制造商是'Microchip'
Microchip 振荡器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | 尺寸/尺寸 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 电压 - 供电 | 电源电压 | 频率 | 频率稳定性 | 输出量 | 功能 | 基本谐振器 | 最大电流源 | 物理尺寸 | 工作频率 | 工作电源电压 | 上升时间-最大值 | 最大下降时间 | 对称性-最大值 | 电源电压-最大值(Vsup) | 电流 - 电源（禁用）（最大值） | 最大电源电压 | 最小电源电压 | 负载电容 | 最大电源电流 | 最大工作周期 | 高度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 评级结果 | |
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 | DSC1001DI1-026.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 1.8V~3.3V | 3.3V | 26MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 26MHz | 2ns | 2ns | 55/45% | 15μA | 6.3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||
 | DSC1001BI2-060.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 85°C | -40°C | 1.8V~3.3V | 60MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 7.2mA | 3.3V | 15μA | 3.6V | 1.7V | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||
 | DSC1122AI2-156.2500T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | -40°C~85°C | Tape & Reel (TR) | DSC1122 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.6V | 156.25MHz | ±25ppm | LVPECL | Enable/Disable | MEMS | 22mA | 58mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||||||
| DSC1001DC1-066.6600 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 0°C~70°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 70°C | 0°C | 1.8V~3.3V | 66.66MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 7.2mA | 3.3V | 15μA | 3.6V | 1.7V | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||
 | MX574JBB32M7680-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD, No Lead | YES | -40°C~85°C | Tape & Reel (TR) | MX55 | 0.276Lx0.197W 7.00mmx5.00mm | e3 | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.375V~3.63V | 32.768MHz | ±50ppm | LVDS | Enable/Disable | Crystal | 90mA | 7.0mm x 5.0mm x 1.4mm | 32.768MHz | 0.4ns | 0.4ns | 55/45% | 0.055 1.40mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | MX575ABH15M0000-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD, No Lead | YES | -40°C~85°C | Tape & Reel (TR) | MX55 | 0.276Lx0.197W 7.00mmx5.00mm | e3 | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.375V~3.63V | 15MHz | ±50ppm | LVCMOS | Enable/Disable | Crystal | 95mA | 7.0mm x 5.0mm x 1.4mm | 15MHz | 0.5ns | 0.5ns | 55/45% | 0.055 1.40mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | MX574EBB120M000-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD, No Lead | YES | -40°C~85°C | Tape & Reel (TR) | MX55 | 0.276Lx0.197W 7.00mmx5.00mm | e3 | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.375V~3.63V | 120MHz | ±50ppm | LVDS | Enable/Disable | Crystal | 90mA | 7.0mm x 5.0mm x 1.4mm | 120MHz | 0.4ns | 0.4ns | 55/45% | 0.055 1.40mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | MX575ABH250M000-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD, No Lead | YES | -40°C~85°C | Tape & Reel (TR) | MX55 | 0.276Lx0.197W 7.00mmx5.00mm | e3 | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.375V~3.63V | 250MHz | ±50ppm | LVCMOS | Enable/Disable | Crystal | 95mA | 7.0mm x 5.0mm x 1.4mm | 250MHz | 0.5ns | 0.5ns | 55/45% | 0.055 1.40mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | MX575ANL15M0000-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD, No Lead | YES | -40°C~85°C | Tape & Reel (TR) | MX55 | 0.276Lx0.197W 7.00mmx5.00mm | e3 | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.375V~3.63V | 15MHz | ±50ppm | LVPECL | Enable/Disable | Crystal | 120mA | 7.0mm x 5.0mm x 1.4mm | 15MHz | 0.35ns | 0.35ns | 55/45% | 0.055 1.40mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | DSC1001CI5-070.4550 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | Automotive grade | -40°C~85°C | Tube | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | 4 | XO (Standard) | ALSO OPERATES AT 2.5V AND 1.8V SUPPLY VOLTAGE | 1.8V~3.3V | 3.3V | 70.455MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.9mm | 70.455MHz | 2ns | 2ns | 55/45% | 15μA | 8.7mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
| DSC1001DI1-010.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 10MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 10MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||
| DSC1001DI1-098.3040T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 98.304MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 98.304MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 8.7mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||
