制造商是'Lattice Semiconductor'
Lattice Semiconductor 嵌入式 - FPGA（现场可编程门阵列）
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图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 内存大小 | 工作电源电流 | 电源电流 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 输入数量 | 组织结构 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 输出功能 | 宏细胞数 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 专用输入数量 | 等效门数 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
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 | LCMXO2-1200ZE-3TG100CR1 | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 79 | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e3 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 1.14V~1.26V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | unknown | 30 | LCMXO2-1200 | 100 | 80 | 不合格 | 1.2V | 58μA | 17.3kB | 现场可编程门阵列 | 1280 | 65536 | 140.315MHz | 160 | 640 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| LCMXO2-1200ZE-2TG100CR1 | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 79 | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e3 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 1.14V~1.26V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | unknown | 30 | LCMXO2-1200 | 100 | 80 | 不合格 | 1.2V | 58μA | 17.3kB | 现场可编程门阵列 | 1280 | 65536 | 140.315MHz | 160 | 640 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | LFE2M100E-5F900I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 900-BBGA | YES | 416 | -40°C~100°C TJ | Tray | 2012 | ECP2M | e0 | no | Obsolete | 3 (168 Hours) | 900 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | LFE2M100 | 900 | S-PBGA-B900 | 416 | 不合格 | 1.2V | 311MHz | 416 | 现场可编程门阵列 | 95000 | 5435392 | 11875 | 0.358 ns | 100000 | 2.6mm | 31mm | 31mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | LCMXO640E-4FTN256I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 159 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | SRAM | -40°C~100°C TJ | Tray | 2000 | MachXO | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | not_compliant | 40 | LCMXO640 | 256 | 159 | 不合格 | 1.2V | 14mA | 14mA | 4.2 ns | 闪存 PLD | 640 | 550MHz | 80 | MACROCELL | 320 | 640 | 7 | 1.55mm | 17mm | 17mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||
.png) | LFE5UM5G-85F-8MG285C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 285-TFBGA | YES | 118 | 0°C~85°C TJ | Tray | 2016 | ECP5-5G | 活跃 | 3 (168 Hours) | 285 | EAR99 | 8542.39.00.01 | 1.045V~1.155V | BOTTOM | BALL | 260 | 1.2V | 0.5mm | 未说明 | S-PBGA-B285 | 10500 CLBS | 现场可编程门阵列 | 84000 | 3833856 | 21000 | 10500 | 1.3mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
| LFX1200B-04F900C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 51.8kB | 表面贴装 | 表面贴装 | 900-BBGA | 900 | 496 | 0°C~85°C TJ | Tray | 2000 | ispXPGA® | e0 | Obsolete | 3 (168 Hours) | 900 | EAR99 | Tin/Lead (Sn63Pb37) | ALSO OPERATES WITH 3.3V SUPPLY | 8542.39.00.01 | 2.3V~3.6V | BOTTOM | BALL | 225 | 2.5V | 1mm | not_compliant | 30 | LFX1200 | 900 | 496 | 不合格 | 2.5V | 2.5/3.3V | 82.5kB | 320MHz | 现场可编程门阵列 | 15376 | 423936 | 1250000 | 0.93 ns | 3844 | 2.6mm | 31mm | 31mm | Non-RoHS Compliant | ||||||||||||||||||||||||||
 | ICE40LM4K-SWG25TR50 | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 10kB | 表面贴装 | 表面贴装 | 25-XFBGA, WLCSP | 25-WLCSP (1.7x1.7) | 18 | -40°C~100°C TJ | Tape & Reel (TR) | 2000 | iCE40™ LM | Discontinued | 3 (168 Hours) | 100°C | -40°C | 1.14V~1.26V | ICE40LM4K | 1.2V | 100μA | 10kB | 3520 | 81920 | 440 | 440 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | LCMXO2280E-4B256I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 211 | 表面贴装 | 表面贴装 | 256-LFBGA, CSPBGA | SRAM | -40°C~100°C TJ | Tray | 2013 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | not_compliant | 30 | LCMXO2280 | 256 | S-PBGA-B256 | 211 | 不合格 | 1.2V | 20mA | 20mA | 420MHz | 4.4 ns | 211 | 闪存 PLD | 2280 | 28262 | 285 | MACROCELL | 1140 | 7 | 1.7mm | 14mm | 14mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||
