制造商是'Microchip'
Microchip 振荡器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 电压 - 供电 | 电源电压 | 频率 | 频率稳定性 | 输出量 | 功能 | 基本谐振器 | 最大电流源 | 物理尺寸 | 工作频率 | 工作电源电压 | 上升时间-最大值 | 最大下降时间 | 对称性-最大值 | 电源电压-最大值(Vsup) | 电流 - 电源（禁用）（最大值） | 最大电源电压 | 最小电源电压 | 负载电容 | 最大电源电流 | 扩频带宽 | 最大工作周期 | 高度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 评级结果 |
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 | DSC1033CI1-048.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1033, PureSilicon™ | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 3.3V | 48MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 4mA Typ | 3.2mm x 2.5mm x 0.85mm | 48MHz | 3.3V | 2ns | 2ns | 55/45% | 3.6V | 1μA | 15pF | 4mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||
 | DSC1121BM1-027.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tape & Reel (TR) | DSC1121 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.25V~3.6V | 27MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 27MHz | 2ns | 2ns | 55/45% | 22mA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
 | DSC1103AE1-100.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1103 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR | 2.25V~3.63V | 100MHz | ±50ppm | LVDS | Standby (Power Down) | MEMS | 7.0mm x 5.0mm x 0.9mm | 100MHz | 52/48% | 95μA | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
 | DSC1101DM1-020.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | 6 | -55°C~125°C | Tape & Reel (TR) | DSC1101 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; TR | 2.25V~3.6V | 20MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.9mm | 20MHz | 2ns | 2ns | 55/45% | 95μA | 15pF | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||
 | DSC1103CI5-106.2500T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1103 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; TR | 2.25V~3.63V | 106.25MHz | ±10ppm | LVDS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.9mm | 106.25MHz | 52/48% | 95μA | 2pF | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||
| DSC1123AI1-120.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | 6 | -40°C~85°C | Tape & Reel (TR) | DSC1123 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.63V | 120MHz | ±50ppm | LVDS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 120MHz | 52/48% | 22mA | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
| DSC1123BI2-025.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1123 | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.63V | 25MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 25MHz | 52/48% | 22mA | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||
| DSC1101CI1-148.5000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1101 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.25V~3.6V | 148.5MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.9mm | 148.5MHz | 2ns | 2ns | 55/45% | 95μA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||
 | DSC1033DE1-013.5600 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tube | DSC1033, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 1 (Unlimited) | XO (Standard) | 3.3V | 3.3V | 13.56MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 2.5mm x 2.0mm x 0.85mm | 13.56MHz | 2ns | 2ns | 55/45% | 1μA | 3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||
| DSC1033DI2-012.2880 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1033, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 1 (Unlimited) | XO (Standard) | 3.3V | 3.3V | 12.288MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 2.5mm x 2.0mm x 0.85mm | 12.288MHz | 2ns | 2ns | 55/45% | 1μA | 3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||
| DSC1033DI1-012.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1033, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 3.3V | 12MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 2.5mm x 2.0mm x 0.85mm | 12MHz | 3.3V | 2ns | 2ns | 55/45% | 3.6V | 1μA | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||
 | DSC6331MI1CA-038.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | YES | -40°C~85°C | Bag | DSC63XX | 0.079Lx0.063W 2.00mmx1.60mm | e3 | 活跃 | 1 (Unlimited) | XO (Standard) | Matte Tin (Sn) | TUBE | 1.8V~3.3V | 38MHz | LVCMOS | MEMS | 3mA Typ | 2.0mm x 1.6mm x 0.89mm | 38MHz | 2ns | 2ns | 55/45% | ±1.00% Center Spread | 0.035 0.89mm | ROHS3 Compliant | ||||||||||||||||||||||
| DSC1101DM2-008.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tube | DSC1101 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.25V~3.6V | 8MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.9mm | 8MHz | 2ns | 2ns | 55/45% | 95μA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||
| DSC1121BM1-016.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tape & Reel (TR) | DSC1121 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.25V~3.6V | 16MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 16MHz | 2ns | 2ns | 55/45% | 22mA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
| DSC1121CE2-025.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1121 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.6V | 25MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 25MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||
| DSC1121CE1-033.3333T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1121 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 70°C | -20°C | 2.25V~3.6V | 33.3333MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 35mA | 22mA | 3.6V | 2.25V | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||
| DSC1121CM2-027.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tape & Reel (TR) | DSC1121 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.25V~3.6V | 27MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 27MHz | 2ns | 2ns | 55/45% | 22mA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
| DSC1101CM1-008.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tube | DSC1101 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.6V | 8MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.9mm | 8MHz | 2ns | 2ns | 55/45% | 95μA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||
| DSC1101DM1-020.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tube | DSC1101 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 2.25V~3.6V | 20MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.9mm | 20MHz | 2ns | 2ns | 55/45% | 95μA | 15pF | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||
| DSC1104AI2-100.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1104 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.6V | 100MHz | ±25ppm | HCSL | Standby (Power Down) | MEMS | 7.0mm x 5.0mm x 0.9mm | 100MHz | 0.4ns | 52/48% | 95μA | 42mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||
| DSC1103DI5-125.0060 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1103 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.63V | 125.006MHz | ±10ppm | LVDS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.9mm | 125.006MHz | 52/48% | 95μA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||||
| DSC1121CI1-050.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1121 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.6V | 50MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 50MHz | 2ns | 2ns | 55/45% | 22mA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||
 | DSC1121CM1-066.6660T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD, No Lead | YES | -55°C~125°C | Tape & Reel (TR) | DSC1121 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.25V~3.6V | 66.666MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 22mA | 3.2mm x 2.5mm x 0.9mm | 66.666MHz | 2ns | 2ns | 55/45% | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||
| DSC1123AI5-125.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | 6 | -40°C~85°C | Tape & Reel (TR) | DSC1123 | 0.276Lx0.197W 7.00mmx5.00mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.63V | 125MHz | ±10ppm | LVDS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.85mm | 125MHz | 52/48% | 22mA | 15pF | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||
| DSC1033DI1-016.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1033, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 3.3V | 16MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 2.5mm x 2.0mm x 0.85mm | 16MHz | 3.3V | 2ns | 2ns | 55/45% | 3.6V | 1μA | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant |