制造商是'Microchip'
Microchip 嵌入式 - FPGA(现场可编程门阵列)
(5152)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 内存大小 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 高度 | 长度 | 宽度 | 辐射硬化 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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A3P250-1PQG208I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | 151 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 272 MHz | 有 | 24 | ProASIC3 | 1.425 V | 1.575 V | 1.575 V | Tray | A3P250 | 活跃 | 表面贴装 | PQFP-208 | 208-PQFP (28x28) | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | A3P250 | 1.425V ~ 1.575V | 1.5 V | 36864 | 250000 | 1 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
A40MX04-3PQG100I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 69 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 188 MHz | 有 | 66 | Actel | 0.062040 oz | Tray | A40MX04 | 活跃 | 5.5 V | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A40MX04-3PQG100I | 109 MHz | QFP | RECTANGULAR | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | PQFP-100 | YES | 100-PQFP (20x14) | 100 | 微芯片技术 | Details | -40°C ~ 85°C (TA) | Tray | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 3.3 V, 5 V | INDUSTRIAL | 547 CLBS, 6000 GATES | 3.4 mm | 现场可编程门阵列 | 6000 | 1.7 ns | 547 | 6000 | 2.7 mm | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
A54SX16A-2TQG100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 81 I/O | 2.25 V | 0 C | + 70 C | SMD/SMT | 294 MHz | 有 | 90 | Actel | 0.023175 oz | 2.75 V | Tray | A54SX16 | 活跃 | LFQFP, QFP100,.63SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP100,.63SQ,20 | 2.5 V | 40 | 70 °C | 有 | A54SX16A-2TQG100 | 294 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | 表面贴装 | TQFP-100 | YES | 100-TQFP (14x14) | 100 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tray | A54SX16A | e3 | Matte Tin (Sn) | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 172 | 不合格 | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 172 | 1452 CLBS, 24000 GATES | 1.6 mm | 现场可编程门阵列 | 24000 | 1452 | 1 ns | 1452 | 1452 | 24000 | 1.4 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
A42MX24-FTQG176 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | 150 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 有 | 40 | Actel | 5.25 V | Tray | A42MX24 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX24-FTQG176 | 50.4 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | 表面贴装 | 表面贴装 | TQFP-176 | YES | 176 | 176-TQFP (24x24) | 176 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tray | A42MX24 | e3 | Matte Tin (Sn) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 5.25 V | 3 V | 1890 CLBS, 36000 GATES | 1.6 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 1410 | 3.4 ns | 1890 | 36000 | 1.4 mm | 24 mm | 24 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||
A3P400-1FG144I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | N | 97 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 272 MHz | 有 | 160 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | A3P400 | 活跃 | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 100 °C | 无 | A3P400-1FG144I | 350 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 表面贴装 | 表面贴装 | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | 微芯片技术 | This product may require additional documentation to export from the United States. | -40 to 85 °C | Tray | A3P400 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 272 MHz | S-PBGA-B144 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 6.8 kB | 9216 CLBS, 400000 GATES | 1.55 mm | 现场可编程门阵列 | 55296 | 400000 | 272 MHz | 1 | 9216 | 9216 | 400000 | 1.05 mm | 13 mm | 13 mm | 无 | |||||||||||||||||||||||||||||||||||||||||
A3P125-1VQ100I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 71 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 272 MHz | 有 | 90 | ProASIC3 | 0.017672 oz | 1.575 V | Tray | A3P125 | 活跃 | 表面贴装 | VQFP | 100-VQFP (14x14) | 微芯片技术 | N | -40°C ~ 100°C (TJ) | Tray | A3P125 | 1.425V ~ 1.575V | 1.5 V | 36864 | 125000 | 1 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
A42MX16-3VQG100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | 83 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 237 MHz | 有 | 90 | Actel | Tray | A42MX16 | 活跃 | 5.25 V | 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX16-3VQG100 | 129 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | 表面贴装 | VQFP | YES | 100 | 100-VQFP (14x14) | 100 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 5.25 V | 3 V | 1232 CLBS, 24000 GATES | 1.2 mm | 现场可编程门阵列 | 608 | 24000 | 237 MHz | 608 | 3 | 928 | 1.9 ns | 1232 | 24000 | 1 mm | 14 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||
