制造商是'Microchip'
Microchip 可编程振荡器
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图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | 尺寸/尺寸 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | 类型 | 端子表面处理 | 附加功能 | 电压 - 供电 | 电源电压 | 频率 | 频率稳定性 | 输出量 | 功能 | 基本谐振器 | 最大电流源 | 物理尺寸 | 工作电源电压 | 上升时间-最大值 | 最大下降时间 | 对称性-最大值 | 电流 - 电源（禁用）（最大值） | 可编程类型 | 可用频率范围 | 负载电容 | 最大电源电流 | 频率调整-机械 | 最大工作周期 | 工作频率-最小值 | 高度 | 座位高度(最大) | RoHS状态 | 无铅 | 评级结果 | ||
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 | DSC8121BI2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | 2009 | DSC8121 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 2.25V~3.6V | 170MHz | 25 ppm | CMOS | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 3.3V | 2ns | 2ns | 55/45% | Blank (User Must Program) | 10MHz~170MHz | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||
 | DSC8001BI2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 4 | -40°C~85°C | Tube | DSC8001 | 0.197Lx0.126W 5.00mmx3.20mm | e4 | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 1.8V | 150MHz | 25 ppm | CMOS | Standby | MEMS | 5.0mm x 3.2mm x 0.85mm | 3.3V | 3ns | 3ns | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||
 | DSC8124BI2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | 4 | -40°C~85°C | Tube | 2013 | DSC8124 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 1 (Unlimited) | XO (Standard) | 2.25V~3.6V | ±25ppm | HCSL | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | Blank (User Must Program) | 10MHz~460MHz | 42mA | NO | 10MHz | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
 | DSC8121AI2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | 2009 | DSC8121 | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 2.25V~3.6V | 170MHz | 25 ppm | CMOS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.85mm | 3.3V | 2ns | 2ns | 55/45% | Blank (User Must Program) | 10MHz~170MHz | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||
 | DSC8001CI2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC8001 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 1.8V~3.3V | 1.8V | 150MHz | 25 ppm | CMOS | Standby | MEMS | 3.2mm x 2.5mm x 0.85mm | 3.3V | 3ns | 3ns | 55/45% | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
 | DSC8001AI2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | 2010 | DSC8001 | 0.276Lx0.197W 7.00mmx5.00mm | e4 | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 1.8V | 150MHz | 25 ppm | CMOS | Standby | MEMS | 7.0mm x 5.0mm x 0.85mm | 3.3V | 3ns | 3ns | 55/45% | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||
 | DSC8121CI2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | 6 | -40°C~85°C | Tube | 2009 | DSC8121 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 2.25V~3.6V | 170MHz | 25 ppm | CMOS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.85mm | 3.3V | 2ns | 2ns | 55/45% | Blank (User Must Program) | 10MHz~170MHz | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | 无铅 | |||||||||||||
 | DSC8123BI2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | 2013 | DSC8123 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 2.25V~3.6V | 460MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 0.2ns | 0.2ns | 52/48% | Blank (User Must Program) | 10MHz~460MHz | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||
| DSC8001CI5 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC8001 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 1.8V | 150MHz | 10 ppm | CMOS | Standby | MEMS | 3.2mm x 2.5mm x 0.85mm | 3.3V | 3ns | 3ns | 55/45% | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||
 | DSC8101BL2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 170MHz | -40°C~105°C | Tube | 2013 | DSC8101 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 1 (Unlimited) | XO (Standard) | 2.25V~3.6V | ±25ppm | CMOS | Standby | MEMS | 5.0mm x 3.2mm x 0.85mm | 2ns | 2ns | 55/45% | 95μA | Blank (User Must Program) | 10MHz~170MHz | 35mA | NO | 10MHz | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||
 | DSC8001DL5 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 4 | -40°C~105°C | Tube | 2009 | DSC8001 | 0.098Lx0.079W 2.50mmx2.00mm | e4 | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 1.8V | 150MHz | 10 ppm | CMOS | Standby | MEMS | 2.5mm x 2.0mm x 0.85mm | 3.3V | 3ns | 3ns | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||
 | DSC6101JE2A-000.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | Commercial grade | -20°C~70°C | Bulk | DSC61XX | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 1 (Unlimited) | XO (Standard) | 1.71V~3.63V | ±25ppm | CMOS | Enable/Disable | MEMS | 3mA Typ | Blank (User Must Program) | 1MHz~100MHz | 0.035 0.89mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||
