制造商是'Microchip'
Microchip 振荡器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | 尺寸/尺寸 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 电压 - 供电 | 电源电压 | 频率 | 频率稳定性 | 输出量 | 功能 | 基本谐振器 | 最大电流源 | 物理尺寸 | 工作频率 | 工作电源电压 | 上升时间-最大值 | 最大下降时间 | 对称性-最大值 | 电源电压-最大值(Vsup) | 电流 - 电源（禁用）（最大值） | 最大电源电压 | 最小电源电压 | 负载电容 | 最大电源电流 | 扩频带宽 | 输出负载 | 最大工作周期 | 高度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 无铅 | 评级结果 | |
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 | DSC1001DL5-033.3330T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | Automotive grade | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 33.333MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 33.333MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||
 | DSC1001BI5-133.3330T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 133.333MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 5.0mm x 3.2mm x 0.85mm | 133.333MHz | 2ns | 2ns | 55/45% | 15μA | 8.7mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||
| DSC1030DI1-042.5000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1030, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 1 (Unlimited) | XO (Standard) | 3V | 3V | 42.5MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 4mA Typ | 2.5mm x 2.0mm x 0.85mm | 42.5MHz | 2ns | 2ns | 55/45% | 1μA | 4mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||
 | DSC1033CE2-050.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tube | DSC1033, PureSilicon™ | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 1 (Unlimited) | SMD/SMT | XO (Standard) | 3.3V | 3.3V | 50MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 4mA Typ | 3.2mm x 2.5mm x 0.85mm | 50MHz | 2ns | 2ns | 55/45% | 1μA | 15pF | 4mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||
| DSC1033BI1-025.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1033, PureSilicon™ | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 3.3V | 25MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 5.0mm x 3.2mm x 0.85mm | 25MHz | 3.3V | 2ns | 2ns | 55/45% | 3.6V | 1μA | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||
| DSC1033BE2-024.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tube | DSC1033, PureSilicon™ | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 1 (Unlimited) | XO (Standard) | 3.3V | 3.3V | 24MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 5.0mm x 3.2mm x 0.85mm | 24MHz | 2ns | 2ns | 55/45% | 1μA | 3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||
| DSC1001BE2-010.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | YES | -20°C~70°C | Tube | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | e4 | 活跃 | 1 (Unlimited) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 3.3V | 10MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 6.3mA | 5.0mm x 3.2mm x 0.85mm | 10MHz | 2ns | 2ns | 55/45% | 15μA | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||
 | DSC1001AI5-032.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead Exposed Pad | -40°C~85°C | Tube | DSC1001 | 0.276Lx0.197W 7.00mmx5.00mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 3.3V | 32MHz | ±10ppm | CMOS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.85mm | 32MHz | 2ns | 2ns | 55/45% | 15μA | 7.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||
 | DSC6331MI1BA-024.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | YES | -40°C~85°C | Bag | DSC63XX | 0.079Lx0.063W 2.00mmx1.60mm | e3 | 活跃 | 1 (Unlimited) | XO (Standard) | Matte Tin (Sn) | TUBE | 1.8V~3.3V | 24MHz | LVCMOS | MEMS | 3mA Typ | 2.0mm x 1.6mm x 0.89mm | 24MHz | 2ns | 2ns | 55/45% | ±0.50% Center Spread | 0.035 0.89mm | ROHS3 Compliant | ||||||||||||||||||||||||||
| DSC1018BC1-100.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 0°C~70°C | Tube | DSC1018 | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 1 (Unlimited) | XO (Standard) | 1.8V | 1.8V | 100MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 5mA Typ | 5.0mm x 3.2mm x 0.85mm | 100MHz | 2ns | 2ns | 55/45% | 1μA | 5mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||
| DSC1033CI1-050.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1033, PureSilicon™ | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 1 (Unlimited) | SMD/SMT | XO (Standard) | 3.3V | 3.3V | 50MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 4mA Typ | 3.2mm x 2.5mm x 0.85mm | 50MHz | 2ns | 2ns | 55/45% | 1μA | 15pF | 4mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||
 | MX553LBB148M500 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 6-SMD, No Lead | YES | -40°C~85°C | Tube | 2016 | MX55 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.375V~3.63V | 148.5MHz | ±50ppm | LVDS | Enable/Disable | Crystal | 90mA | 5.0mm x 3.2mm x 1.4mm | 148.5MHz | 0.4ns | 0.4ns | 55/45% | 0.055 1.40mm | Non-RoHS Compliant | |||||||||||||||||||||||||
| DSC1001DL5-026.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | Automotive grade | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 26MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 26MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||
| DSC1001CI2-016.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 16MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 16MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||
| DSC1001CI2-020.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 20MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 20MHz | 2ns | 2ns | 55/45% | 15μA | 6.3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||
| DSC1001BI1-038.4000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 38.4MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 5.0mm x 3.2mm x 0.85mm | 38.4MHz | 2ns | 2ns | 55/45% | 15μA | 7.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||
| DSC1003DL2-008.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1003 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; TR; SUPPLY VOLTAGE OF 1.8V & 2.5V ALSO AVAILABLE | 1.7V~3.6V | 3.3V | 8MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 8MHz | 3ns | 3ns | 55/45% | 15μA | 6mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||
 | DSC1123BI1-200.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | 6 | -40°C~85°C | Tape & Reel (TR) | DSC1123 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 85°C | -40°C | 2.25V~3.63V | 200MHz | ±50ppm | LVDS | Enable/Disable | MEMS | 32mA | 22mA | 3.6V | 2.25V | 2pF | 32mA | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||
| DSC1003DL2-100.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1003 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 1.7V~3.6V | 3.3V | 100MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 100MHz | 2ns | 2ns | 55/45% | 15μA | 9.6mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||
| DSC1001CI2-096.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 96MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 96MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 8.7mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||
| MX553BBA312M500-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | MX55 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.375V~3.63V | 312.5MHz | ±50ppm | Enable/Disable | Crystal | 5.0mm x 3.2mm x 1.4mm | 312.5MHz | 0.35ns | 0.35ns | 55/45% | 120mA | 50 OHM | 1.397mm | 0.055 1.40mm | ROHS3 Compliant | ||||||||||||||||||||||||
| DSC1001AE1-027.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1001 | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 70°C | -20°C | 1.8V~3.3V | 27MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 7.2mA | 15μA | 7.2mA | 889μm | 0.035 0.90mm | 7.0104mm | 5.0038mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||
 | DSC1122AI5-155.5200 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | -40°C~85°C | Tube | DSC1122 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.6V | 155.52MHz | ±10ppm | LVPECL | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.85mm | 155.52MHz | 52/48% | 22mA | 58mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||||||||
| DSC1001AI5-100.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead Exposed Pad | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.276Lx0.197W 7.00mmx5.00mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 100MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 7.0mm x 5.0mm x 0.85mm | 100MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 8.7mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||
| DSC1001BI2-027.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 27MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 5.0mm x 3.2mm x 0.85mm | 27MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 |