A3PE1500-FGG484 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | Details | 16500 LE | 280 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 231 MHz | 有 | - | 60 | 276480 bit | ProASIC3 | 1.5000 V | 1.425 V | 1.575 V | Tray | A3PE1500 | 活跃 | 1.575 V | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.5 V | 40 | 70 °C | 有 | A3PE1500-FGG484 | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 33.8 kB | 表面贴装 | 表面贴装 | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | 微芯片技术 | This product may require additional documentation to export from the United States. | 0 to 70 °C | Tray | A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 231 MHz | S-PBGA-B484 | 280 | 不合格 | 1.5 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 12 mA | 33.8 kB | 700 Mb/s | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | 现场可编程门阵列 | 16500 | 276480 | 1500000 | 231 MHz | STD | 38400 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | 无 | 无铅 | |||||||||||||||||||||||||||||||
A3P030-2VQG100I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 77 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 310 MHz | 有 | 90 | ProASIC3 | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | A3P030 | 活跃 | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | A3P030-2VQG100I | 350 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 表面贴装 | VQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | Details | -40 to 85 °C | Tray | A3P030 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 1.5 V | INDUSTRIAL | 768 CLBS, 30000 GATES | 1.2 mm | 现场可编程门阵列 | 30000 | 2 | 768 | 30000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
A42MX24-3PQG208I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | 176 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 有 | 24 | Actel | 3.3, 5 V | 3 V | 5.5 V | Tray | A42MX24 | 活跃 | 5.5 V | ROHS COMPLIANT, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A42MX24-3PQG208I | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | 表面贴装 | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | Details | -40 to 85 °C | Tray | A42MX24 | e3 | Matte Tin (Sn) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | 3.3 V, 5 V | INDUSTRIAL | 5.5 V | 3 V | 1890 CLBS, 36000 GATES | 4.1 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 3 | 1410 | 2 ns | 1890 | 36000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||
A42MX09-TQG176A | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 104 I/O | 4.75 V | - 40 C | + 125 C | SMD/SMT | 192 MHz | 有 | 40 | Actel | Tray | A42MX09 | 活跃 | 5.25 V | TQFP-176 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 5 V | 40 | 125 °C | 有 | A42MX09-TQG176A | 174 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.6 | 表面贴装 | TQFP-176 | YES | 176-TQFP (24x24) | 176 | 微芯片技术 | Details | -40°C ~ 125°C (TA) | Tray | A42MX09 | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5.0V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 不合格 | 5 V | AUTOMOTIVE | 684 CLBS, 14000 GATES | 1.6 mm | 现场可编程门阵列 | 14000 | STD | 2 ns | 684 | 14000 | 1.4 mm | 24 mm | 24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
A3P1000-2FGG144 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | 11000 LE | 97 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 310 MHz | 有 | 160 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | A3P1000 | 活跃 | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 40 | 85 °C | 有 | A3P1000-2FGG144 | 350 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 表面贴装 | FBGA | YES | 144-FPBGA (13x13) | 144 | 微芯片技术 | This product may require additional documentation to export from the United States. | 0 to 70 °C | Tray | A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 不合格 | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 1.55 mm | 现场可编程门阵列 | 147456 | 1000000 | 2 | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
A40MX02-3PLG44I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 34 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 188 MHz | 有 | 27 | Actel | 0.084185 oz | 5.5 V | Tray | A40MX02 | 活跃 | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A40MX02-3PLG44I | 109 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | PLCC-44 | YES | 44-PLCC (16.59x16.59) | 44 | 微芯片技术 | Details | -40°C ~ 85°C (TA) | Tube | A40MX02 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J44 | 不合格 | 3.3 V, 5 V | INDUSTRIAL | 295 CLBS, 3000 GATES | 4.572 mm | 现场可编程门阵列 | 3000 | 1.7 ns | 295 | 3000 | 3.68 mm | 16.59 mm | 16.59 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