| DSC8001BL5 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tube | DSC8001 | 0.197Lx0.126W 5.00mmx3.20mm | e4 | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 1.8V | 150MHz | 10 ppm | CMOS | Standby | MEMS | 5.0mm x 3.2mm x 0.85mm | 3.3V | 3ns | 3ns | 55/45% | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||
| DSC8001BI2T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | 2009 | DSC8001 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; 2.5V 3.3V ARE AVAILABLE; TAPE AND REEL | 1.8V~3.3V | 1.8V | 150MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 5.0mm x 3.2mm x 0.85mm | 3.3V | 3ns | 3ns | 55/45% | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||
| DSC8001AI1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | 2014 | DSC8001 | 0.276Lx0.197W 7.00mmx5.00mm | e4 | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 1.8V | 150MHz | 50 ppm | CMOS | Standby | MEMS | 7.0mm x 5.0mm x 0.85mm | 3.3V | 3ns | 3ns | 55/45% | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||
 | DSC8103CI5 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | 4 | -40°C~85°C | Tube | 2013 | DSC8103 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 2.25V~3.6V | 460MHz | 10 ppm | LVDS | Standby | MEMS | 3.2mm x 2.5mm x 0.85mm | 0.2ns | 0.2ns | Blank (User Must Program) | 10MHz~460MHz | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||
 | DSC8123CI5 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | 460MHz | -40°C~85°C | Tube | 2013 | DSC8123 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 1 (Unlimited) | XO (Standard) | 2.25V~3.6V | ±10ppm | LVDS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.85mm | 0.2ns | 0.2ns | 52/48% | 22mA | Blank (User Must Program) | 10MHz~460MHz | 32mA | NO | 10MHz | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||
| DSC6102JE1A-000.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | Commercial grade | -20°C~70°C | Bulk | DSC61XX | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 1 (Unlimited) | XO (Standard) | 1.71V~3.63V | ±50ppm | CMOS | Enable/Disable | MEMS | 3mA Typ | Blank (User Must Program) | 1MHz~100MHz | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||
| DSC8001CL2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 4 | -40°C~105°C | Tube | DSC8001 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 1.8V | 150MHz | 25 ppm | CMOS | Standby | MEMS | 3.2mm x 2.5mm x 0.85mm | 3.3V | 3ns | 3ns | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||
 | DSC6001ME1A-000.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC60XX | 0.079Lx0.063W 2.00mmx1.60mm | yes | 活跃 | 1 (Unlimited) | XO (Standard) | 1.71V~3.63V | ±50ppm | CMOS | Enable/Disable | MEMS | 1.3mA Typ | 12μA | Blank (User Must Program) | 1MHz~80MHz | 0.035 0.89mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||
 | DSC8104CI2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC8104 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 2.25V~3.6V | 460MHz | 25 ppm | HCSL | Standby | MEMS | 3.2mm x 2.5mm x 0.85mm | 0.4ns | 0.4ns | 52/48% | Blank (User Must Program) | 10MHz~460MHz | 2pF | 42mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||
 | DSC6101MI2A-000.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | Industrial grade | -40°C~85°C | Tape & Reel (TR) | DSC61XX | 0.079Lx0.063W 2.00mmx1.60mm | e4 | yes | 活跃 | 1 (Unlimited) | XO (Standard) | Gold (Au) - with Nickel (Ni) barrier | 1.71V~3.63V | ±25ppm | CMOS | Enable/Disable | MEMS | 3mA Typ | Blank (User Must Program) | 1MHz~100MHz | 3mA | 0.035 0.89mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||
| DSC8001AL5 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 4 | -40°C~105°C | Tube | 2009 | DSC8001 | 0.276Lx0.197W 7.00mmx5.00mm | e4 | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 1.8V | 150MHz | 10 ppm | CMOS | Standby | MEMS | 7.0mm x 5.0mm x 0.85mm | 3.3V | 3ns | 3ns | 15μA | Blank (User Must Program) | 1MHz~150MHz | 15pF | 12.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||
 | DSC6111CE2A-000.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | Commercial grade | -20°C~70°C | Bulk | DSC61XX | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 1 (Unlimited) | XO (Standard) | 1.71V~3.63V | ±25ppm | CMOS | Standby | MEMS | 3mA Typ | 12μA | Blank (User Must Program) | 1MHz~100MHz | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||
| DSC8123CI2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC8123 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 2.25V~3.6V | 460MHz | 25 ppm | LVDS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.85mm | 0.2ns | 0.2ns | 52/48% | Blank (User Must Program) | 10MHz~460MHz | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 |