N/A

-

FLATPACK

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

85 °C

有

M1AFS250-1PQG208I

QFF

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.82

YES

208

QFF,

e3

哑光锡

8542.39.00.01

CMOS

QUAD

FLAT

245

0.5 mm

compliant

R-PQFP-F208

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

6144

250000

30.6 mm

28 mm

N/A

-

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

40

1.14 V

85 °C

有

M1A3P1000L-FGG484I

350 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

YES

484

BGA, BGA484,22X22,40

e1

锡银铜

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

300

不合格

1.5/3.3 V

INDUSTRIAL

300

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

24576

1000000

23 mm

23 mm

N/A

-

Compliant

表面贴装

208

95

70 °C

0 °C

1.5 V

1.575 V

1.425 V

13.5 kB

600000

1.47059 GHz

2

13824

3.4 mm

28 mm

28 mm

无

N/A

-

Non-Compliant

N/A

-

Compliant

表面贴装

144

104

85 °C

-40 °C

90 MHz

5 V

5.5 V

4.5 V

5 ns

684

4000

684

568

无

N/A

-

Production (Last Updated: 2 months ago)

Tray

AX1000

活跃

Compliant

GQFF, TPAK352,2.9SQ,20

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

TPAK352,2.9SQ,20

-55 °C

1.5 V

20

1.425 V

125 °C

无

AX1000-1CQ352M

763 MHz

GQFF

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.29

Military grade

表面贴装

表面贴装

352-BFCQFP with Tie Bar

YES

352

352-CQFP (75x75)

10.567001 g

352

微芯片技术

198

-55°C ~ 125°C (TA)

Axcelerator

e0

3A001.A.2.C

锡铅

125 °C

-55 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F352

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

20.3 kB

850 ps

516

12096 CLBS, 1000000 GATES

2.89 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

MIL-STD-883 Class B

1

12096

0.84 ns

12096

18144

1000000

2.66 mm

48 mm

48 mm

无

N/A

-

Tray

A54SX32

Obsolete

1.40 MM HEIGHT, MO-136, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A54SX32-2TQ144I

320 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.25

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

113

-40°C ~ 85°C (TA)

SX

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G144

不合格

INDUSTRIAL

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

48000

2880

0.7 ns

2880

32000

20 mm

20 mm

N/A

-

Compliant

3

30

有

AGL250V2-FGG144T

Microsemi Corporation

活跃

MICROSEMI CORP

5.75

表面贴装

144

97

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

260

compliant

4.5 kB

现场可编程门阵列

6144

250000

N/A

-

Compliant

,

3

未说明

有

AGL250V2-VQG100T

Microsemi Corporation

活跃

MICROSEMI CORP

5.75

表面贴装

36864

e3

Tin (Sn)

70 °C

0 °C

8542.39.00.01

未说明

compliant

4.5 kB

现场可编程门阵列

6144

250000

N/A

-

活跃

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

Bulk

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

Compliant

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

有

M2GL010S-1FGG484I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.82

表面贴装

YES

484

233

100 °C

-40 °C

现场可编程门阵列

BOTTOM

BALL

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

114 kB

233

现场可编程门阵列

12084

12084

N/A

-

Production (Last Updated: 2 months ago)

Compliant

Tray

AX2000

活跃

通孔

通孔

624-BCCGA

624

624-CCGA (32.5x32.5)

微芯片技术

418

-55°C ~ 125°C (TA)

