制造商是'Microchip'
Microchip 振荡器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | 尺寸/尺寸 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 电容量 | 子类别 | 电压 - 供电 | 电源电压 | 频率 | 频率稳定性 | 输出量 | 引脚数量 | 终端样式 | 功能 | 基本谐振器 | 最大电流源 | 物理尺寸 | 工作频率 | 工作电源电压 | 上升时间-最大值 | 最大下降时间 | 对称性-最大值 | 电流 - 电源（禁用）（最大值） | 负载电容 | 电源电流 | 最大电源电流 | 定时器/计数器的数量 | 产品类别 | 最大工作周期 | 输出格式 | 最大结点温度（Tj） | 环境温度范围高 | 输出电平 | 产品类别 | 高度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 无铅 | 评级结果 | ||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | VC-801-JAC-KAAN-33M3330000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 33.333 | ±50 | 15 | 55 | 1.71 | 1.89 | 1.8 | -55 | 125 | CSMD | 表面贴装 | 1.4(Max) | 5 | 3.2 | 4 | Tape & Reel (TR) | 活跃 | + 125 C | 5.5 V | 0.045872 oz | - 55 C | 1 | 4.5 V | Microchip | 微芯片技术 | Details | 标准时钟振荡器 | 微芯片技术 | EAR99 | Reel | * | 活跃 | 晶体振荡器 | Oscillators | 33.333 MHz | 50 PPM, 100 PPM | 4 | SMD/SMT | 15 pF | CMOS | CMOS | 标准振荡器 | 1.3 mm | 5 mm | 3.2 mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
 | DSC1123CI2-100.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1123 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 2.25V~3.63V | 100MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.85mm | 100MHz | 52/48% | 22mA | 2pF | 32mA | 52 % | 150°C | 85°C | 900μm | 0.035 0.90mm | ROHS3 Compliant | 无铅 | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1123CI2-200.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | 6 | -40°C~85°C | Tube | DSC1123 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.63V | 200MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.85mm | 200MHz | 52/48% | 22mA | 2pF | 20mA | 32mA | 1 | 52 % | 150°C | 85°C | 900μm | 0.035 0.90mm | ROHS3 Compliant | 无铅 | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1001DI1-033.3300 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | Industrial grade | -40°C~85°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 33.33MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 33.33MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | 无铅 | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1001CI2-025.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.3V | 3.3V | 25MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 25MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.88mm | ROHS3 Compliant | 无铅 | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1123CI2-156.2500 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1123 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 2.25V~3.63V | 156.25MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 156.25MHz | 52/48% | 22mA | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | 无铅 | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001CE1-024.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 4 | -20°C~70°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 24MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 24MHz | 3.3V | 2ns | 2ns | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1103CE1-156.2500T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1103 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 1 (Unlimited) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR | 2.25V~3.63V | 156.25MHz | ±50ppm | LVDS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 156.25MHz | 52/48% | 95μA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1123CI1-027.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1123 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 3 (168 Hours) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.63V | 27MHz | ±50ppm | LVDS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.85mm | 27MHz | 52/48% | 22mA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1123AE2-100.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | 6 | -20°C~70°C | Tube | DSC1123 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 2.25V~3.63V | 100MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 100MHz | 52/48% | 22mA | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1124CI2-100.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1124 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | 2.25V~3.6V | 100MHz | ±25ppm | HCSL | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 100MHz | 0.4ns | 52/48% | 22mA | 2pF | 42mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1104BI2-100.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 6-SMD, No Lead | YES | -40°C~85°C | Tube | DSC1104 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | 活跃 | 1 (Unlimited) | XO (Standard) | Matte Tin (Sn) | 2.25V~3.6V | 100MHz | ±25ppm | HCSL | Standby (Power Down) | MEMS | 95μA | 5.0mm x 3.2mm x 0.85mm | 100MHz | 0.4ns | 52/48% | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001DL2-049.5000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-VDFN | -40°C~105°C | Tape & Reel (TR) | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 1.8V~3.3V | 3.3V | 49.5MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 49.5MHz | 2ns | 2ns | 55/45% | 15μA | 7.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1121AI2-050.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | 6 | -40°C~85°C | Tube | DSC1121 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 2.25V~3.6V | 50MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 50MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001DE5-019.2000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | e3 | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 19.2MHz | ±10ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 19.2MHz | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC557-0344FI0 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 14-SMD, No Lead | Industrial grade | -40°C~85°C | Tube | 2013 | DSC557-03 | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 1 (Unlimited) | XO (Standard) | 85°C | -40°C | 2.25V~3.6V | 100MHz | ±100ppm | HCSL | Enable/Disable | MEMS | 60mA Typ | 23mA | 60mA | 889μm | 0.035 0.90mm | 3.2004mm | 2.4892mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1123AL1-150.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | -40°C~105°C | Tube | DSC1123 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.63V | 150MHz | ±50ppm | LVDS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 150MHz | 52/48% | 22mA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1001AI5-027.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead Exposed Pad | Automotive grade | -40°C~85°C | Tube | DSC1001 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 1 (Unlimited) | 4 | XO (Standard) | ALSO OPERATES AT 2.5V AND 1.8V SUPPLY VOLTAGE | 1.8V~3.3V | 3.3V | 27MHz | ±10ppm | CMOS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 27MHz | 2ns | 2ns | 55/45% | 15μA | 7.2mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSC1001BI2-012.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Standard, Surface Mount | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 12MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 5.0mm x 3.2mm x 0.85mm | 12MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1123CI2-125.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1123 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 1 (Unlimited) | Solder | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.63V | 125MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.85mm | 125MHz | 52/48% | 22mA | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001CI1-027.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-VDFN | 4 | -40°C~85°C | Tape & Reel (TR) | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 1.8V~3.3V | 3.3V | 27MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 27MHz | 3.3V | 2ns | 2ns | 15μA | 15pF | 7.2mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001CI2-033.3330 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | YES | Automotive grade | -40°C~85°C | Tube | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 1 (Unlimited) | 4 | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO OPERATES AT 2.5V AND 1.8V SUPPLY VOLTAGE | 1.8V~3.3V | 3.3V | 33.333MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 7.2mA | 3.2mm x 2.5mm x 0.9mm | 33.333MHz | 2ns | 2ns | 55/45% | 15μA | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001DI2-125.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tube | DSC1001 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 125MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 2.5mm x 2.0mm x 0.85mm | 125MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 8.7mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1001CE2-024.5760 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -20°C~70°C | Tube | DSC1001 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 1.8V~3.3V | 3.3V | 24.576MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 24.576MHz | 3.3V | 2ns | 2ns | 55/45% | 15μA | 15pF | 6.3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DSC1121CL5-050.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~105°C | Tube | DSC1121 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 15pF | 2.25V~3.6V | 50MHz | ±10ppm | CMOS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 50MHz | 2ns | 2ns | 55/45% | 22mA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 |