547 | 273 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A42MX24-3PL84 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete (Last Updated: 2 months ago) | Compliant | Tray | A42MX24 | Obsolete | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX24-3PL84 | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.25 | LCC | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | YES | 84 | 84-PLCC (29.31x29.31) | 6.777889 g | 84 | 微芯片技术 | 72 | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 225 | 1.27 mm | compliant | 84 | S-PQCC-J84 | 不合格 | 5 V | COMMERCIAL | 5.25 V | 3 V | 1890 CLBS, 36000 GATES | 4.572 mm | 现场可编程门阵列 | 36000 | 3 | 1410 | 2 ns | 1890 | 36000 | 3.68 mm | 29.31 mm | 29.31 mm | 无 | ||||||||||||||||||||||
| A54SX08-2PL84 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Compliant | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A54SX08-2PL84 | 320 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.27 | 表面贴装 | YES | 84 | 6.777889 g | 84 | 69 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | J BEND | 225 | 1.27 mm | compliant | 320 MHz | S-PQCC-J84 | 不合格 | 5 V | COMMERCIAL | 5.25 V | 4.75 V | 700 ps | 700 ps | 768 CLBS, 8000 GATES | 4.572 mm | 现场可编程门阵列 | 768 | 12000 | 320 MHz | 768 | 2 | 256 | 0.7 ns | 768 | 8000 | 3.68 mm | 29.31 mm | 29.31 mm | 无 | ||||||||||||||||||||||||||||
| RT4G150L-CGG1657E | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 通孔 | 1657-BFCPGA | 1657-CCGA (42.5x42.5) | 微芯片技术 | Bulk | -55°C ~ 125°C (TJ) | RTG4™ | 1.14V ~ 1.26V | 151824 | 5325 |