| DSC1001CI2-073.7280T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 85°C | -40°C | 1.8V~3.3V | 73.728MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 8.7mA | 3.3V | 15μA | 3.6V | 1.7V | 15pF | 8.7mA | 55 % | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||
 | DSC6001HI2A-025.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | YES | -40°C~85°C | Bag | DSC60XX | 0.063Lx0.047W 1.60mmx1.20mm | 活跃 | 1 (Unlimited) | XO (Standard) | 1.8V~3.3V | 25MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 1.3mA Typ | 1.6mm x 1.2mm x 0.89mm | 25MHz | 2ns | 2ns | 55/45% | 0.035 0.89mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||
 | DSC1123DI2-148.5000B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1123 | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | XO (Standard) | 2.25V~3.63V | 148.5MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 22mA | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
| DSC1033DI1-011.0592T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; TR, 7/13 INCH | 3.3V | 11.0592MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 2.5mm x 2.0mm x 0.85mm | 11.0592MHz | 3.3V | 2ns | 2ns | 55/45% | 3.6V | 1μA | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||
| DSC6001CI2A-012.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD, No Lead | YES | -40°C~85°C | Tape & Reel (TR) | DSC60XX | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 12MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 1.3mA Typ | 3.2mm x 2.5mm x 0.85mm | 12MHz | 2ns | 2ns | 55/45% | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||
 | MX573ABA212M500-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | 6 | -40°C~85°C | Tape & Reel (TR) | 2000 | MX57 | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 85°C | -40°C | 2.375V~3.63V | 212.5MHz | ±50ppm | LVPECL | Enable/Disable | Crystal | 120mA | 3.63V | 2.375V | 120mA | 1.397mm | 0.055 1.40mm | 7.0104mm | 5.0038mm | ROHS3 Compliant | |||||||||||||||||||||
 | DSC1101DL5-052.8000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1101 | 0.098Lx0.079W 2.50mmx2.00mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | STANDBY; ENABLE/DISABLE FUNCTION; TR | 2.25V~3.6V | 52.8MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 52.8MHz | 2ns | 2ns | 55/45% | 95μA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||
| DSC1101DM2-033.3333T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tape & Reel (TR) | DSC1101 | 0.098Lx0.079W 2.50mmx2.00mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | STANDBY; ENABLE/DISABLE FUNCTION; TR | 2.25V~3.6V | 33.3333MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 33.3333MHz | 2ns | 2ns | 55/45% | 95μA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||
| DSC1101DM1-033.3333T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tape & Reel (TR) | DSC1101 | 0.098Lx0.079W 2.50mmx2.00mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | STANDBY; ENABLE/DISABLE FUNCTION; TR | 2.25V~3.6V | 33.3333MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 33.3333MHz | 2ns | 2ns | 55/45% | 95μA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||
 | DSC1101CI1-125.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1101 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.6V | 125MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 125MHz | 2ns | 2ns | 55/45% | 95μA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||
| DSC1121DM1-033.3333T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tape & Reel (TR) | DSC1121 | 0.098Lx0.079W 2.50mmx2.00mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.6V | 33.3333MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 2.5mm x 2.0mm x 0.85mm | 33.3333MHz | 2ns | 2ns | 55/45% | 22mA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||
| DSC1033BI1-035.3280 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1033, PureSilicon™ | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 3 (168 Hours) | XO (Standard) | 85°C | -40°C | 3.3V | 35.328MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 1μA | 3mA | 889μm | 0.035 0.90mm | 5.0038mm | 3.2004mm | ROHS3 Compliant | |||||||||||||||||||||||||
| DSC1033DI2-025.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1033, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 85°C | -40°C | 3.3V | 25MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 1μA | 3.6V | 3V | 15pF | 3mA | 889μm | 0.035 0.90mm | 2.4892mm | 2.0066mm | ROHS3 Compliant |