| OR2T26A6S208I-DB | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 171 | -40°C~85°C TA | Tray | 1992 | ORCA® 2 | e0 | Obsolete | 3 (168 Hours) | 208 | EAR99 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | 3V~3.6V | QUAD | 鸥翼 | 3.3V | 0.5mm | 294.12MHz | OR2T26A | 208 | 163 | 3.3V | 4.5kB | 576 CLBS, 27600 GATES | 现场可编程门阵列 | 2304 | 36864 | 63600 | 1.4 ns | 576 | 27600 | 4.1mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| LCMXO2-1200ZE-2TG100IR1 | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 79 | -40°C~100°C TJ | Tray | 2000 | MachXO2 | e3 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 1.14V~1.26V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | unknown | 30 | LCMXO2-1200 | 100 | 80 | 不合格 | 1.2V | 58μA | 17.3kB | 现场可编程门阵列 | 1280 | 65536 | 141.645MHz | 160 | 640 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | LCMXO2-256HC-6SG32CAIC | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 32-UFQFN Exposed Pad | 32-QFNS (5x5) | 21 | 0°C~85°C TJ | Tray | 2013 | MachXO2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 2.375V~3.465V | 256 | 32 | 32 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | LFXP2-40E-5F484IAFI | Lattice Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2012 | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LCMXO640C-4B256C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 159 | 表面贴装 | 表面贴装 | 256-LFBGA, CSPBGA | SRAM | 0°C~85°C TJ | Tray | 2013 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | 锡铅 | IT CAN ALSO OPERATE AT 2.5V AND 3.3V | 8542.39.00.01 | 1.71V~3.465V | BOTTOM | BALL | 240 | 1.8V | 0.8mm | not_compliant | 30 | LCMXO640 | 256 | S-PBGA-B256 | 159 | 不合格 | 3.3V | 17mA | 17mA | 420MHz | 4.2 ns | 159 | 闪存 PLD | 640 | 80 | MACROCELL | 320 | 640 | 7 | 1.7mm | 14mm | 14mm | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||
 | LFECP6E-3F256I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11.5kB | 表面贴装 | 表面贴装 | 256-BGA | 256 | 195 | -40°C~100°C TJ | Tray | 2006 | ECP | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 225 | 1.2V | 1mm | not_compliant | 30 | LFECP6 | 256 | 195 | 不合格 | 1.2V | 1.21.2/3.33.3V | 14.6kB | 现场可编程门阵列 | 6100 | 94208 | 340MHz | 768 | 0.56 ns | 768 | 2.1mm | 17mm | 17mm | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||
| LCMXO2280C-4B256I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 211 | 表面贴装 | 表面贴装 | 256-LFBGA, CSPBGA | 256 | SRAM | -40°C~100°C TJ | Tray | 2013 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn/Pb) | IT CAN ALSO OPERATE AT 2.5V AND 3.3V | 8542.39.00.01 | 1.71V~3.465V | BOTTOM | BALL | 240 | 1.8V | 0.8mm | 30 | LCMXO2280 | 256 | 211 | 3.3V | 23mA | 23mA | 420MHz | 4.4 ns | 4.4 ns | 闪存 PLD | 2280 | 28262 | 285 | MACROCELL | 1140 | 7 | 1.7mm | 14mm | 14mm | 无 | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||
| LCMXO2280C-3B256C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 211 | 表面贴装 | 表面贴装 | 256-LFBGA, CSPBGA | SRAM | 0°C~85°C TJ | Tray | 2013 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn/Pb) | IT CAN ALSO OPERATE AT 2.5V AND 3.3V | 8542.39.00.01 | 1.71V~3.465V | BOTTOM | BALL | 240 | 1.8V | 0.8mm | not_compliant | 30 | LCMXO2280 | 256 | S-PBGA-B256 | 211 | 不合格 | 3.3V | 23mA | 23mA | 420MHz | 5.1 ns | 211 | 闪存 PLD | 2280 | 28262 | 285 | MACROCELL | 1140 | 7 | 1.7mm | 14mm | 14mm | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||
 | LIF-MD6000-6UWG36ITR50 | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 36-UFBGA, WLCSP | YES | 17 | -40°C~100°C TJ | Bulk | CrossLink™ | Discontinued | 1 (Unlimited) | 36 | EAR99 | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 未说明 | 1.2V | 0.4mm | 未说明 | R-PBGA-B36 | 1500 CLBS | 现场可编程门阵列 | 5936 | 184320 | 1484 | 1500 | 0.6mm | 2.585mm | 2.535mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
