N/A

-

FLATPACK

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1AFS250-PQ208

QFF

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.88

YES

208

QFP-208

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

QUAD

FLAT

225

0.5 mm

compliant

R-PQFP-F208

不合格

OTHER

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

6144

250000

30.6 mm

28 mm

N/A

-

Tray

M1A3P400

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1A3P400-PQ208

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

151

0°C ~ 85°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

9216

400000

28 mm

28 mm

N/A

-

活跃

表面贴装

352-BFCQFP Exposed Pad

352-QFP (48x48)

微芯片技术

Bulk

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

Obsolete (Last Updated: 2 months ago)

Compliant

5.3

1.575 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

BGA

763 MHz

AX2000-1FGG1152

有

70 °C

1.425 V

40

1.5 V

BGA1152,34X34,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA1152,34X34,40

表面贴装

YES

1152

400.011771 mg

1152

684

e1

锡银铜

70 °C

0 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

245

1 mm

compliant

763 MHz

S-PBGA-B1152

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

36 kB

850 ps

850 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

2e+06

763 MHz

21504

1

21504

0.84 ns

21504

32256

2000000

1.73 mm

35 mm

35 mm

无

N/A

-

Compliant

FQFP, QFP240,1.3SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP240,1.3SQ,20

-55 °C

3.3 V

40

3 V

125 °C

有

A42MX36-1PQG240M

83 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.81

表面贴装

YES

240

240

202

e3

3A001.A.2.C

哑光锡

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G240

202

不合格

5 V

3.3,3.3/5,5 V

MILITARY

5.5 V

3 V

320 B

202

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

54000

151 MHz

1184

1

1822

2.3 ns

2438

2438

54000

3.4 mm

32 mm

32 mm

无

N/A

-

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

无

M2GL100TS-1FC1152I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.88

YES

1152

网格排列

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

99512

N/A

-

N/A

-

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

无

M2GL150S-1FC1152I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.88

YES

1152

网格排列

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

146124

N/A

-

N/A

-

Compliant

表面贴装

425

100 °C

-40 °C

323.3 kB

86316

N/A

-

N/A

-

3

有

M2S050S-1VFG400I

Microsemi Corporation

活跃

MICROSEMI CORP

5.76

,

compliant

现场可编程门阵列

N/A

-

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

未说明

1.14 V

无

M2S100-1FC1152I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.86

YES

1152

35 X 35 MM, 1 MM PITCH, FBGA-1152

e0

锡铅

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

99512

35 mm

35 mm

N/A

-

Non-Compliant

BGA, BGA1152,34X34,40

网格排列

PLASTIC

BGA1152,34X34,40

1.2 V

无

M2GL100-1FC1152

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.88

表面贴装

YES

1152

1152

574

85 °C

0 °C

现场可编程门阵列

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

1.2 V

1.26 V

1.14 V

444 kB

574

现场可编程门阵列

99512

99512

N/A

-

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

未说明

1.14 V

85 °C

有

M2S100-1FCG1152

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.8

YES

1152

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

99512

35 mm

35 mm

N/A

-

N/A

-

N/A

-

N/A

-

Compliant

70 °C

0 °C

5 V

2.3 ns

2

568

无

N/A

-

Tray

活跃

48000 LE

+ 100 C

1.03 V/1.08 V

- 40 C

970 mV/1.02 V

SMD/SMT

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

176

-40°C ~ 100°C (TJ)

-

0.97V ~ 1.08V

1 V, 1.05 V

3774874

48000

N/A

-

Tray

活跃

48000 LE

+ 125 C

1.08 V

- 40 C

970 mV

SMD/SMT

表面贴装

325-TFBGA

325-BGA (11x11)

微芯片技术

164

-40°C ~ 125°C (TJ)

-

0.97V ~ 1.08V

12.5 Gb/s

48000

3774874

4 Transceiver

N/A

-

N/A

-

活跃

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

Bulk

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

Obsolete (Last Updated: 2 months ago)

Compliant

1 MM PITCH, FBGA-1152

网格排列

3

PLASTIC/EPOXY

BGA1152,34X34,40

1.5 V

20

1.425 V

70 °C

无

AX2000-2FG1152

870 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.84

表面贴装

YES

1152

400.011771 mg

1152

684

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1 mm

unknown

870 MHz

S-PBGA-B1152

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

36 kB

740 ps

740 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

2e+06

870 MHz

21504

2

21504

0.74 ns

21504

32256

2000000

1.73 mm

35 mm

35 mm

无

N/A

-

活跃

表面贴装

352-BFCQFP Exposed Pad

352-QFP (48x48)

微芯片技术

Bulk

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325