制造商是'Maxim Integrated'
Maxim Integrated 存储器 - 控制器
(64)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 通道数量 | 界面 | 最大电源电压 | 最小电源电压 | 模拟 IC - 其他类型 | 工作电源电流 | uPs/uCs/外围ICs类型 | 可调阈值 | 传播延迟 | 接通延迟时间 | 供应电流-最大值(Isup) | 控制器类型 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |
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 | DS1314E+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | 20 | 190.990737mg | SRAM | -40°C~85°C | Tube | 2012 | e3 | yes | 活跃 | 1 (Unlimited) | 20 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | 3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 0.65mm | 30 | DS1314 | 20 | 3.6V | 3.3V | 3V | 1 | 电源支持电路 | 30μA | NO | 140mA | 非易失性RAM | 1.1mm | 6.5mm | 4.4mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||
 | DS1321S+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 16-SOIC (0.154, 3.90mm Width) | 16 | 200.686274mg | SRAM | -40°C~85°C | Tube | 2001 | e3 | yes | 活跃 | 1 (Unlimited) | 16 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | 4.75V~5.5V | DUAL | 鸥翼 | 260 | 1 | 5V | 1.27mm | DS1321 | 16 | 5V | 5V | 1 | 电源支持电路 | 50μA | NO | 20 ns | 1.5mA | 非易失性RAM | 1.35mm | 9.8mm | 3.8mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||
 | DS1218S+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | 0°C~70°C | Tube | 2011 | e3 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 4.5V~5.5V | DUAL | 鸥翼 | 260 | 1 | 5V | 1.27mm | 未说明 | DS1218 | 8 | 不合格 | 5.5V | 5V | 4.5V | 2 | 电源管理电路 | NO | 5mA | 非易失性RAM | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||
 | DS1321+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | PRODUCTION (Last Updated: 1 month ago) | 通孔 | 16-DIP (0.300, 7.62mm) | NO | 16 | -40°C~85°C | Tube | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 16 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | 4.75V~5.5V | DUAL | 260 | 1 | 5V | 2.54mm | 30 | DS1321 | 16 | 不合格 | 5.5V | 5V | 4.5V | 1 | 电源支持电路 | NO | 1.5mA | 非易失性RAM | 4.572mm | 19.175mm | 7.62mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||
 | DS1314S+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | 665.986997mg | SRAM | -40°C~85°C | Tube | 2012 | e3 | yes | 活跃 | 1 (Unlimited) | 16 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | 3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 1.27mm | DS1314 | 16 | 3.3V | 3.6V | 3V | 1 | 电源支持电路 | 30μA | NO | 20 ns | 20 ns | 140mA | 非易失性RAM | 2.35mm | 10.1mm | 7.4mm | 无 | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||
| DS1312S+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | 16 | -40°C~85°C | Tube | 2012 | e3 | yes | 活跃 | 1 (Unlimited) | 16 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | 4.75V~5.5V | DUAL | 鸥翼 | 260 | 1 | 5V | 1.27mm | 未说明 | DS1312 | 16 | 不合格 | 5.5V | 5V | 4.5V | 1 | 电源支持电路 | NO | 200mA | 非易失性RAM | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||
| DS1321E+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | -40°C~85°C | Tube | 2012 | e3 | yes | 活跃 | 1 (Unlimited) | 20 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | 4.75V~5.5V | DUAL | 鸥翼 | 260 | 1 | 5V | 0.65mm | 30 | DS1321 | 20 | R-PDSO-G20 | 不合格 | 5.5V | 5V | 4.5V | 1 | 电源支持电路 | NO | 1.5mA | 非易失性RAM | 1.1mm | 6.5mm | 4.4mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||
| DS1312S-2+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 540.001716mg | RAM | -40°C~85°C | Tube | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | Matte Tin (Sn) | 4.75V~5.5V | DUAL | 鸥翼 | 260 | 1 | 5V | 1.27mm | DS1312 | 8 | 5V | 5V | 1 | Parallel | 电源支持电路 | 50μA | NO | 10 ns | 200mA | 非易失性RAM | 1.35mm | 4.8mm | 3.8mm | 无 | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||||
| DS1314S-2+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 540.001716mg | SRAM | -40°C~85°C | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Tin (Sn) | 3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 1.27mm | DS1314 | 8 | 3.3V | 3.6V | 3V | 1 | 电源支持电路 | 30μA | NO | 20 ns | 140mA | 非易失性RAM | 1.35mm | 4.8mm | 3.8mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||
 | DS1314 | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | 2.26799g | SRAM | -40°C~85°C | Tube | 2012 | e0 | no | Obsolete | 1 (Unlimited) | 8 | EAR99 | Tin/Lead (Sn/Pb) | 3V~3.6V | DUAL | 245 | 1 | 3.3V | 2.54mm | DS1314 | 8 | 3.3V | 3.6V | 3V | 1 | 电源支持电路 | 30μA | NO | 140mA | 非易失性RAM | 3.18mm | 8.84mm | 6.1mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||
| DS1210S | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | 16 | 0°C~70°C | Tube | 2003 | e0 | no | Obsolete | 1 (Unlimited) | 16 | EAR99 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | 4.75V~5.5V | DUAL | 鸥翼 | 245 | 1 | 5V | 1.27mm | not_compliant | 未说明 | DS1210 | 16 | 不合格 | 5.5V | 5V | 4.5V | 3 | 电源支持电路 | NO | 80mA | 非易失性RAM | 2.65mm | 10.3mm | 7.5mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||