Axcelerator

125 °C

-55 °C

1.425V ~ 1.575V

763 MHz

1.5 V

1.575 V

1.425 V

36 kB

850 ps

850 ps

21504

294912

2e+06

763 MHz

32256

21504

1

21504

2.73 mm

32.5 mm

32.5 mm

无

N/A

-

Tray

A40MX02

Obsolete

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A40MX02-2PL44I

101 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.25

LCC

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

微芯片技术

34

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

44

S-PQCC-J44

不合格

INDUSTRIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2 ns

295

3000

16.5862 mm

16.5862 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

A3PE1500

Tray

147

Compliant

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

30

1.425 V

70 °C

无

A3PE1500-2PQ208

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.61

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

Obsolete

0°C ~ 85°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

33.8 kB

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

310 MHz

2

38400

38400

38400

1500000

3.4 mm

28 mm

28 mm

无

N/A

-

Compliant

表面贴装

80

69

70 °C

0 °C

48 MHz

5 V

5.25 V

4.75 V

4.5 ns

547

2000

547

273

无

N/A

-

Non-Compliant

FBGA, BGA400,20X20,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

无

M2GL010S-1VF400I

FBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.88

表面贴装

YES

400

400

195

100 °C

-40 °C

现场可编程门阵列

BOTTOM

BALL

0.8 mm

unknown

S-PBGA-B400

195

不合格

1.2 V

114 kB

195

现场可编程门阵列

12084

12084

N/A

-

Compliant

FQFP, QFP240,1.3SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP240,1.3SQ,20

-40 °C

3.3 V

30

3 V

85 °C

无

A42MX36-2PQ240I

91 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.73

QFP

表面贴装

YES

240

240

202

e0

锡铅

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

240

S-PQFP-G240

202

不合格

5 V

3.3,3.3/5,5 V

INDUSTRIAL

5.5 V

3 V

320 B

202

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

54000

164 MHz

1184

2

1822

2.1 ns

2438

2414

54000

3.4 mm

32 mm

32 mm

无

N/A

-

Compliant

70 °C

0 °C

5 V

2.3 ns

2

360

无

N/A

-

Compliant

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

3 V

70 °C

有

A54SX08-2VQG100

320 MHz

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.27

表面贴装

YES

100

100

81

e3

哑光锡

70 °C

0 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

320 MHz

S-PQFP-G100

不合格

5 V

COMMERCIAL

5.25 V

4.75 V

700 ps

700 ps

768 CLBS, 8000 GATES

1.2 mm

现场可编程门阵列

768

12000

320 MHz

768

2

256

0.7 ns

768

8000

1 mm

14 mm

14 mm

无

N/A

-

Compliant

FQFP, QFP240,1.3SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP240,1.3SQ,20

3.3 V

40

3 V

70 °C

有

A42MX36-2PQG240

91 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.81

表面贴装

YES

240

240

202

e3

哑光锡

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G240

202

不合格

5 V

3.3,3.3/5,5 V

COMMERCIAL

5.25 V

3 V

320 B

202

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

54000

164 MHz

1184

2

1822

2.1 ns

2438

2438

54000

3.4 mm

32 mm

32 mm

无

N/A

-

Tray

A42MX09

Obsolete

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

30

3 V

125 °C

无

A42MX09-1PL84M

135 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

LCC

表面贴装

84-LCC (J-Lead)

YES

84-PLCC (29.31x29.31)

84

微芯片技术

72

-55°C ~ 125°C (TC)

MX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

84

S-PQCC-J84

不合格

MILITARY

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

14000

2.1 ns

684

14000

29.3116 mm

29.3116 mm

N/A

-

Tray

A42MX09

Obsolete

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

30

70 °C

无

A42MX09-3VQ100

161 MHz

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.26

QFP

3.3 V

3 V

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

83

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

100

S-PQFP-G100

不合格

COMMERCIAL

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

1.6 ns

684

14000

14 mm

14 mm

N/A

-

Tray

A42MX16

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A42MX16-1PQ208I

108 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

QFP

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

140

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.5 mm

compliant

208

S-PQFP-G208

不合格

INDUSTRIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

28 mm

28 mm

N/A

-

Tray

A42MX16

Obsolete

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

5 V

30

4.75 V

125 °C

无

A42MX16-VQ100A

139 MHz

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.25 V

5.53

QFP

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

83

-40°C ~ 125°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 3V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.5 mm

compliant

100

S-PQFP-G100

不合格

AUTOMOTIVE

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

24000

2.2 ns

1232

24000

14 mm

14 mm

N/A

-

Tray

A40MX04

Obsolete

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A40MX04-3PQ100

109 MHz

QFP

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.24

QFP

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

微芯片技术

69

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.65 mm

compliant

100

R-PQFP-G100

不合格

COMMERCIAL

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

1.7 ns

547

6000

20 mm

14 mm