| LFE5UM-85F-7MG285I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 285-TFBGA | 118 | -40°C~100°C TJ | Tray | 2016 | ECP5 | 活跃 | 3 (168 Hours) | EAR99 | 8542.39.00.01 | 1.045V~1.155V | 260 | 未说明 | 现场可编程门阵列 | 84000 | 3833856 | 21000 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| LCMXO2280E-3B256I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 211 | 表面贴装 | 表面贴装 | 256-LFBGA, CSPBGA | SRAM | -40°C~100°C TJ | Tray | 2013 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | not_compliant | 30 | LCMXO2280 | 256 | S-PBGA-B256 | 211 | 不合格 | 1.2V | 20mA | 20mA | 420MHz | 5.1 ns | 211 | 闪存 PLD | 2280 | 28262 | 285 | MACROCELL | 1140 | 7 | 1.7mm | 14mm | 14mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||
| LFX1200B-05F900C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 51.8kB | 表面贴装 | 表面贴装 | 900-BBGA | 900 | 496 | 0°C~85°C TJ | Tray | 2000 | ispXPGA® | e0 | Obsolete | 3 (168 Hours) | 900 | EAR99 | Tin/Lead (Sn63Pb37) | ALSO OPERATES WITH 3.3V SUPPLY | 8542.39.00.01 | 2.3V~3.6V | BOTTOM | BALL | 225 | 2.5V | 1mm | not_compliant | 30 | LFX1200 | 900 | 496 | 不合格 | 2.5V | 2.5/3.3V | 82.5kB | 320MHz | 现场可编程门阵列 | 15376 | 423936 | 1250000 | 0.86 ns | 3844 | 2.6mm | 31mm | 31mm | Non-RoHS Compliant | ||||||||||||||||||||||||||
| LFX1200C-04F900C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 51.8kB | 表面贴装 | 表面贴装 | 900-BBGA | 900 | 496 | 0°C~85°C TJ | Tray | 2000 | ispXPGA® | e0 | Obsolete | 3 (168 Hours) | 900 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 1.65V~1.95V | BOTTOM | BALL | 225 | 1.8V | 1mm | not_compliant | 30 | LFX1200 | 900 | 496 | 不合格 | 1.8V | 82.5kB | 320MHz | 现场可编程门阵列 | 15376 | 423936 | 1250000 | 0.93 ns | 3844 | 2.6mm | 31mm | 31mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | LFX200B-05F256C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13.9kB | 表面贴装 | 表面贴装 | 256-BGA | 256 | 160 | 0°C~85°C TJ | Tray | 2000 | ispXPGA® | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | ALSO OPERATES WITH 3.3V SUPPLY | 8542.39.00.01 | 2.3V~3.6V | BOTTOM | BALL | 225 | 2.5V | 1mm | not_compliant | 30 | LFX200 | 256 | 160 | 不合格 | 2.5V | 2.5/3.3V | 19.3kB | 320MHz | 现场可编程门阵列 | 2704 | 113664 | 210000 | 0.86 ns | 676 | 2.1mm | 17mm | 17mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||
 | LFX1200EB-03FE680I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 51.8kB | 表面贴装 | 表面贴装 | 680-LBGA | 680 | 496 | -40°C~105°C TJ | Tray | 2000 | ispXPGA® | e0 | Obsolete | 3 (168 Hours) | 680 | EAR99 | Tin/Lead (Sn63Pb37) | ALSO OPERATES WITH 3.3V SUPPLY | 8542.39.00.01 | 2.3V~3.6V | BOTTOM | BALL | 225 | 2.5V | 1mm | not_compliant | 30 | LFX1200 | 680 | 496 | 不合格 | 2.5V | 2.5/3.3V | 82.5kB | 320MHz | 现场可编程门阵列 | 15376 | 423936 | 1250000 | 1.07 ns | 3844 | 1.7mm | 40mm | 40mm | Non-RoHS Compliant | ||||||||||||||||||||||||||
| LFX200B-03F256C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13.9kB | 表面贴装 | 表面贴装 | 256-BGA | 256 | 160 | 0°C~85°C TJ | Tray | 2000 | ispXPGA® | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | ALSO OPERATES WITH 3.3V SUPPLY | 8542.39.00.01 | 2.3V~3.6V | BOTTOM | BALL | 225 | 2.5V | 1mm | not_compliant | 30 | LFX200 | 256 | 160 | 不合格 | 2.5V | 2.5/3.3V | 19.3kB | 320MHz | 现场可编程门阵列 | 2704 | 113664 | 210000 | 1.07 ns | 676 | 2.1mm | 17mm | 17mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||
| LFX1200EC-04F900C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 51.8kB | 表面贴装 | 表面贴装 | 900-BBGA | 900 | 496 | 0°C~85°C TJ | Tray | 2000 | ispXPGA® | e0 | Obsolete | 3 (168 Hours) | 900 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 1.65V~1.95V | BOTTOM | BALL | 225 | 1.8V | 1mm | not_compliant | 30 | LFX1200 | 900 | 496 | 不合格 | 1.8V | 82.5kB | 320MHz | 现场可编程门阵列 | 15376 | 423936 | 1250000 | 0.93 ns | 3844 | 2.6mm | 31mm | 31mm | Non-RoHS Compliant |