| DS1314E+T&R | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | 20-TSSOP | -40°C~85°C | Tape & Reel (TR) | 2012 | 活跃 | 1 (Unlimited) | 3V~3.6V | DS1314 | 非易失性RAM | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1312E | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | 20 | 190.990737mg | RAM | -40°C~85°C | Tube | 2004 | e3 | yes | Obsolete | 1 (Unlimited) | 20 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | 4.75V~5.5V | DUAL | 鸥翼 | 260 | 1 | 5V | 0.65mm | 30 | DS1312 | 20 | 5.5V | 5V | 4.5V | 1 | 电源支持电路 | 50μA | NO | 非易失性RAM | 1.1mm | 6.5mm | 4.4mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||
| DS1314S+T&R | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16-SOIC | -40°C~85°C | Tape & Reel (TR) | 2012 | 活跃 | 1 (Unlimited) | 3V~3.6V | DS1314 | 非易失性RAM | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1314S-2+T&R | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 8-SOIC | 540.001716mg | SRAM | -40°C~85°C | Tape & Reel (TR) | 2012 | 活跃 | 1 (Unlimited) | 85°C | -40°C | 3V~3.6V | DS1314 | 3.6V | 3V | 30μA | 非易失性RAM | 无 | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
| DS1210N | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | 930.006106mg | RAM | -40°C~85°C | Tube | 2003 | e0 | no | Obsolete | 1 (Unlimited) | 8 | EAR99 | Tin/Lead (Sn/Pb) | 4.75V~5.5V | DUAL | 245 | 1 | 5V | 2.54mm | DS1210 | 8 | 5.5V | 5V | 4.5V | 3 | 电源支持电路 | 5mA | NO | 非易失性RAM | 4.572mm | 9.375mm | 7.62mm | 无 | Unknown | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||
| DS1321S+T&R | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 16-SOIC (0.154, 3.90mm Width) | 16-SOIC | -40°C~85°C | Tape & Reel (TR) | 2012 | 活跃 | 1 (Unlimited) | 4.75V~5.5V | DS1321 | 非易失性RAM | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| DS1218 | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | 930.006106mg | RAM | 0°C~70°C | Tube | 2012 | e3 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 2.54mm | DS1218 | 8 | 5V | 2 | 电源管理电路 | 2mA | NO | 非易失性RAM | 3.18mm | 8.84mm | 6.1mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||
| DS1210S+TRL | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | 200.686274mg | RAM | 0°C~70°C | Tape & Reel (TR) | 2012 | e3 | yes | Obsolete | 1 (Unlimited) | 16 | EAR99 | 8542.31.00.01 | 4.75V~5.5V | DUAL | 鸥翼 | 260 | 1 | 5V | 1.27mm | DS1210 | 16 | 5.5V | 5V | 4.5V | 3 | 电源支持电路 | 5mA | NO | 80mA | 非易失性RAM | 2.71mm | 10.285mm | 7.5mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||
| DS1312+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 通孔 | 8-DIP (0.300, 7.62mm) | NO | -40°C~85°C | Tube | 2012 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 8542.31.00.01 | 4.75V~5.5V | DUAL | 未说明 | 1 | 5V | 2.54mm | 未说明 | DS1312 | R-PDIP-T8 | 5.5V | 4.5V | 1 | 电源支持电路 | NO | 非易失性RAM | 4.572mm | 9.375mm | 7.62mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
| DS1210+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | 0°C~70°C | Tube | 2003 | e3 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 4.75V~5.5V | DUAL | 260 | 1 | 5V | 2.54mm | 未说明 | DS1210 | 8 | 不合格 | 5.5V | 5V | 4.5V | 3 | 电源支持电路 | NO | 非易失性RAM | 4.572mm | 9.375mm | 7.62mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||
 | DS1211 | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 20-DIP (0.300, 7.62mm) | NO | 20 | RAM | 0°C~70°C | Tube | 1996 | e0 | Obsolete | 1 (Unlimited) | 20 | 通孔 | EAR99 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | 4.75V~5.5V | DUAL | 240 | 5V | 2.54mm | 20 | DS1211 | 20 | 微处理器电路 | 非易失性RAM | 4.572mm | 26.16mm | 7.62mm | 无 | 无SVHC | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||
 | DS1211S | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | YES | 0°C~70°C | Tube | 1999 | e0 | Obsolete | 1 (Unlimited) | 20 | EAR99 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | 4.75V~5.5V | DUAL | 鸥翼 | 245 | 5V | 1.27mm | not_compliant | 未说明 | DS1211 | 20 | R-PDSO-G20 | 不合格 | 微处理器电路 | 非易失性RAM | 2.65mm | 12.8mm | 7.5mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||
| MXD1210CSA+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 506.605978mg | S8+4 | RAM | 0°C~70°C | Tube | 2006 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 4.75V~5.5V | DUAL | 鸥翼 | 260 | 5V | 1.27mm | MXD1210 | 8 | 230μA | 微处理器电路 | 20 ns | 非易失性RAM | 1.35mm | 4.8mm | 3.8mm | 无 | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||
| MXD1210ESA+ | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | 506.605978mg | RAM | -40°C~85°C | Tube | 2006 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 4.75V~5.5V | DUAL | 鸥翼 | 260 | 5V | 1.27mm | MXD1210 | 8 | 230μA | 微处理器电路 | 非易失性RAM | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 |