制造商是'Microchip'
Microchip 嵌入式 - FPGA(现场可编程门阵列)
(5152)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 数据率 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 主要属性 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 闪光大小 | 产品类别 | 高度 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | A42MX16-PQ100M | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | QFP | PLASTIC, QFP-100 | 5.22 | 94 MHz | 3 | 125 °C | -55 °C | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | 3.6 V | 3.3 V | 30 | 83 | Tray | A42MX16 | Obsolete | 3 V | 表面贴装 | 100-BQFP | YES | 100-PQFP (20x14) | 100 | 微芯片技术 | A42MX16-PQ100M | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 100 | R-PQFP-G100 | 不合格 | MILITARY | 1232 CLBS, 24000 GATES | 3.4 mm | 现场可编程门阵列 | 24000 | 2.8 ns | 1232 | 24000 | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA1000-PQ208M | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete (Last Updated: 2 months ago) | 无 | Obsolete | MICROSEMI CORP | 0.50 MM PITCH, PLASTIC, QFP-208 | 5.28 | 180 MHz | 3 | 125 °C | -55 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 2.7 V | 2.5 V | 30 | 158 | Tray | APA1000 | Obsolete | Compliant | 2.3 V | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | APA1000-PQ208M | -55°C ~ 125°C (TC) | ProASICPLUS | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 8542.39.00.01 | 2.3V ~ 2.7V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G208 | 158 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 2.7 V | 2.3 V | 24.8 kB | 158 | 1000000 GATES | 4.1 mm | 现场可编程门阵列 | 202752 | 1000000 | 180 MHz | 56320 | 56320 | 1000000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||
![]() | A42MX16-1PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | QFP | FQFP, | 5.23 | 108 MHz | 3 | 70 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 3.6 V | 3.3 V | 30 | 140 | Tray | A42MX16 | Obsolete | 3 V | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | A42MX16-1PQ208 | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | COMMERCIAL | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.4 ns | 1232 | 24000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-1PQ160 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | QFP | QFP, | 5.23 | 135 MHz | 3 | 70 °C | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | 3.6 V | 3.3 V | 30 | 101 | Tray | A42MX09 | Obsolete | 3 V | 表面贴装 | 160-BQFP | YES | 160-PQFP (28x28) | 160 | 微芯片技术 | A42MX09-1PQ160 | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 160 | S-PQFP-G160 | 不合格 | COMMERCIAL | 684 CLBS, 14000 GATES | 4.1 mm | 现场可编程门阵列 | 14000 | 2.1 ns | 684 | 14000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16-PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 3.6 V | 3.3 V | 40 | 3 | 240 MHz | 7.57 | FQFP, | MICROSEMI CORP | Obsolete | 有 | A54SX16-PQG208 | 3 V | YES | 208 | 70 °C | e3 | 哑光锡 | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | COMMERCIAL | 1452 CLBS, 16000 GATES | 4.1 mm | 现场可编程门阵列 | 0.9 ns | 1452 | 16000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P125-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | FQFP, | 5.25 | 350 MHz | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.5 V | 30 | 133 | Tray | A3P125 | Obsolete | 1.425 V | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | A3P125-1PQ208I | -40°C ~ 100°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | INDUSTRIAL | 3072 CLBS, 125000 GATES | 4.1 mm | 现场可编程门阵列 | 36864 | 125000 | 3072 | 125000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32-1TQ176 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | 1.40 MM HEIGHT, MO-136, TQFP-176 | 5.61 | 280 MHz | 3 | 70 °C | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 3.6 V | 3.3 V | 30 | 3 V | YES | 176 | A54SX32-1TQ176 | e0 | 锡铅 | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G176 | 不合格 | COMMERCIAL | 2880 CLBS, 32000 GATES | 1.6 mm | 现场可编程门阵列 | 0.8 ns | 2880 | 32000 | 24 mm | 24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | QFP | FQFP, | 5.22 | 94 MHz | 3 | 70 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 3.6 V | 3 V | 3.3 V | 30 | 140 | Tray | A42MX16 | Obsolete | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | A42MX16-PQ208 | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | COMMERCIAL | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.8 ns | 1232 | 24000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-1PL44 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | LCC | QCCJ, | 5.23 | 92 MHz | 3 | 70 °C | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | 3.6 V | 3.3 V | 30 | 34 | Tray | A40MX02 | Obsolete | 3 V | 表面贴装 | 44-LCC (J-Lead) | YES | 44-PLCC (16.59x16.59) | 44 | 微芯片技术 | A40MX02-1PL44 | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 225 | 1.27 mm | compliant | 44 | S-PQCC-J44 | 不合格 | COMMERCIAL | 295 CLBS, 3000 GATES | 4.572 mm | 现场可编程门阵列 | 3000 | 2.3 ns | 295 | 3000 | 16.5862 mm | 16.5862 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS250-1PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | QFP-208 | 5.88 | 3 | 85 °C | PLASTIC/EPOXY | QFF | RECTANGULAR | FLATPACK | 1.575 V | 1.5 V | 30 | 93 | Compliant | 1.425 V | 表面贴装 | YES | 208 | 208 | AFS250-1PQ208 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | QUAD | FLAT | 225 | 0.5 mm | unknown | R-PQFP-F208 | 不合格 | 1.5 V | OTHER | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 250000 | 1.28205 GHz | 1 | 6144 | 6144 | 250000 | 3.4 mm | 30.6 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-3PL44 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | LCC | QCCJ, | 5.25 | 109 MHz | 3 | 70 °C | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | 3.6 V | 3.3 V | 30 | 34 | Tray | A40MX02 | Obsolete | 3 V | 表面贴装 | 44-LCC (J-Lead) | YES | 44-PLCC (16.59x16.59) | 44 | 微芯片技术 | A40MX02-3PL44 | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 225 | 1.27 mm | compliant | 44 | S-PQCC-J44 | 不合格 | COMMERCIAL | 295 CLBS, 3000 GATES | 4.572 mm | 现场可编程门阵列 | 3000 | 1.7 ns | 295 | 3000 | 16.5862 mm | 16.5862 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-PL84 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete (Last Updated: 2 months ago) | QCCJ | SQUARE | CHIP CARRIER | 3.6 V | 3.3 V | 30 | 70 °C | 3 | 5.22 | PLASTIC, LCC-84 | LCC | MICROSEMI CORP | Obsolete | 无 | A42MX24-PL84 | 8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000 | 72 | Compliant | Tray | A42MX24 | Obsolete | 3 V | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | YES | 84 | 84-PLCC (29.31x29.31) | 6.777889 g | 84 | 微芯片技术 | PLASTIC/EPOXY | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 225 | 1.27 mm | compliant | 84 | S-PQCC-J84 | 不合格 | 5 V | COMMERCIAL | 5.25 V | 3 V | 1890 CLBS, 36000 GATES | 4.572 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 1410 | 2.5 ns | 1890 | 1866 | 36000 | 3.68 mm | 29.3116 mm | 29.3116 mm | 无 | |||||||||||||||||||||||||||||||||||||
![]() | A3P125-VQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1.575 V | 1.5 V | 30 | SQUARE | TFQFP | PLASTIC/EPOXY | 85 °C | 3 | 350 MHz | 1.5 | TFQFP, | MICROSEMI CORP | 活跃 | 无 | A3P125-VQ100 | 1.5000 V | 1.425 V | 1.575 V | 有 | 1500 LE | 71 I/O | + 85 C | 0 C | 90 | SMD/SMT | Microchip Technology / Atmel | 350 MHz | ProASIC3 | N | Tray | A3P125 | 活跃 | 1.425 V | FPGA - Field Programmable Gate Array | 表面贴装 | VQFP-100 | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | FLATPACK, THIN PROFILE, FINE PITCH | 0 to 70 °C | Tray | A3P125 | e0 | 锡铅 | 8542.39.00.01 | 可编程逻辑集成电路 | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 1.5 V | COMMERCIAL | - | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 36864 | 125000 | STD | - | 3072 | 125000 | FPGA - Field Programmable Gate Array | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||
![]() | AX250-PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | MICROSEMI CORP | FQFP, QFP208,1.2SQ,20 | 8.31 | 649 MHz | 3 | 70 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.5 V | 40 | 1.425 V | YES | 208 | AX250-PQG208 | e3 | 哑光锡 | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 248 | 不合格 | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 248 | 2816 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 0.99 ns | 2816 | 4224 | 250000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3PE3000-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | FQFP, QFP208,1.2SQ,20 | 5.61 | 350 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.5 V | 30 | 147 | Tray | M1A3PE3000 | Obsolete | 1.425 V | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | M1A3PE3000-1PQ208I | -40°C ~ 100°C (TJ) | ProASIC3E | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3000000 | 75264 | 75264 | 3000000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3PE1500-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | FQFP, QFP208,1.2SQ,20 | 5.6 | 350 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.5 