A3P125-2PQG208I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 133 I/O | 1.425 V | - 40 C | + 85 C | SMD/SMT | 310 MHz | 有 | 24 | ProASIC3 | 1.575 V | Tray | A3P125 | 活跃 | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 40 | 100 °C | 有 | A3P125-2PQG208I | 350 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 表面贴装 | PQFP-208 | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | Details | -40°C ~ 100°C (TJ) | Tray | A3P125 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | 1.5 V | INDUSTRIAL | 3072 CLBS, 125000 GATES | 4.1 mm | 现场可编程门阵列 | 36864 | 125000 | 2 | 3072 | 125000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
A42MX24-1PQG208 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 1 month ago) | 176 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 250 MHz | 有 | 24 | Actel | 5.25 V | Tray | A42MX24 | 活跃 | ROHS COMPLIANT, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX24-1PQG208 | 96.6 MHz | FQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | 表面贴装 | 表面贴装 | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tray | A42MX24 | e3 | Matte Tin (Sn) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 5.25 V | 3 V | 1890 CLBS, 36000 GATES | 4.1 mm | 现场可编程门阵列 | 912 | 36000 | 250 MHz | 912 | 1 | 1410 | 2.1 ns | 1890 | 36000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||
A40MX02-2PLG44I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 34 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 175 MHz | 有 | 27 | Actel | 0.084185 oz | 5.5 V | Tray | A40MX02 | 活跃 | ROHS COMPLIANT, PLASTIC, LCC-44 | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A40MX02-2PLG44I | 101 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | PLCC-44 | YES | 44-PLCC (16.59x16.59) | 44 | 微芯片技术 | Details | -40°C ~ 85°C (TA) | Tube | A40MX02 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J44 | 不合格 | 3.3 V, 5 V | INDUSTRIAL | 295 CLBS, 3000 GATES | 4.572 mm | 现场可编程门阵列 | 3000 | 2 ns | 295 | 3000 | 3.68 mm | 16.59 mm | 16.59 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
A42MX24-FPLG84 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | 72 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 有 | 16 | Actel | 0.239083 oz | Tray | A42MX24 | 活跃 | 5.25 V | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX24-FPLG84 | 50.4 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.26 | 表面贴装 | 表面贴装 | PLCC-84 | YES | 84 | 84-PLCC (29.31x29.31) | 6.777889 g | 84 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tube | A42MX24 | e3 | Matte Tin (Sn) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 5.25 V | 3 V | 1890 CLBS, 36000 GATES | 4.572 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 1410 | 3.4 ns | 1890 | 36000 | 3.68 mm | 29.31 mm | 29.31 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||
A42MX16-1VQG100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 83 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 198 MHz | 有 | 90 | Actel | 5.25 V | Tray | A42MX16 | 活跃 | 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX16-1VQG100 | 108 MHz | TFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | 表面贴装 | VQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 1232 CLBS, 24000 GATES | 1.2 mm | 现场可编程门阵列 | 24000 | 2.4 ns | 1232 | 24000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
A42MX09-2PQG160 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 101 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 269 MHz | 有 | 24 | Actel | 0.196363 oz | 5.25 V | Tray | A42MX09 | 活跃 | ROHS COMPLIANT, PLASTIC, QFP-160 | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A42MX09-2PQG160 | 146 MHz | QFP | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | PQFP-160 | YES | 160-PQFP (28x28) | 160 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tray | A42MX09 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 684 CLBS, 14000 GATES | 4.1 mm | 现场可编程门阵列 | 14000 | 1.8 ns | 684 | 14000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
