制造商是'Microchip'
Microchip 振荡器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 电压 - 供电 | 电源电压 | 频率 | 频率稳定性 | 输出量 | 功能 | 基本谐振器 | 最大电流源 | 物理尺寸 | 工作频率 | 工作电源电压 | 上升时间-最大值 | 最大下降时间 | 对称性-最大值 | 电流 - 电源（禁用）（最大值） | 最大电源电压 | 最小电源电压 | 负载电容 | 最大电源电流 | 最大工作周期 | 高度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 评级结果 | |
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 | DSC1001CI2-125.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 125MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 125MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 8.7mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||
| DSC1001CI2-066.6660T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 66.666MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 66.666MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||
| DSC1001CL5-030.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 105°C | -40°C | 1.8V~3.3V | 30MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 7.2mA | 3.3V | 15μA | 3.6V | 1.7V | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||
 | DSC1001DI2-005.0196T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 5.0196MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 5.0196MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||
| DSC1001DL1-024.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 24MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 24MHz | 2ns | 2ns | 55/45% | 15μA | 6.3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||
| DSC1001DL5-001.8432T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | Automotive grade | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 1.8432MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 1.8432MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
| DSC1001CE2-011.2896T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 1.8V~3.3V | 3.3V | 11.2896MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 11.2896MHz | 2ns | 2ns | 55/45% | 15μA | 6.3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||
 | DSC1103CI5-148.5000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1103 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | XO (Standard) | 85°C | -40°C | 2.25V~3.63V | 148.5MHz | ±10ppm | LVDS | Standby (Power Down) | MEMS | 32mA | 95μA | 32mA | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||
| DSC1001DE1-125.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 125MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 125MHz | 2ns | 2ns | 55/45% | 15μA | 8.7mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||
| DSC1001DC2-027.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 0°C~70°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 70°C | 0°C | 1.8V~3.3V | 27MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 7.2mA | 15μA | 7.2mA | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||
| DSC1001DL1-008.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 8MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 8MHz | 2ns | 2ns | 55/45% | 15μA | 6.3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||
 | DSC1122BE2-050.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -20°C~70°C | Tube | DSC1122 | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.6V | 50MHz | ±25ppm | LVPECL | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 50MHz | 52/48% | 22mA | 58mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||
 | DSC1001BI2-133.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 1.8V~3.3V | 3.3V | 133MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 5.0mm x 3.2mm x 0.85mm | 133MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 8.7mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||
| DSC1001DE1-027.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 27MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 27MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||
| DSC1001CL1-030.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tube | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 1.8V~3.3V | 3.3V | 30MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 30MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||
| DSC1001DL1-024.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 24MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 24MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
| DSC1001DI5-030.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 4 | -40°C~85°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 1.8V~3.3V | 3.3V | 30MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 30MHz | 2ns | 2ns | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||
 | DSC1123AI2-312.5000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | -40°C~85°C | Tube | DSC1123 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.63V | 312.5MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 312.5MHz | 52/48% | 22mA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||
| DSC1123CI2-180.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1123 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 1 (Unlimited) | SMD/SMT | XO (Standard) | 2.25V~3.63V | 180MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 180MHz | 52/48% | 22mA | 2pF | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
| DSC1122AI2-156.2500 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead Exposed Pad | -40°C~85°C | Tube | DSC1122 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.6V | 156.25MHz | ±25ppm | LVPECL | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.85mm | 156.25MHz | 52/48% | 22mA | 58mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||
 | DSC6001CI2A-024.5760 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | YES | -40°C~85°C | Tube | DSC60XX | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 1 (Unlimited) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 24MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 1.3mA Typ | 3.2mm x 2.5mm x 0.85mm | 24.576MHz | 2ns | 2ns | 55/45% | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
 | DSC6001HI2A-016.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | YES | -40°C~85°C | Bag | DSC60XX | 0.063Lx0.047W 1.60mmx1.20mm | 活跃 | 1 (Unlimited) | XO (Standard) | 1.8V~3.3V | 16MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 1.3mA Typ | 1.6mm x 1.2mm x 0.89mm | 16MHz | 2ns | 2ns | 55/45% | 0.035 0.89mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||
| DSC6011HE2A-032.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | YES | -20°C~70°C | Bag | DSC60XX | 0.063Lx0.047W 1.60mmx1.20mm | 活跃 | 1 (Unlimited) | XO (Standard) | 1.8V~3.3V | 32MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 1.3mA Typ | 1.6mm x 1.2mm x 0.89mm | 32MHz | 2ns | 2ns | 55/45% | 0.035 0.89mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||
| DSC6001CE2A-008.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | YES | -20°C~70°C | Tube | DSC60XX | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 1 (Unlimited) | XO (Standard) | 1.8V~3.3V | 8MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 1.3mA Typ | 3.2mm x 2.5mm x 0.85mm | 8MHz | 2ns | 2ns | 55/45% | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||
| DSC6001HE2A-012.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | YES | -20°C~70°C | Bag | DSC60XX | 0.063Lx0.047W 1.60mmx1.20mm | 活跃 | 1 (Unlimited) | XO (Standard) | 1.8V~3.3V | 12MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 1.3mA Typ | 1.6mm x 1.2mm x 0.89mm | 12MHz | 2ns | 2ns | 55/45% | 0.035 0.89mm | ROHS3 Compliant | AEC-Q100 |