制造商是'Microchip'
Microchip 振荡器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 越来越多的功能 | 引脚数 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | 尺寸/尺寸 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 电压 - 供电 | 电源电压 | Reach合规守则 | 频率 | 频率稳定性 | 输出量 | 引脚数量 | 功能 | 基本谐振器 | 最大电流源 | 物理尺寸 | 工作频率 | 工作电源电压 | 上升时间-最大值 | 最大下降时间 | 对称性-最大值 | 电流 - 电源（禁用）（最大值） | 最大电源电压 | 最小电源电压 | 振荡器类型 | 负载电容 | 最大电源电流 | 输出负载 | 频率调整-机械 | 最大工作周期 | 输出电平 | 高度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 评级结果 | |||||||||||||||||||||||||||||||||||
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 | DSC1122AE1-123.5200 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | -20°C~70°C | Tube | DSC1122 | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 70°C | -20°C | 2.25V~3.6V | 123.52MHz | ±50ppm | LVPECL | Enable/Disable | MEMS | 58mA | 22mA | 3.6V | 2.25V | 58mA | 52 % | 889μm | 0.035 0.90mm | 7.0104mm | 5.0038mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1001BI2-003.5700T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 85°C | -40°C | 1.8V~3.3V | 3.57MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 6.3mA | 3.3V | 15μA | 3.6V | 1.7V | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1018CE1-026.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1018 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 70°C | -20°C | 1.8V | 26MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 1.8V | 1μA | 1.95V | 1.65V | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VCC6-LCB-156M250000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8542.31.00.01 | 156.25 | ±50 | 55 | 3.135 | 3.465 | 3.3 | -10 | 70 | 表面贴装 | 1.6(Max) | 7 | 5 | 6 | Tape & Reel (TR) | 最后一次购买 | 微芯片技术 | EAR99 | * | 活跃 | 晶体振荡器 | 6 | LVDS | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1001BL5-026.7000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD, No Lead | YES | -40°C~105°C | Tube | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 26.7MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 6.3mA | 5.0mm x 3.2mm x 0.85mm | 26.7MHz | 2ns | 2ns | 55/45% | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1003AL5-025.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD, No Lead Exposed Pad | YES | -40°C~105°C | Tape & Reel (TR) | DSC1003 | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; TR; SUPPLY VOLTAGE OF 1.8V & 2.5V ALSO AVAILABLE | 1.7V~3.6V | 3.3V | 25MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 6.3mA | 7.0mm x 5.0mm x 0.85mm | 25MHz | 3ns | 3ns | 55/45% | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1102CI1-125.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD, No Lead | YES | -40°C~85°C | Tape & Reel (TR) | DSC1102 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; LVDS HCSL O/P ALSO AVAILABLE; TAPE AND REEL | 2.25V~3.6V | 125MHz | ±50ppm | LVPECL | Standby (Power Down) | MEMS | 58mA | 3.2mm x 2.5mm x 0.85mm | 125MHz | 52/48% | 95μA | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1001DL2-032.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 3.3V | 32MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 32MHz | 2ns | 2ns | 55/45% | 15μA | 7.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001DL5-001.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | Automotive grade | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 105°C | -40°C | 1.8V~3.3V | 1MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 6.3mA | 15μA | 6.3mA | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC2033FI2-G0002 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 years ago) | 8542.39.00.01 | 125|100 | ±25 | ±5 (1st) | 52 | 2.25 | 3.6 | 3.3 | -40 | 85 | Industrial | QFN EP | 表面贴装 | 3.2 | 2.5 | 14 | Tray | 活跃 | Compliant | ROHS COMPLIANT, PLASTIC, QFN, 14 PIN | -40 °C | 100 MHz | 2.25 V | 85 °C | 有 | DSC2033FI2-G0002 | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 3.6 V | 5.61 | DSC2033 | Standard | YES | SURFACE MOUNT | 微芯片技术 | EAR99 | Tube | * | Unconfirmed | SMD/SMT | 时钟振荡器 | 85 °C | -40 °C | TRI-STATE; ENABLEDISABLE FUNCTION; DIFFERENTIAL OUTPUT; MULTI O/P FREQ ARE AVAILABLE; TUBE | compliant | 460 MHz | 25 ppm | 14 | 3.2mm x 2.5mm x 0.85mm | 0.35 ns | 0.35 ns | 52/48 % | 3.6 V | 2.25 V | LVDS | 2 pF | 100 OHM | NO | LVDS | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | DSC1121DI5-125.