制造商是'Microchip'
Microchip 振荡器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | 尺寸/尺寸 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | 类型 | 最高工作温度 | 最小工作温度 | 附加功能 | 电压 - 供电 | 电源电压 | 频率 | 频率稳定性 | 输出量 | 功能 | 基本谐振器 | 最大电流源 | 物理尺寸 | 工作频率 | 工作电源电压 | 上升时间-最大值 | 最大下降时间 | 对称性-最大值 | 电源电压-最大值(Vsup) | 电流 - 电源（禁用）（最大值） | 最大电源电压 | 最小电源电压 | 负载电容 | 最大电源电流 | 最大工作周期 | 高度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 评级结果 |
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 | DSC1001CL1-076.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 105°C | -40°C | 1.8V~3.3V | 76MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 8.7mA | 3.3V | 15μA | 3.6V | 1.7V | 15pF | 8.7mA | 55 % | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||
 | DSC1001DI2-024.0004T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 4 | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 85°C | -40°C | 1.8V~3.3V | 24.0004MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 6.3mA | 15μA | 3.6V | 2.7V | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||
| DSC1001DI2-001.2000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 85°C | -40°C | 1.8V~3.3V | 1.2MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 6.3mA | 15μA | 3.6V | 2.7V | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
 | DSC1001BE1-040.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | XO (Standard) | 70°C | -20°C | 1.8V~3.3V | 40MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 7.2mA | 15μA | 7.2mA | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||
| DSC1001BC1-040.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 0°C~70°C | Tape & Reel (TR) | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | XO (Standard) | 70°C | 0°C | 1.8V~3.3V | 40MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 7.2mA | 15μA | 7.2mA | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||
 | DSC1033AI1-075.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead Exposed Pad | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 85°C | -40°C | 3.3V | 75MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 4mA Typ | 3.3V | 1μA | 3.6V | 3V | 15pF | 4mA | 55 % | 889μm | 0.035 0.90mm | 7.0104mm | 5.0038mm | ROHS3 Compliant | |||||||||||||
| DSC1033BI1-012.2880T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 85°C | -40°C | 3.3V | 12.288MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 3.3V | 1μA | 3.6V | 3V | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | |||||||||||||
| DSC1033BI2-027.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 85°C | -40°C | 3.3V | 27MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 3.3V | 1μA | 3.6V | 3V | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | |||||||||||||
| DSC1033CI1-014.7456T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 85°C | -40°C | 3.3V | 14.7456MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 3.3V | 1μA | 3.6V | 3V | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | |||||||||||||
| DSC1033CI1-030.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 85°C | -40°C | 3.3V | 30MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 3.3V | 1μA | 3.6V | 3V | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | |||||||||||||
| DSC1033CI1-007.3728T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 85°C | -40°C | 3.3V | 7.3728MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 3.3V | 1μA | 3.6V | 3V | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | |||||||||||||
| DSC1033DI1-010.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 85°C | -40°C | 3.3V | 10MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 3.3V | 1μA | 3.6V | 3V | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | |||||||||||||
| DSC1033CE1-120.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 70°C | -20°C | 3.3V | 120MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 5mA Typ | 3.3V | 1μA | 3.6V | 3V | 15pF | 5mA | 55 % | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | |||||||||||||
| DSC1033DI2-060.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 85°C | -40°C | 3.3V | 60MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 4mA Typ | 3.3V | 1μA | 3.6V | 3V | 15pF | 4mA | 55 % | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | |||||||||||||
| DSC1033DI1-018.4320T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 85°C | -40°C | 3.3V | 18.432MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 3.3V | 1μA | 3.6V | 3V | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | |||||||||||||
| DSC1033DI1-080.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 85°C | -40°C | 3.3V | 80MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 5mA Typ | 1μA | 3.6V | 3V | 15pF | 5mA | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | |||||||||||||||
| DSC1033CI1-027.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 85°C | -40°C | 3.3V | 27MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 3.3V | 1μA | 3.6V | 3V | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | |||||||||||||
| DSC1033BE2-024.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; TR, 7/13 INCH | 3.3V | 24MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 5.0mm x 3.2mm x 0.85mm | 24MHz | 3.3V | 2ns | 2ns | 55/45% | 3.6V | 1μA | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||
| DSC1030BI1-066.6666T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1030, PureSilicon™ | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 85°C | -40°C | 3V | 66.6666MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 4mA Typ | 3V | 1μA | 3.3V | 2.7V | 15pF | 4mA | 55 % | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | |||||||||||||
| DSC1033AE1-133.3333T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead Exposed Pad | -20°C~70°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 70°C | -40°C | 3.3V | 133.3333MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 10mA | 3.3V | 1μA | 3.6V | 3V | 15pF | 10mA | 55 % | 889μm | 0.035 0.90mm | 7.0104mm | 5.0038mm | ROHS3 Compliant | |||||||||||||
 | DSC557-0334SI0T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | -40°C~85°C | Tape & Reel (TR) | 2013 | DSC557-03 | 0.197Lx0.177W 5.00mmx4.50mm | 活跃 | 3 (168 Hours) | XO (Standard) | 85°C | -40°C | 2.25V~3.6V | 100MHz | ±100ppm | HCSL, LVDS | Enable/Disable | MEMS | 60mA Typ | 23mA | 60mA | 1.0922mm | 0.043 1.10mm | 5.0038mm | 4.4958mm | ROHS3 Compliant | ||||||||||||||||||
| DSC1001BC1-040.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 0°C~70°C | Tube | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | XO (Standard) | 70°C | 0°C | 1.8V~3.3V | 40MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 7.2mA | 15μA | 7.2mA | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||
| DSC1030BC1-024.5760 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 0°C~70°C | Tube | DSC1030, PureSilicon™ | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | XO (Standard) | 70°C | 0°C | 3V | 24.576MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA | 1μA | 3mA | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | |||||||||||||||||||
| DSC1033DI2-005.1200 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1033, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 85°C | -40°C | 3.3V | 5.12MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 1μA | 3mA | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | |||||||||||||||||||
 | DSC1123BI2-224.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1123 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 85°C | -40°C | 2.25V~3.63V | 224MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 32mA | 22mA | 3.6V | 2.25V | 2pF | 32mA | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | AEC-Q100 |