制造商是'Microchip'
Microchip 嵌入式 - FPGA（现场可编程门阵列）
(5152)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 终止次数 | ECCN 代码 | 温度系数 | 电阻 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 功率(瓦特) | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | Reach合规守则 | 频率 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 失败率 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 传播延迟 | 接通延迟时间 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 特征 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||
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.png) | A42MX16-1PL84 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 72 | A42MX16 | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX16-1PL84 | 108 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | LCC | 表面贴装 | Radial | YES | - | 84 | Vishay Foil Resistors (Division of Vishay Precision Group) | Bulk | -55°C ~ 125°C | S | 0.300 L x 0.105 W (7.62mm x 2.67mm) | ±0.5% | e0 | 2 | ±2ppm/°C | 2.304 Ohms | Tin/Lead (Sn/Pb) | 金属箔 | 0.6W | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 225 | 1.27 mm | compliant | 84 | S-PQCC-J84 | 不合格 | - | COMMERCIAL | 1232 CLBS, 24000 GATES | 4.572 mm | 现场可编程门阵列 | 24000 | 2.4 ns | 1232 | 24000 | Moisture Resistant, Non-Inductive | 0.336 (8.53mm) | 29.3116 mm | 29.3116 mm | ||||||||||||||||||||||||||||||||
| A1425A-PQ100C | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 120065 | 活跃 | PLASTIC, QFP-100 | FLATPACK | 3 | PLASTIC/EPOXY | 5 V | 30 | 4.75 V | 70 °C | 无 | A1425A-PQ100C | 125 MHz | QFP | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.25 V | 8.8 | YES | 100 | Molex | Bulk | * | e0 | 锡铅 | MAX 80 I/OS | CMOS | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 310 CLBS, 2500 GATES | 3.4 mm | 现场可编程门阵列 | 3 ns | 310 | 2500 | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| A14V25A-PL84C | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | 70 | Non-Compliant | PLASTIC, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A14V25A-PL84C | 100 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.88 | 表面贴装 | YES | 84 | 84 | Phoenix Contact | Bulk | - | e0 | 锡铅 | 70 °C | 0 °C | MAX 70 I/OS | CMOS | QUAD | J BEND | 225 | 1.27 mm | compliant | 100 MHz | S-PQCC-J84 | 不合格 | 3.3 V | COMMERCIAL | 3.6 V | 3 V | 3.9 ns | 310 CLBS, 2500 GATES | 4.572 mm | 现场可编程门阵列 | 310 | 2500 | 310 | 3.9 ns | 310 | 2500 | 29.3116 mm | 29.3116 mm | |||||||||||||||||||||||||||||||||||||||
| A1010B-PLG68I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ERC55 | 活跃 | PLASTIC, MS-007-AD, LCC-68 | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 5 V | 40 | 4.5 V | 85 °C | 有 | A1010B-PLG68I | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 8.59 | Axial | YES | Axial | 68 | Vishay Dale | Tape & Reel (TR) | -65°C ~ 175°C | ERC | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | e3 | 2 | ±50ppm/°C | 56.9 kOhms | Matte Tin (Sn) | Metal Film | 0.125W, 1/8W | MAX 57 I/OS | 8542.39.00.01 | CMOS | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J68 | 不合格 | - | INDUSTRIAL | 295 CLBS, 1200 GATES | 4.445 mm | 现场可编程门阵列 | 4.5 ns | 295 | 1200 | Moisture Resistant | - | 24.13 mm | 24.13 mm | ||||||||||||||||||||||||||||||||||||||
| M2S150-1FCG1152X417 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M7A3P1000-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete (Last Updated: 2 months ago) | Compliant | Tray | M7A3P1000 | Obsolete | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | PLASTIC/EPOXY | -40 °C | 1.5 V | 1.425 V | 85 °C | 无 | M7A3P1000-1PQ208I | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.27 | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | 154 | -40°C ~ 100°C (TJ) | ProASIC3 | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 0.5 mm | unknown | S-PQFP-G208 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 18 kB | 24576 CLBS, 1000000 GATES | 4.1 mm | 现场可编程门阵列 | 147456 | 1e+06 | 272 MHz | 1 | 24576 | 24576 | 1000000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||