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1121 | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.6V | 125MHz | ±10ppm | CMOS | Enable/Disable | MEMS | 2.5mm x 2.0mm x 0.85mm | 125MHz | 2ns | 2ns | 55/45% | 22mA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC557-0333FE0T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 14-VFQFN Exposed Pad | -20°C~70°C | Tape & Reel (TR) | 2013 | DSC557-03 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | XO (Standard) | 70°C | -20°C | 2.25V~3.6V | 100MHz | ±100ppm | LVDS | Enable/Disable | MEMS | 60mA Typ | 23mA | 60mA | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001CL5-032.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD, No Lead | YES | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 3.3V | 32MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 7.2mA | 3.2mm x 2.5mm x 0.85mm | 32MHz | 2ns | 2ns | 55/45% | 15μA | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001CL5-150.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 4 | -40°C~105°C | Tube | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 3.3V | 150MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 150MHz | 2ns | 2ns | 15μA | 15pF | 12.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1033CI1-001.9800T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; TR, 7/13 INCH | 3V~3.6V | 3.3V | 1.98MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 3.2mm x 2.5mm x 0.85mm | 1.98MHz | 2ns | 2ns | 55/45% | 1μA | 3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1033CI2-048.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1033, PureSilicon™ | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | XO (Standard) | 85°C | -40°C | 3.3V | 48MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 10mA | 1μA | 10mA | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1101CM2-002.5000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tube | DSC1101 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | XO (Standard) | 125°C | -55°C | 2.25V~3.6V | 2.5MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 35mA | 95μA | 35mA | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1101AE2-040.6080T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | -20°C~70°C | Tape & Reel (TR) | DSC1101 | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 70°C | -20°C | 2.25V~3.6V | 40.608MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 35mA | 95μA | 35mA | 889μm | 0.035 0.90mm | 7.0104mm | 5.0038mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1103AE2-050.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | -20°C~70°C | Tape & Reel (TR) | DSC1103 | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 70°C | -20°C | 2.25V~3.63V | 50MHz | ±25ppm | LVDS | Standby (Power Down) | MEMS | 32mA | 95μA | 32mA | 889μm | 0.035 0.90mm | 7.0104mm | 5.0038mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1103CI5-075.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1103 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | XO (Standard) | 85°C | -40°C | 2.25V~3.63V | 75MHz | ±10ppm | LVDS | Standby (Power Down) | MEMS | 32mA | 95μA | 32mA | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1121BE5-025.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1121 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | XO (Standard) | 70°C | -20°C | 2.25V~3.6V | 25MHz | ±10ppm | CMOS | Enable/Disable | MEMS | 35mA | 22mA | 35mA | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1121DM2-040.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tape & Reel (TR) | DSC1121 | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 125°C | -55°C | 2.25V~3.6V | 40MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 35mA | 22mA | 35mA | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1103AI1-160.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1103 | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 85°C | -40°C | 2.25V~3.63V | 160MHz | ±50ppm | LVDS | Standby (Power Down) | MEMS | 32mA | 95μA | 32mA | 889μm | 0.035 0.90mm | 7.0104mm | 5.0038mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1103NI1-074.2500T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1103 | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 85°C | -40°C | 2.25V~3.63V | 74.25MHz | ±50ppm | LVDS | Standby (Power Down) | MEMS | 32mA | 95μA | 32mA | 889μm | 0.035 0.90mm | 7.0104mm | 5.0038mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1121AI2-010.0000C | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | -40°C~85°C | Tape & Reel (TR) | DSC1121 | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 85°C | -40°C | 2.25V~3.6V | 10MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 35mA | 22mA | 35mA | 889μm | 0.035 0.90mm | 7.0104mm | 5.0038mm | ROHS3 Compliant | AEC-Q100 |