制造商是'Microchip'
Microchip 振荡器
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图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 电容量 | 电压 - 供电 | 电源电压 | 频率 | 频率稳定性 | 输出量 | 功能 | 基本谐振器 | 最大电流源 | 物理尺寸 | 工作频率 | 工作电源电压 | 上升时间-最大值 | 最大下降时间 | 对称性-最大值 | 电流 - 电源（禁用）（最大值） | 负载电容 | 最大电源电流 | 最大工作周期 | 高度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 无铅 | 评级结果 | |
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 | DSC1101DI5-026.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1101 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; TR | 2.25V~3.6V | 26MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.9mm | 26MHz | 2ns | 2ns | 55/45% | 95μA | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||
 | DSC1001DI1-074.2500 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 1.8V~3.3V | 3.3V | 74.25MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 2.5mm x 2.0mm x 0.85mm | 74.25MHz | 2ns | 2ns | 55/45% | 15μA | 8.7mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
 | DSC1001CL5-060.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tube | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 1.8V~3.3V | 3.3V | 60MHz | ±10ppm | CMOS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.85mm | 60MHz | 2ns | 2ns | 55/45% | 15μA | 7.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
 | DSC1003AL5-025.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead Exposed Pad | YES | -40°C~105°C | Tube | DSC1003 | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 1 (Unlimited) | XO (Standard) | 1.7V~3.6V | 3.3V | 25MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 6.5mA | 7.0mm x 5.0mm x 0.85mm | 25MHz | 3ns | 3ns | 55/45% | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||
| DSC1003CI5-020.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1003 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 30pF | 1.7V~3.6V | 3.3V | 20MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 20MHz | 2ns | 2ns | 55/45% | 15μA | 6mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||
 | DSC1123CE1-156.2500 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -20°C~70°C | Tube | DSC1123 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | yes | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.63V | 156.25MHz | ±50ppm | LVDS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.85mm | 156.25MHz | 52/48% | 22mA | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||
 | DSC1101BI5-024.5760 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1101 | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 2.25V~3.6V | 24.576MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 5.0mm x 3.2mm x 0.85mm | 24.576MHz | 2ns | 2ns | 55/45% | 95μA | 15pF | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||
| DSC1123CE5-100.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -20°C~70°C | Tube | DSC1123 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 1 (Unlimited) | XO (Standard) | 2.25V~3.63V | 100MHz | ±10ppm | LVDS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 100MHz | 52/48% | 22mA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||
| DSC1001DI2-024.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 24MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 24MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||
| DSC1001AC1-075.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead Exposed Pad | 0°C~70°C | Tube | DSC1001 | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | 70°C | 0°C | 1.8V~3.3V | 75MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 8.7mA | 15μA | 8.7mA | 889μm | 0.035 0.90mm | 7.0104mm | 5.0038mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||
| DSC1103CL5-106.2500 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~105°C | Tube | DSC1103 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.63V | 106.25MHz | ±10ppm | LVDS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.9mm | 106.25MHz | 52/48% | 95μA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||||
| DSC1001DI2-048.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 48MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 48MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||
| DSC1001CI5-050.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 4 | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 50MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 50MHz | 3.3V | 2ns | 2ns | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | 无铅 | AEC-Q100 | ||||||||||||||
 | DSC1121AE1-075.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | -20°C~70°C | Tube | DSC1121 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.6V | 75MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 75MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||
| DSC1001AL1-020.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead Exposed Pad | YES | Automotive grade | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 1 (Unlimited) | 4 | XO (Standard) | ALSO OPERATES AT 2.5V AND 1.8V SUPPLY VOLTAGE | 1.8V~3.3V | 3.3V | 20MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 6.5mA | 7.0mm x 5.0mm x 0.9mm | 20MHz | 2ns | 2ns | 55/45% | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||
| DSC1103CI1-100.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1103 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 2.25V~3.63V | 100MHz | ±50ppm | LVDS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.9mm | 100MHz | 52/48% | 95μA | 2pF | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||
| DSC1004DI2-072.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1004 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 72MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 72MHz | 2ns | 2ns | 55/45% | 15μA | 10.5mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||
| DSC1003DI2-100.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1003 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; TR; SUPPLY VOLTAGE OF 1.8V & 2.5V ALSO AVAILABLE | 1.7V~3.6V | 3.3V | 100MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 100MHz | 3ns | 3ns | 55/45% | 15μA | 9.6mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||
| DSC1124CI2-156.2500 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1124 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 1 (Unlimited) | XO (Standard) | 2.25V~3.6V | 156.25MHz | ±25ppm | HCSL | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 156.25MHz | 0.4ns | 52/48% | 22mA | 42mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||
| DSC1001DL5-033.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 33MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 33MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | 无铅 | AEC-Q100 | ||||||||||||
| DSC1123DL5-150.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 6-SMD, No Lead | YES | -40°C~105°C | Tube | DSC1123 | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 1 (Unlimited) | XO (Standard) | 2.25V~3.63V | 150MHz | ±10ppm | LVDS | Enable/Disable | MEMS | 22mA | 2.5mm x 2.0mm x 0.85mm | 150MHz | 52/48% | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||||||
| DSC1123AL5-100.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 6-SMD, No Lead Exposed Pad | YES | -40°C~105°C | Tube | DSC1123 | 0.276Lx0.197W 7.00mmx5.00mm | 活跃 | 1 (Unlimited) | XO (Standard) | 2.25V~3.63V | 100MHz | ±10ppm | LVDS | Enable/Disable | MEMS | 22mA | 7.0mm x 5.0mm x 0.85mm | 100MHz | 52/48% | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||||||
 | DSC6111JI2A-024.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | YES | -40°C~85°C | Tape & Reel (TR) | DSC61XX | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 3 (168 Hours) | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; TR | 1.8V~3.3V | 24MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 2.5mm x 2.0mm x 0.89mm | 24MHz | 2.2ns | 2.2ns | 55/45% | 12μA | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||
| DSC1001CI2-018.4320 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 4 | -40°C~85°C | Tube | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 18.432MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 18.432MHz | 3.3V | 2ns | 2ns | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||
| DSC1101AI2-148.5000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | 6 | -40°C~85°C | Tube | DSC1101 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.6V | 148.5MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 7.0mm x 5.0mm x 0.9mm | 148.5MHz | 3.6V | 2ns | 2ns | 55/45% | 95μA | 15pF | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | 无铅 |