制造商是'Microchip'
Microchip 时钟/计时 - 时钟缓冲器，驱动器
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图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出量 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电路数量 | 最大电源电压 | 最小电源电压 | 传播延迟 | 静态电流 | 接通延迟时间 | 家人 | 逻辑功能 | 输入 | 比率-输入：输出 | 差分 - 输入：输出 | 高电平输出电流 | 传播延迟(tpd) | 低水平输出电流 | 最大工作周期 | fmax-Min | 同边偏斜-最大(tskwd) | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
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.png) | PL133-21GC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 6-UFDFN Exposed Pad | 6-DFN (2x1.3) | 150MHz | 0°C~70°C | Tube | 2016 | 活跃 | 1 (Unlimited) | Fanout Buffer (Distribution) | 1.8V 2.5V 3.3V | PL133 | LVCMOS | 1 | LVCMOS | 1:2 | No/No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | SY89808LTG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 32-TQFP | 32 | 500MHz | -40°C~85°C | Tray | 2005 | Precision Edge® | e4 | Obsolete | 3 (168 Hours) | 32 | Fanout Buffer (Distribution), Multiplexer, Translator | Nickel/Palladium/Gold (Ni/Pd/Au) | 3.15V~3.45V | QUAD | 鸥翼 | 260 | 1 | 3.3V | 0.8mm | 40 | SY89808 | HSTL | 9 | 3.3V | 3.45V | 1 | 1.7 ns | HSTL, LVPECL | 2:9 | Yes/Yes | 500 MHz | 0.025 ns | 7mm | 7mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||
 | PL130-07QC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 16-WFQFN Exposed Pad | 200MHz | 0°C~70°C | Tube | yes | Obsolete | 3 (168 Hours) | 16 | Buffer/Driver | 2.5V~3.3V | QUAD | 无铅 | 1 | 0.5mm | PL130 | LVCMOS | 3.3V | 2.5V | 1 | LVCMOS, Sine Wave | 1:1 | No/No | 0.95mm | 3mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | SY56017RMG-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad, 16-MLF® | 16 | 16-MLF® (3x3) | 4.5GHz | -40°C~85°C | Tape & Reel (TR) | 2000 | Precision Edge® | 活跃 | 2 (1 Year) | Multiplexer | 85°C | -40°C | 2.375V~2.625V | SY56017 | CML | 2.5V | 1 | 2.625V | 2.375V | 21mA | CML, LVDS, LVPECL | 2:1 | Yes/Yes | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | SY10E111LEJZ-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 28-PLCC | 0°C~85°C | Tape & Reel (TR) | 2000 | 100E, Precision Edge® | Obsolete | 2 (1 Year) | Fanout Buffer (Distribution) | 85°C | 0°C | 3V~5.5V | SY10E111 | PECL | 9 | 1 | 3.8V | 3V | 850 ps | 850 ps | PECL | 1:9 | Yes/Yes | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | ZL40223LDF1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 32-VFQFN Exposed Pad | 32-QFN (5x5) | 750MHz | -40°C~85°C | Tape & Reel (TR) | 2012 | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution), Multiplexer | 85°C | -40°C | 2.375V~3.465V | LVDS | 1 | 2 ns | CML, HCSL, LVCMOS, LVDS, LVPECL | 2:8 | Yes/Yes | 5 % | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | ZL40255LDF1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | 32-QFN (5x5) | 1.035GHz | -40°C~85°C TA | Tray | SmartBuffer™ | 活跃 | Fanout Buffer (Distribution), Divider, Multiplexer | 1.71V~3.465V | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1 | CMOS, Crystal | 4:3 | Yes/Yes | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | SY75576LKY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | 20-TSSOP | 267MHz | -40°C~85°C | Tube | 2016 | Precision Edge® | 活跃 | 1 (Unlimited) | Fanout Buffer (Distribution), Multiplexer | 85°C | -40°C | 3.135V~3.465V | SY75576 | HCSL, LVDS | 1 | HCSL, LVDS | 2:4 | Yes/Yes | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| PL138-48OI-R | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | 1GHz | -40°C~85°C | Tape & Reel (TR) | 2000 | e3 | yes | Discontinued | 1 (Unlimited) | 20 | Fanout Buffer (Distribution), Multiplexer | Matte Tin (Sn) - annealed | ALSO OPERATES AT -2.375 TO -3.8 V SUPPLY | 2.375V~3.63V | DUAL | 鸥翼 | 1 | 2.5V | 0.65mm | PL138 | LVPECL | R-PDSO-G20 | 3.8V | 2.375V | 1 | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | 2:4 | Yes/Yes | 0.79 ns | 800 MHz | 0.037 ns | 6.5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||
 | PL130-08OI-R | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | 1GHz | -40°C~85°C TA | Tape & Reel (TR) | 2012 | yes | Obsolete | 1 (Unlimited) | 8 | Translator | 2.5V~3.3V | DUAL | 鸥翼 | 1 | 0.65mm | PECL | R-PDSO-G8 | 1 | 1:1 | No/Yes | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | ZL40203LDF1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 16-VFQFN Exposed Pad | YES | 750MHz | -40°C~85°C | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 16 | Fanout Buffer (Distribution) | ALSO OPERATES AT 3.3 V SUPPLY | 2.375V~3.465V | QUAD | 1 | 2.375V | 0.5mm | LVPECL | 16 | 2.625V | 2.5/3.3V | 2.375V | 1 | 2 ns | CML, HCSL, LVCMOS, LVDS, LVPECL | 1:4 | Yes/Yes | 2 % | 3mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
| SY56020XRMG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 16-VFQFN Exposed Pad, 16-MLF® | YES | 4.5GHz | -40°C~85°C | Tube | Precision Edge® | e4 | 活跃 | 2 (1 Year) | 16 | Fanout Buffer (Distribution) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.375V~2.625V | QUAD | 无铅 | 260 | 1 | 2.5V | 0.5mm | 40 | SY56020 | CML | 不合格 | 2.625V | 2.375V | 1 | CML, LVDS, LVPECL | 1:4 | Yes/Yes | 0.3 ns | 4500 MHz | 0.9mm | 3mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
| SY100E111LJY-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | -40°C~85°C | Tape & Reel (TR) | 2006 | 100E, Precision Edge® | e3 | Obsolete | 2 (1 Year) | 28 | Fanout Buffer (Distribution) | 哑光锡 | 3V~5.5V | QUAD | J BEND | 245 | 1 | 40 | SY100E111 | 18 | 1 | 780 ps | 780 ps | PECL | 1:9 | Yes/Yes | 0.05 ns | 4.57mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||
 | SY58033UMG-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad, 32-MLF® | 32 | 5.5GHz | -40°C~85°C | Tape & Reel (TR) | Precision Edge® | e4 | 活跃 | 2 (1 Year) | 32 | Fanout Buffer (Distribution) | Nickel/Palladium/Gold (Ni/Pd/Au) | CAN ALSO OPERATE WITH 3.3V SUPPLY | 2.375V~3.6V | QUAD | 无铅 | 260 | 1 | 2.5V | 0.5mm | 40 | SY58033 | LVPECL | 16 | 不合格 | 3.3V | 2.625V | 2.375V | 1 | 280 ps | 250mA | CML, LVDS, LVPECL | 1:8 | Yes/Yes | 5500 MHz | 0.02 ns | 0.9mm | 5mm | 5mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||
| SY56020RMG-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 16-VFQFN Exposed Pad, 16-MLF® | 16-MLF® (3x3) | 4.5GHz | -40°C~85°C | Tape & Reel (TR) | 2000 | Precision Edge® | 活跃 | 2 (1 Year) | Fanout Buffer (Distribution) | 2.375V~2.625V | SY56020 | CML | 1 | LVDS, LVPECL | 1:4 | Yes/Yes | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | PL130-07SI | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 16 | 200MHz | -40°C~85°C | Tube | 2016 | e3 | Obsolete | 3 (168 Hours) | 8 | Buffer/Driver | Matte Tin (Sn) - annealed | 2.5V~3.3V | DUAL | 鸥翼 | 260 | 1 | 40 | PL130 | LVCMOS | R-PDSO-G8 | 3.3V | 2.5V | 1 | LVCMOS, Sine Wave | 1:1 | No/No | 4.875mm | 3.9mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||
