制造商是'Microchip'
Microchip 振荡器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 电容量 | 电压 - 供电 | 电源电压 | 频率 | 频率稳定性 | 输出量 | 功能 | 基本谐振器 | 最大电流源 | 物理尺寸 | 工作频率 | 工作电源电压 | 上升时间-最大值 | 最大下降时间 | 对称性-最大值 | 电流 - 电源（禁用）（最大值） | 负载电容 | 最大电源电流 | 最大工作周期 | 高度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 评级结果 | |
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 | DSC1122AI1-125.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | -40°C~85°C | Tube | DSC1122 | 0.276Lx0.197W 7.00mmx5.00mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.6V | 125MHz | ±50ppm | LVPECL | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.85mm | 125MHz | 52/48% | 22mA | 58mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||
 | DSC1123NI2-125.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1123 | 0.276Lx0.197W 7.00mmx5.00mm | e4 | 活跃 | 1 (Unlimited) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.63V | 125MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.85mm | 125MHz | 52/48% | 22mA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||
 | DSC1001CI2-032.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 3.3V | 32MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 32MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
 | DSC1001DI2-032.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e4 | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 3.3V | 32MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 32MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||
| DSC1001CI5-150.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 3.3V | 150MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 150MHz | 2ns | 2ns | 55/45% | 15μA | 12.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||
 | DSC1001BI2-032.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | e4 | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 3.3V | 32MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 5.0mm x 3.2mm x 0.85mm | 32MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||
| DSC1001DL5-032.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | Automotive grade | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e4 | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 3.3V | 32MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 32MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||
| DSC1001CL5-032.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tube | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 3.3V | 32MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 32MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
| DSC1001DE2-032.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e4 | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 3.3V | 32MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 32MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||
| DSC1001DI5-150.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 4 | -40°C~85°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e4 | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 3.3V | 150MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 150MHz | 2ns | 2ns | 15μA | 15pF | 12.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
 | DSC1122BI2-155.5200T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1122 | 0.197Lx0.126W 5.00mmx3.20mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.6V | 155.52MHz | ±25ppm | LVPECL | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 155.52MHz | 52/48% | 22mA | 58mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||
 | DSC1121CM1-012.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD, No Lead | YES | -55°C~125°C | Tape & Reel (TR) | DSC1121 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.6V | 12MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 35mA | 3.2mm x 2.5mm x 0.9mm | 12MHz | 2ns | 2ns | 55/45% | 22mA | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||
| DSC1122AI5-125.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | -40°C~85°C | Tube | DSC1122 | 0.276Lx0.197W 7.00mmx5.00mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.6V | 125MHz | ±10ppm | LVPECL | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.85mm | 125MHz | 52/48% | 22mA | 58mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||
| DSC1001CI4-054.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | XO (Standard) | 85°C | -40°C | 1.8V~3.3V | 54MHz | CMOS | Standby (Power Down) | MEMS | 7.2mA | 15μA | 7.2mA | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
 | MX555ABJ100M000-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD, No Lead | YES | -40°C~85°C | Tape & Reel (TR) | MX55 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.375V~3.63V | 100MHz | ±50ppm | HCSL | Enable/Disable | Crystal | 95mA | 5.0mm x 3.2mm x 1.4mm | 100MHz | 0.45ns | 0.45ns | 52/48% | 0.055 1.40mm | ROHS3 Compliant | |||||||||||||||||||
| DSC1103DL2-147.4560 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD, No Lead | YES | -40°C~105°C | Tube | DSC1103 | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 1 (Unlimited) | XO (Standard) | 2.25V~3.63V | 147.456MHz | ±25ppm | LVDS | Standby (Power Down) | MEMS | 32mA | 2.5mm x 2.0mm x 0.85mm | 147.456MHz | 52/48% | 95μA | 0.035 0.90mm | Non-RoHS Compliant | ||||||||||||||||||||||
 | MX555ABF500M000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 表面贴装 | 6-SMD, No Lead | YES | -40°C~85°C | Tube | MX55 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.375V~3.63V | 500MHz | ±50ppm | LVPECL | Enable/Disable | Crystal | 120mA | 5.0mm x 3.2mm x 1.4mm | 500MHz | 0.35ns | 0.35ns | 55/45% | 0.055 1.40mm | ROHS3 Compliant | ||||||||||||||||||
 | MX575ABF100M000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 表面贴装 | 6-SMD, No Lead | YES | -40°C~85°C | Tube | MX55 | 0.276Lx0.197W 7.00mmx5.00mm | e3 | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.375V~3.63V | 100MHz | ±50ppm | LVPECL | Enable/Disable | Crystal | 120mA | 7.0mm x 5.0mm x 1.4mm | 100MHz | 0.35ns | 0.35ns | 55/45% | 0.055 1.40mm | ROHS3 Compliant | ||||||||||||||||||
 | MX573EBH125M000-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD, No Lead | YES | -40°C~85°C | Tape & Reel (TR) | MX55 | 0.276Lx0.197W 7.00mmx5.00mm | e3 | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.375V~3.63V | 125MHz | ±50ppm | LVCMOS | Enable/Disable | Crystal | 95mA | 7.0mm x 5.0mm x 1.4mm | 125MHz | 0.5ns | 0.5ns | 55/45% | 0.055 1.40mm | ROHS3 Compliant | |||||||||||||||||||
| MX554ENL120M000-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD, No Lead | YES | -40°C~85°C | Tape & Reel (TR) | MX55 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.375V~3.63V | 120MHz | ±50ppm | LVPECL | Enable/Disable | Crystal | 120mA | 5.0mm x 3.2mm x 1.4mm | 120MHz | 0.35ns | 0.35ns | 55/45% | 0.055 1.40mm | ROHS3 Compliant | |||||||||||||||||||
 | DSC1101DM2-156.2500 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tube | DSC1101 | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 125°C | -55°C | 2.25V~3.6V | 156.25MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 35mA | 95μA | 35mA | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | |||||||||||||||||||
| DSC1101DM2-027.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tube | DSC1101 | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 125°C | -55°C | 15pF | 2.25V~3.6V | 27MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 35mA | 95μA | 35mA | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | ||||||||||||||||||
| DSC1101DC1-025.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | Tape & Reel (TR) | DSC1101 | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.6V | 25MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 35mA | 95μA | 35mA | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | ||||||||||||||||||||||
 | MX573DNN16M6666 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 表面贴装 | 6-SMD, No Lead | YES | -40°C~85°C | Tube | MX55 | 0.276Lx0.197W 7.00mmx5.00mm | e3 | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.375V~3.63V | 16.666666MHz | ±50ppm | LVCMOS | Enable/Disable | Crystal | 95mA | 7.0mm x 5.0mm x 1.4mm | 16.6666MHz | 0.5ns | 0.5ns | 55/45% | 0.055 1.40mm | ROHS3 Compliant | ||||||||||||||||||
 | MX555ABG300M000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 表面贴装 | 6-SMD, No Lead | YES | -40°C~85°C | Tube | MX55 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.375V~3.63V | 300MHz | ±50ppm | LVDS | Enable/Disable | Crystal | 90mA | 5.0mm x 3.2mm x 1.4mm | 300MHz | 0.4ns | 0.4ns | 55/45% | 0.055 1.40mm | ROHS3 Compliant |