A54SX32A-1TQG144I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 113 I/O | 2.25 V | - 40 C | + 85 C | SMD/SMT | 278 MHz | 有 | 60 | Actel | 0.046530 oz | Tray | A54SX32 | 活跃 | 2.75 V | LFQFP, QFP144,.87SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | -40 °C | 2.5 V | 40 | 85 °C | 有 | A54SX32A-1TQG144I | 278 MHz | LFQFP | SQUARE | 活跃 | MICROSEMI CORP | 5.24 | 表面贴装 | TQFP-144 | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | Details | -40°C ~ 85°C (TA) | Tray | A54SX32A | e3 | Matte Tin (Sn) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G144 | 113 | 不合格 | 2.5 V | 2.5,3.3/5 V | INDUSTRIAL | 113 | 2880 CLBS, 48000 GATES | 1.6 mm | 现场可编程门阵列 | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 1.4 mm | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
A42MX09-PQG100I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 336 LE | 83 I/O | 3 V | - 40 C | + 85 C | SMD/SMT | 215 MHz | 有 | 66 | Actel | 0.062040 oz | 3.3, 5 V | 3 V | 5.5 V | 42MX | 85C | Industrial | PQFP | 14000 | -40C to 85C | 83 | 14000 | 336 | 0.45UM | 5.5(V) | 3.3/5(V) | 无 | 3(V) | -40C | 有 | 336 | 516 | 表面贴装 | 5.5 V | Tray | A42MX09 | 活跃 | ROHS COMPLIANT, PLASTIC, QFP-100 | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 40 | 85 °C | 有 | A42MX09-PQG100I | 117 MHz | QFP | RECTANGULAR | 活跃 | MICROSEMI CORP | 1.51 | 表面贴装 | PQFP-100 | YES | 100-PQFP (20x14) | 100 | 微芯片技术 | Details | -40 to 85 °C | Tray | A42MX09 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | 129/215(MHz) | 100 | R-PQFP-G100 | 不合格 | 3.3 V, 5 V | INDUSTRIAL | - | 684 CLBS, 14000 GATES | 3.4 mm | 现场可编程门阵列 | 14000 | STD | - | 2.5 ns | 684 | 684 | 14000 | 2.7 mm | 20 mm | 14 mm | |||||||||||||||||||||||||||||
A40MX04-1PLG68 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 57 I/O | 3 V | 0 C | + 70 C | SMD/SMT | 160 MHz | 有 | 19 | Actel | 0.171777 oz | 5.25 V | Tray | A40MX04 | 活跃 | ROHS COMPLIANT, PLASTIC, LCC-68 | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 70 °C | 有 | A40MX04-1PLG68 | 48 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 1.52 | 表面贴装 | PLCC-68 | YES | 68-PLCC (24.23x24.23) | 68 | 微芯片技术 | Details | 0°C ~ 70°C (TA) | Tube | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J68 | 不合格 | 3.3 V, 5 V | COMMERCIAL | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 6000 | 2.3 ns | 547 | 6000 | 3.68 mm | 24.23 mm | 24.23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
A40MX02-1PLG44M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | 34 I/O | 3 V | - 55 C | + 125 C | SMD/SMT | 160 MHz | 有 | 27 | Actel | 0.084185 oz | 5.5 V | Tray | A40MX02 | 活跃 | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 40 | 125 °C | 有 | A40MX02-1PLG44M | 92 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.28 | 表面贴装 | PLCC-44 | YES | 44-PLCC (16.59x16.59) | 44 | 微芯片技术 | This product may require additional documentation to export from the United States. | -55°C ~ 125°C (TC) | Tube | A40MX02 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J44 | 不合格 | 3.3 V, 5 V | MILITARY | 295 CLBS, 3000 GATES | 4.572 mm | 现场可编程门阵列 | 3000 | 2.3 ns | 295 | 3000 | 3.68 mm | 16.59 mm | 16.59 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
A3PE600-FG484 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | 270 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 231 MHz | 有 | 60 | ProASIC3 | 0.014110 oz | 1.5000 V | Tray | A3PE600 | 活跃 | 1.575 V | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.5 V | 30 | 70 °C | 无 | A3PE600-FG484 | 350 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | FBGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | This product may require additional documentation to export from the United States. | 0 to 70 °C | Tray | A3PE600 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 270 | 不合格 | 1.5 V | 1.5/3.3 V | COMMERCIAL | 270 | 13824 CLBS, 600000 GATES | 2.44 mm | 现场可编程门阵列 | 110592 | 600000 | STD | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
AGLE3000V2-FG484 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | 341 I/O | 1.14 V | 0 C | + 70 C | SMD/SMT | 892.86 MHz | 有 | 60 | IGLOOe | 0.014110 oz | Tray | AGLE3000 | 活跃 | 1.575 V | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 70 °C | 无 | AGLE3000V2-FG484 | 250 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | FBGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | This product may require additional documentation to export from the United States. | 0°C ~ 70°C (TA) | Tray | AGLE3000V2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B484 | 341 | 不合格 | 1.2 V to 1.5 V | 1.2/1.5 V | COMMERCIAL | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | 现场可编程门阵列 | 75264 | 516096 | 3000000 | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm |