制造商是'Microchip'
Microchip 振荡器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 底架 | 安装类型 | 包装/外壳 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 电压 - 供电 | 电源电压 | 频率 | 频率稳定性 | 输出量 | 功能 | 基本谐振器 | 最大电流源 | 物理尺寸 | 工作频率 | 工作电源电压 | 上升时间-最大值 | 最大下降时间 | 对称性-最大值 | 电流 - 电源（禁用）（最大值） | 最大电源电压 | 最小电源电压 | 负载电容 | 最大电源电流 | 最大工作周期 | 高度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 评级结果 | |
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 | DSC1001BC1-024.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 0°C~70°C | Tape & Reel (TR) | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 24MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3.3V | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||
| DSC1001BI2-059.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 59MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 5.0mm x 3.2mm x 0.85mm | 59MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
| DSC1001BI5-072.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 72MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 5.0mm x 3.2mm x 0.85mm | 72MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 8.7mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
 | DSC1001CE2-001.8432T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | Automotive grade | -20°C~70°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | 4 | Solder | XO (Standard) | ALSO OPERATES AT 2.5V AND 1.8V SUPPLY VOLTAGE | 1.8V~3.3V | 3.3V | 1.8432MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.9mm | 1.8432MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||
| DSC1001CI2-025.0000B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 25MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 15μA | 15pF | 6.3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
| DSC1001CI2-033.3330T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 33.333MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 33.333MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
| DSC1001CL1-033.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 33MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 33MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||
| DSC1001CL5-010.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 10MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 10MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
| DSC1001CL5-125.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 125MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 125MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 8.7mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
 | DSC1001DE1-024.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 24MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 24MHz | 2ns | 2ns | 55/45% | 15μA | 6.3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||
| DSC1001DE2-027.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 27MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 27MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
| DSC1001DE1-020.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 1.8V~3.3V | 3.3V | 20MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 20MHz | 2ns | 2ns | 55/45% | 15μA | 6.3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||
| DSC1001CL5-016.3840T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 1.8V~3.3V | 3.3V | 16.384MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 16.384MHz | 2ns | 2ns | 55/45% | 15μA | 6.3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||
| DSC1001DI2-024.5760T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 24.576MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 24.576MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||
| DSC1001DI1-100.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 100MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 100MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 8.7mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||
| DSC1001DI5-003.6864T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 3.6864MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 3.6864MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||
| DSC1001DE2-100.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 100MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 100MHz | 2ns | 2ns | 55/45% | 15μA | 8.7mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||
 | DSC1122NE2-150.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1122 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.6V | 150MHz | ±25ppm | LVPECL | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.0.85mm | 150MHz | 52/48% | 22mA | 58mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||
 | DSC1122AI1-155.5200T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead Exposed Pad | -40°C~85°C | Tape & Reel (TR) | DSC1122 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.6V | 155.52MHz | ±50ppm | LVPECL | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.85mm | 155.52MHz | 52/48% | 22mA | 58mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||
| DSC1001CI1-047.3333 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 1.8V~3.3V | 3.3V | 47.3333MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 47.3333MHz | 2ns | 2ns | 55/45% | 15μA | 7.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||
| DSC1123AI2-155.5200T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | -40°C~85°C | Tape & Reel (TR) | DSC1123 | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 85°C | -40°C | 2.25V~3.63V | 155.52MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 32mA | 22mA | 3.6V | 2.25V | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | 7.0104mm | 5.0038mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||
| DSC1001DL2-012.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 12MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 12MHz | 2ns | 2ns | 55/45% | 15μA | 6.3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||
| DSC1001DI1-133.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 133MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 133MHz | 2ns | 2ns | 55/45% | 15μA | 8.7mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||
| DSC1001DL2-024.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 24MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 24MHz | 2ns | 2ns | 55/45% | 15μA | 6.3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||
| DSC1001DI2-009.6000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 9.6MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 9.6MHz | 2ns | 2ns | 55/45% | 15μA | 6.3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 |