 | ZL40252LDG1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 56-VFQFN Exposed Pad | 56-QFN (8x8) | 1.035GHz | -40°C~85°C | Tray | SmartBuffer™ | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution), Divider, Multiplexer | 1.71V~3.465V | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1 | CMOS, Crystal | 4:10 | Yes/Yes | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| ZL40204LDG1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32-QFN (5x5) | 750MHz | -40°C~85°C | Tray | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution) | 85°C | -40°C | 2.375V~3.465V | LVPECL | 3.465V | 1 | 2 ns | CML, HCSL, LVCMOS, LVDS, LVPECL | 1:6 | Yes/Yes | 2 % | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | PL130-07AQC-R | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 200MHz | 0°C~70°C | Tape & Reel (TR) | 2016 | Obsolete | 1 (Unlimited) | 16 | Buffer/Driver | 2.5V~3.3V | QUAD | 无铅 | 1 | 0.5mm | LVCMOS | 3.3V | 2.5V | 1 | LVCMOS, Sine Wave | 1:1 | No/No | 0.8mm | 3mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
| SY100H646LJZ-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 0°C~85°C | Tape & Reel (TR) | Precision Edge® | e3 | Discontinued | 2 (1 Year) | 28 | Fanout Buffer (Distribution), Multiplexer | Matte Tin (Sn) | 3V~3.6V | QUAD | J BEND | 245 | 1 | 3.3V | 160MHz | 40 | SY100H646 | TTL | 8 | 不合格 | 3.3V | 3.6V | 3V | 1 | PECL, TTL | 2:8 | Yes/Yes | 3.3 ns | 0.3 ns | 4.57mm | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||||
| SY10EL11VZG-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 8-SOIC | -40°C~85°C | Tape & Reel (TR) | 2014 | 100EL, Precision Edge® | Obsolete | 1 (Unlimited) | Fanout Buffer (Distribution) | 85°C | -40°C | 3V~5.5V | SY10EL11 | Clock | 4 | 1 | 5.5V | 3V | 385 ps | 385 ps | Clock | 1:2 | Yes/Yes | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | SY89823LHY-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 64-TQFP Exposed Pad | 64 | 500MHz | -40°C~85°C | Tape & Reel (TR) | 2000 | Precision Edge® | e3 | 活跃 | 3 (168 Hours) | 64 | Fanout Buffer (Distribution), Multiplexer, Translator | Matte Tin (Sn) | 3.15V~3.45V | QUAD | 鸥翼 | 260 | 1 | 3.3V | 0.5mm | 40 | SY89823 | HSTL | 3.3V | 3.45V | 1 | HSTL, LVPECL | 2:22 | Yes/Yes | 500 MHz | 0.05 ns | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
| SY10E111JY-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | -40°C~85°C | Tape & Reel (TR) | 2000 | 100E, ECLinPS™ | e3 | Obsolete | 2 (1 Year) | 28 | Fanout Buffer (Distribution) | 哑光锡 | 4.2V~5.5V | QUAD | J BEND | 未说明 | 1 | 未说明 | SY10E111 | 18 | 1 | 850 ps | 10E | PECL | 1:9 | Yes/Yes | 0.05 ns | 4.57mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
| SY100H641LJZ-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 28-PLCC (11.48x11.48) | 135MHz | 0°C~85°C | Tape & Reel (TR) | 2000 | Precision Edge® | Obsolete | 2 (1 Year) | Fanout Buffer (Distribution) | 85°C | 0°C | 3V~3.6V | SY100H641 | TTL | 3.3V | 1 | 3.6V | 3V | 3.5 ns | 3.5 ns | Translator | PECL | 1:9 | Yes/Yes | -3mA | 24mA | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
| PL130-07QC-R | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 16-WFQFN Exposed Pad | 16 | 200MHz | 0°C~70°C | Tape & Reel (TR) | 2016 | Obsolete | 2 (1 Year) | 16 | Buffer/Driver | 2.5V~3.3V | QUAD | 无铅 | 1 | 0.5mm | PL130 | LVCMOS | 3.3V | 2.5V | 1 | Translator | LVCMOS, Sine Wave | 1:1 | No/No | -12mA | 12mA | 0.8mm | 3mm | 3mm | ROHS3 Compliant |