制造商是'Microchip'
Microchip 振荡器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | 类型 | 端子表面处理 | 附加功能 | 电容量 | 电压 - 供电 | 频率 | 频率稳定性 | 输出量 | 功能 | 基本谐振器 | 物理尺寸 | 工作频率 | 上升时间-最大值 | 最大下降时间 | 对称性-最大值 | 电流 - 电源（禁用）（最大值） | 负载电容 | 最大电源电流 | 最大工作周期 | 高度 | 座位高度(最大) | RoHS状态 | 评级结果 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | DSC1103CE5-100.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1103 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR | 2.25V~3.63V | 100MHz | ±10ppm | LVDS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 100MHz | 52/48% | 95μA | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||
| DSC1121CI2-010.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1121 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.6V | 10MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 10MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||
| DSC1121CM1-025.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tape & Reel (TR) | DSC1121 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 2.25V~3.6V | 25MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 25MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||
 | DSC1121BM1-048.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tape & Reel (TR) | DSC1121 | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 2.25V~3.6V | 48MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 48MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||
| DSC1121CI2-030.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1121 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 2.25V~3.6V | 30MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 30MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||
 | DSC1123AI2-148.5000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead Exposed Pad | -40°C~85°C | Tape & Reel (TR) | DSC1123 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.63V | 148.5MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 148.5MHz | 52/48% | 22mA | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||
| DSC1101CL2-016.3840T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1101 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; TR | 2.25V~3.6V | 16.384MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.9mm | 16.384MHz | 2ns | 2ns | 55/45% | 95μA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||
| DSC1103CI2-148.5000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1103 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR | 2.25V~3.63V | 148.5MHz | ±25ppm | LVDS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 148.5MHz | 52/48% | 95μA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||
| DSC1121CM1-027.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tube | DSC1121 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.6V | 27MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 27MHz | 2ns | 2ns | 55/45% | 22mA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||
| DSC1123CE2-148.5000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -20°C~70°C | Tube | DSC1123 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.63V | 148.5MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 148.5MHz | 52/48% | 22mA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||
| DSC1123CI1-156.2500T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1123 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.63V | 156.25MHz | ±50ppm | LVDS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 156.25MHz | 52/48% | 22mA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||
| DSC1124BI2-156.2500T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1124 | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 1 (Unlimited) | SMD/SMT | XO (Standard) | 2.25V~3.6V | 156.25MHz | ±25ppm | HCSL | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 156.25MHz | 0.4ns | 52/48% | 22mA | 2pF | 42mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||
| DSC1101CM2-062.2080 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tube | DSC1101 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 2.25V~3.6V | 62.208MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.9mm | 62.208MHz | 2ns | 2ns | 55/45% | 95μA | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||
| DSC1121BM1-050.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | 6 | -55°C~125°C | Tube | DSC1121 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Matte Tin (Sn) | 2.25V~3.6V | 50MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 50MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||
| DSC1121BI2-050.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | 6 | -40°C~85°C | Tube | DSC1121 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Matte Tin (Sn) | 2.25V~3.6V | 50MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 50MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||
| DSC1121BI2-100.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1121 | 0.197Lx0.126W 5.00mmx3.20mm | e4 | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.6V | 100MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 100MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||
| DSC1121CI1-025.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1121 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.6V | 25MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 25MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||
| DSC1123BI1-100.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1123 | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.63V | 100MHz | ±50ppm | LVDS | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 100MHz | 52/48% | 22mA | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||
| DSC1123AI5-150.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead Exposed Pad | -40°C~85°C | Tube | DSC1123 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 2.25V~3.63V | 150MHz | ±10ppm | LVDS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 150MHz | 52/48% | 22mA | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||
| DSC1123BI1-200.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1123 | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 2.25V~3.63V | 200MHz | ±50ppm | LVDS | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 200MHz | 52/48% | 22mA | 2pF | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||
| DSC1101BM2-025.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tube | DSC1101 | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.6V | 25MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 5.0mm x 3.2mm x 0.85mm | 25MHz | 2ns | 2ns | 55/45% | 95μA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||
| DSC1101BM2-100.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tape & Reel (TR) | DSC1101 | 0.197Lx0.126W 5.00mmx3.20mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | STANDBY; ENABLE/DISABLE FUNCTION; TR | 2.25V~3.6V | 100MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 5.0mm x 3.2mm x 0.85mm | 100MHz | 2ns | 2ns | 55/45% | 95μA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||
| DSC1101BM2-100.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tube | DSC1101 | 0.197Lx0.126W 5.00mmx3.20mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.6V | 100MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 5.0mm x 3.2mm x 0.85mm | 100MHz | 2ns | 2ns | 55/45% | 95μA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||
| DSC1121AM1-030.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | -55°C~125°C | Tape & Reel (TR) | DSC1121 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 15pF | 2.25V~3.6V | 30MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 30MHz | 2ns | 2ns | 55/45% | 22mA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||
| DSC1121BI2-013.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1121 | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.6V | 13MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 13MHz | 2ns | 2ns | 55/45% | 22mA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 |