| A3PE3000L-1FG896M | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | Compliant | Tray | A3PE3000 | 活跃 | 1 MM PITCH, FBGA-896 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | -55 °C | 1.2 V | 30 | 1.14 V | 125 °C | 无 | A3PE3000L-1FG896M | 250 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | 表面贴装 | 表面贴装 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | 微芯片技术 | 620 | -55°C ~ 125°C (TJ) | ProASIC3L | e0 | 3A001.A.2.C | 锡铅 | 125 °C | -55 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B896 | 620 | 不合格 | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 1.575 V | 1.14 V | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | 现场可编程门阵列 | 516096 | 3e+06 | 1 | 75264 | 75264 | 75264 | 3000000 | 31 mm | 31 mm | 无 | |||||||||||||||||||||||
| AGL1000V2-FG144T | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Non-Compliant | 3 | 20 | 无 | AGL1000V2-FG144T | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.8 | 144 | 97 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | 235 | unknown | 1.5 V | 18 kB | 现场可编程门阵列 | 24576 | 1e+06 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A1240A-1PG132C | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Compliant | PGA, PGA133M,13X13 | 网格排列 | 3 | CERAMIC, METAL-SEALED COFIRED | PGA133M,13X13 | 5 V | 30 | 4.75 V | 70 °C | 无 | A1240A-1PG132C | 80 MHz | PGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.25 V | 5.84 | 通孔 | NO | 132 | 132 | 104 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | PLD EQUIVALENT GATES=10000 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | PERPENDICULAR | PIN/PEG | 225 | 2.54 mm | unknown | 110 MHz | S-CPGA-P132 | 104 | 不合格 | 5 V | 5 V | COMMERCIAL | 5.25 V | 4.75 V | 4.3 ns | 4.3 ns | 104 | 684 CLBS, 4000 GATES | 7.3152 mm | 现场可编程门阵列 | 684 | 4000 | 684 | 1 | 568 | 4.3 ns | 684 | 684 | 4000 | 34.544 mm | 34.544 mm | 无 | |||||||||||||||||||||||||||||||
| A1010B-2PQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Compliant | 表面贴装 | 100 | 57 | 85 °C | -40 °C | 5 V | 3.4 ns | 1200 | 295 | 2 | 147 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P060-QNG132 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 | UNSPECIFIED | 1.5 V | 30 | 1.425 V | 85 °C | 有 | A3P060-QNG132 | 350 MHz | HVBCC | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 7.68 | YES | 132 | HVBCC, | 8542.39.00.01 | CMOS | BOTTOM | BUTT | 260 | 0.5 mm | compliant | S-XBCC-B132 | 不合格 | COMMERCIAL | 1536 CLBS, 60000 GATES | 0.8 mm | 现场可编程门阵列 | 1536 | 60000 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| APA750-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete (Last Updated: 2 months ago) | Non-Compliant | Tray | APA750 | Obsolete | 0.50 MM PITCH, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | -40 °C | 2.5 V | 30 | 2.3 V | 85 °C | 无 | APA750-PQ208I | 180 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.7 V | 5.3 | Lead, Tin | 表面贴装 | 表面贴装 | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | 微芯片技术 | 158 | -40°C ~ 85°C (TA) | ProASICPLUS | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | 180 MHz | S-PQFP-G208 | 158 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 2.7 V | 2.3 V | 18 kB | 158 | 750000 GATES | 4.1 mm | 现场可编程门阵列 | 147456 | 750000 | 180 MHz | 32768 | 32768 | 750000 | 3.4 mm | 28 mm | 28 mm | 无 | ||||||||||||||||||||||
| A54SX08-1PL84 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Compliant | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A54SX08-1PL84 | 280 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.26 | 表面贴装 | YES | 84 | 6.777889 g | 84 | 69 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | J BEND | 225 | 1.27 mm | compliant | 280 MHz | S-PQCC-J84 | 不合格 | 5 V | COMMERCIAL | 5.25 V | 4.75 V | 800 ps | 800 ps | 768 CLBS, 8000 GATES | 4.572 mm | 现场可编程门阵列 | 768 | 12000 | 280 MHz | 768 | 1 | 256 | 0.8 ns | 768 | 8000 | 3.68 mm | 29.31 mm | 29.31 mm | 无 | |||||||||||||||||||||||||||||||||||
| A1415A-PL84M | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Compliant | 表面贴装 | 84 | 70 | 125 °C | -55 °C | 125 MHz | 5 V | 5.5 V | 4.5 V | 3 ns | 3 ns | 200 | 1500 | 200 | 264 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M1A3P600L-1FGG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.2 V | 40 | 1.14 V | 70 °C | 有 | M1A3P600L-1FGG256 | 350 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.26 | YES | 256 | BGA, BGA256,16X16,40 | e1 | 锡银铜 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | 不合格 | 1.5/3.3 V | COMMERCIAL | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | 现场可编程门阵列 | 13824 | 13824 | 600000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| RT4G150L-LGG1657R | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 表面贴装 | 1657-BCLGA | 1657-CLGA (42.5x42.5) | 微芯片技术 | Bulk | -55°C ~ 125°C (TJ) | RTG4™ | 1.14V ~ 1.26V | 151824 | 5325 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| RT4G150-1CGG1657PROTO | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 通孔 | 1657-BFCPGA | 1657-CCGA (42.5x42.5) | 微芯片技术 | Bulk | -55°C ~ 125°C (TJ) | RTG4™ | 1.14V ~ 1.26V | 151824 | 5325 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EX128-FTQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | EX128 | 活跃 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 2.5 V | 40 | 2.3 V | 70 °C | 有 | EX128-FTQG100 | 178 MHz | LFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 1.48 | 表面贴装 | 100-LQFP | YES | 100-TQFP (14x14) | 100 | 微芯片技术 | 70 | 0°C ~ 70°C (TA) | EX | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | COMMERCIAL | 6000 GATES | 1.6 mm | 现场可编程门阵列 | 256 | 6000 | F | 1.4 ns | 6000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||
| A42MX16-2VQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete (Last Updated: 2 months ago) | Tray | A42MX16 | Obsolete | Compliant | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A42MX16-2VQ100I | 117 MHz | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.26 | QFP | 表面贴装 | 表面贴装 | 100-TQFP | YES | 100 | 100-VQFP (14x14) | 100 | 微芯片技术 | 83 | -40°C ~ 85°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 100 | S-PQFP-G100 | 不合格 | 5 V | INDUSTRIAL | 5.5 V | 3 V | 1232 CLBS, 24000 GATES | 1.2 mm | 现场可编程门阵列 | 608 | 24000 | 215 MHz | 608 | 2 | 928 | 2.1 ns | 1232 | 24000 | 1 mm | 14 mm | 14 mm | 无 | |||||||||||||||||||||||||
| AGL125V2-FG144T | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Non-Compliant | 表面贴装 | 144 | 97 | 70 °C | 0 °C | 4.5 kB | 3072 | 125000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A40MX02-PL68M | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | A40MX02 | Obsolete | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A40MX02-PL68M | 80 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | LCC | 表面贴装 | 68-LCC (J-Lead) | YES | 68-PLCC (24.23x24.23) | 68 | 微芯片技术 | 57 | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 68 | S-PQCC-J68 | 不合格 | MILITARY | 295 CLBS, 3000 GATES | 4.572 mm | 现场可编程门阵列 | 3000 | 2.7 ns | 295 | 3000 | 24.2316 mm | 24.2316 mm | ||||||||||||||||||||||||||||||||||||||||
| M2S025S-1VFG400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 | 有 | M2S025S-1VFG400I | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.78 | , | compliant | 现场可编程门阵列 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S005-FGG484IX417 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050-FG896ESX423 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL100T-1FCG1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 网格排列 | PLASTIC | BGA1152,34X34,40 | 1.2 V | 有 | M2GL100T-1FCG1152I | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.82 | YES | 1152 | BGA, BGA1152,34X34,40 | 现场可编程门阵列 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 574 | 现场可编程门阵列 | 99512 |