制造商是'Microchip'
Microchip 振荡器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 电压 - 供电 | 电源电压 | 频率 | 频率稳定性 | 输出量 | 功能 | 基本谐振器 | 最大电流源 | 物理尺寸 | 工作频率 | 工作电源电压 | 上升时间-最大值 | 最大下降时间 | 对称性-最大值 | 电源电压-最大值(Vsup) | 电流 - 电源(禁用)(最大值) | 最大电源电压 | 最小电源电压 | 负载电容 | 最大电源电流 | 最大工作周期 | 高度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 评级结果 |
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![]() | DSC1001CE2-010.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 10MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 10MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
![]() | DSC1001CL1-032.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 1.8V~3.3V | 3.3V | 32MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 32MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||
![]() | DSC1001DE1-074.2500T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 74.25MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 74.25MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 8.7mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
![]() | DSC1018CI1-026.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1018 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; TR, 7/13 INCH | 1.8V | 26MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 3.2mm x 2.5mm x 0.85mm | 26MHz | 1.8V | 2ns | 2ns | 55/45% | 1.95V | 1μA | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||
![]() | DSC1001DI5-066.5800T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 85°C | -40°C | 1.8V~3.3V | 66.58MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 7.2mA | 15μA | 7.2mA | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
![]() | DSC1030BC1-012.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 0°C~70°C | Tape & Reel (TR) | DSC1030, PureSilicon™ | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; TR, 7/13 INCH | 3V | 12MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 5.0mm x 3.2mm x 0.85mm | 12MHz | 3V | 2ns | 2ns | 55/45% | 1μA | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||
![]() | DSC1033DI1-004.9152T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; TR, 7/13 INCH | 3.3V | 4.9152MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 2.5mm x 2.0mm x 0.85mm | 4.9152MHz | 3.3V | 2ns | 2ns | 55/45% | 3.6V | 1μA | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||
![]() | DSC1001CI5-150.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | XO (Standard) | 1.8V~3.3V | 3.3V | 150MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 150MHz | 2ns | 2ns | 55/45% | 15μA | 12.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||
![]() | DSC1001DE1-030.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 1.8V~3.3V | 3.3V | 30MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 30MHz | 2ns | 2ns | 55/45% | 15μA | 7.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||
![]() | DSC1001DI2-010.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 1.8V~3.3V | 3.3V | 10MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 10MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||
![]() | DSC1001DI1-075.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 1.8V~3.3V | 3.3V | 75MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 75MHz | 2ns | 2ns | 55/45% | 15μA | 8.7mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||
![]() | DSC1101BL1-012.5000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~105°C | Tube | DSC1101 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 105°C | -40°C | 2.25V~3.6V | 12.5MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 35mA | 95μA | 3.6V | 2.25V | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | |||||||||||||||
![]() | DSC1001DI1-075.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 1.8V~3.3V | 3.3V | 75MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 75MHz | 2ns | 2ns | 55/45% | 15μA | 8.7mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||
![]() | DSC1001AI1-001.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD, No Lead Exposed Pad | YES | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.276Lx0.197W 7.00mmx5.00mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 3.3V | 1MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 6.3mA | 7.0mm x 5.0mm x 0.85mm | 1MHz | 2ns | 2ns | 55/45% | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||
![]() | DSC1123BL5-125.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD, No Lead | YES | -40°C~105°C | Tape & Reel (TR) | DSC1123 | 0.197Lx0.126W 5.00mmx3.20mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.63V | 125MHz | ±10ppm | LVDS | Enable/Disable | MEMS | 22mA | 5.0mm x 3.2mm x 0.85mm | 125MHz | 52/48% | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||
![]() | DSC1123CL1-200.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~105°C | Tube | DSC1123 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 1 (Unlimited) | SMD/SMT | XO (Standard) | 105°C | -40°C | 2.25V~3.63V | 200MHz | ±50ppm | LVDS | Enable/Disable | MEMS | 32mA | 22mA | 3.6V | 2.25V | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||
![]() | DSC1001CL2-060.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tube | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | XO (Standard) | 105°C | -40°C | 1.8V~3.3V | 60MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 7.2mA | 15μA | 7.2mA | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
![]() | DSC1033AC2-100.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead Exposed Pad | 0°C~70°C | Tube | DSC1033, PureSilicon™ | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 70°C | 0°C | 3.3V | 100MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 5mA Typ | 1μA | 5mA | 889μm | 0.035 0.90mm | 7.0104mm | 5.0038mm | ROHS3 Compliant | ||||||||||||||||||||
![]() | DSC1001CL2-060.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | XO (Standard) | 105°C | -40°C | 1.8V~3.3V | 60MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 7.2mA | 15μA | 7.2mA | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
![]() | DSC1033DI1-125.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1033, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 85°C | -40°C | 3.3V | 125MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 10mA | 1μA | 10mA | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | ||||||||||||||||||||
![]() | DSC1033BI2-050.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | XO (Standard) | 85°C | -40°C | 3.3V | 50MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 4mA Typ | 1μA | 4mA | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | ||||||||||||||||||||
![]() | DSC1033DI2-019.6608T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 85°C | -40°C | 3.3V | 19.6608MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 1μA | 3mA | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | ||||||||||||||||||||
![]() | DSC1004CL2-027.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD, No Lead | YES | -40°C~105°C | Tube | DSC1004 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 27MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 7.1mA | 3.2mm x 2.5mm x 0.85mm | 27MHz | 2ns | 2ns | 55/45% | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||
![]() | DSC1001BE2-024.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 70°C | -20°C | 1.8V~3.3V | 24MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 6.3mA | 3.3V | 15μA | 3.6V | 1.7V | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
![]() | DSC1001BL5-027.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 105°C | -40°C | 1.8V~3.3V | 27MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 7.2mA | 3.3V | 15μA | 3.6V | 1.7V | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | AEC-Q100 |