V | 30 | 147 | Tray | M1A3PE1500 | Obsolete | 1.425 V | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | M1A3PE1500-2PQ208I | -40°C ~ 100°C (TJ) | ProASIC3E | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 147 | 38400 CLBS, 1500000 GATES | 4.1 mm | 现场可编程门阵列 | 276480 | 1500000 | 38400 | 38400 | 1500000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P1000L-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | FQFP, QFP208,1.2SQ,20 | 5.27 | 350 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.2 V | 30 | 1.14 V | YES | 208 | M1A3P1000L-1PQ208I | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | 现场可编程门阵列 | 24576 | 24576 | 1000000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010-TQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | 20 X 20 MM, 0.50 MM PITCH, TQFP-144 | 5.57 | 3 | 85 °C | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 1.26 V | 1.2 V | 20 | 84 | Tray | Obsolete | 1.14 V | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | M2GL010-TQ144 | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | QUAD | 鸥翼 | 240 | 0.5 mm | compliant | S-PQFP-G144 | OTHER | 1.6 mm | 现场可编程门阵列 | 12084 | 933888 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P1000L-1PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | FQFP, QFP208,1.2SQ,20 | 5.27 | 350 MHz | 3 | 70 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.14 V | 1.2 V | 30 | YES | 208 | M1A3P1000L-1PQ208 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.5/3.3 V | COMMERCIAL | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | 现场可编程门阵列 | 24576 | 24576 | 1000000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M7AFS600-2PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | MICROSEMI CORP | FQFP, | 5.8 | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.5 V | 40 | 1.425 V | YES | 208 | M7AFS600-2PQG208I | e3 | 哑光锡 | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | INDUSTRIAL | 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-TQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | TQFP-144 | 5.88 | 3 | 85 °C | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 1.26 V | 1.2 V | 30 | 84 | Tray | Obsolete | 1.14 V | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | M2S010-TQ144 | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 240 | 0.5 mm | not_compliant | S-PQFP-G144 | 84 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 256KB | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P400-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | FQFP, | 5.25 | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.5 V | 30 | 151 | Tray | M1A3P400 | Obsolete | 1.425 V | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | M1A3P400-2PQ208I | -40°C ~ 100°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | INDUSTRIAL | 9216 CLBS, 400000 GATES | 4.1 mm | 现场可编程门阵列 | 55296 | 400000 | 9216 | 400000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P600-1PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.5 V | 30 | 3 | 350 MHz | 5.25 | FQFP, | MICROSEMI CORP | Obsolete | 无 | M1A3P600-1PQ208 | 154 | Tray | M1A3P600 | Obsolete | 1.425 V | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 85 °C | 0°C ~ 85°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | COMMERCIAL | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 110592 | 600000 | 13824 | 600000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN060V2-VQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | 活跃 | MICROSEMI CORP | TFQFP, | 5.58 | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 1.575 V | 1.2 V | 未说明 | 71 | Tray | AGLN060 | 活跃 | 1.14 V | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | AGLN060V2-VQG100I | -40°C ~ 100°C (TJ) | IGLOO nano | e3 | Tin (Sn) | 8542.39.00.01 | 1.14V ~ 1.575V | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | INDUSTRIAL | 1536 CLBS, 60000 GATES | 1.2 mm | 现场可编程门阵列 | 1536 | 18432 | 60000 | STD | 1536 | 60000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08A-2PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | MICROSEMI CORP | FQFP, QFP208,1.2SQ,20 | 5.31 | 313 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 2.75 V | 2.5 V | 40 | 2.25 V | YES | 208 | A54SX08A-2PQG208I | e3 | 哑光锡 | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 130 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 130 | 768 CLBS, 12000 GATES | 4.1 mm | 现场可编程门阵列 | 0.9 ns | 768 | 768 | 12000 | 28 mm | 28 mm |