制造商是'Lattice Semiconductor'
Lattice Semiconductor 嵌入式 - FPGA（现场可编程门阵列）
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图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 内存大小 | 工作电源电流 | 电源电流 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 组织结构 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 输出功能 | 宏细胞数 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 专用输入数量 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
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 | LFSC3GA40E-5FF1020I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 1020-BBGA, FCBGA | 1020 | 562 | -40°C~105°C TJ | Tray | 2008 | SC | e0 | Obsolete | 3 (168 Hours) | EAR99 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | 0.95V~1.26V | BOTTOM | BALL | 225 | 1.2V | 1mm | not_compliant | 30 | LFSC3GA40 | 562 | 不合格 | 1.2V | 1.21.2/3.32.5V | 497.5kB | 现场可编程门阵列 | 40000 | 4075520 | 700MHz | 10000 | 216 | 40400 | 3.82mm | 33mm | 33mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||
.png) | LFSCM3GA40EP1-5FC1152C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 1152-BCBGA, FCBGA | 1152 | 604 | 0°C~85°C TJ | Tray | 2008 | SCM | e0 | Obsolete | 3 (168 Hours) | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 0.95V~1.26V | BOTTOM | BALL | 225 | 1.2V | 1mm | not_compliant | 30 | LFSCM3GA40 | 604 | 不合格 | 1.21.2/3.32.5V | 497.5kB | 现场可编程门阵列 | 40000 | 4075520 | 700MHz | 10000 | 216 | 40400 | 5.2mm | 35mm | 35mm | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||
| LFSCM3GA115EP1-5FC1152C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 1152-BCBGA, FCBGA | 1152 | 660 | 0°C~85°C TJ | Tray | 2010 | SCM | e0 | Obsolete | 3 (168 Hours) | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 0.95V~1.26V | BOTTOM | BALL | 225 | 1.2V | 1mm | not_compliant | 30 | LFSCM3GA115 | 660 | 不合格 | 1.2V | 1.21.2/3.32.5V | 975kB | 现场可编程门阵列 | 115000 | 7987200 | 700MHz | 28750 | 424 | 5.2mm | 35mm | 35mm | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||
 | LFEC1E-4T144C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2.3kB | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 97 | 0°C~85°C TJ | Tray | 2000 | EC | e0 | no | Obsolete | 3 (168 Hours) | 144 | EAR99 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | 1.14V~1.26V | QUAD | 鸥翼 | 225 | 1.2V | 0.5mm | not_compliant | 30 | LFEC1 | 144 | 97 | 不合格 | 1.2V | 1.21.2/3.33.3V | 3kB | 现场可编程门阵列 | 1500 | 18432 | 378MHz | 192 | 0.48 ns | 192 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||
| LFSC3GA115E-6FC1704C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 1704-BCBGA, FCBGA | 1704 | 942 | 0°C~85°C TJ | Tray | 2010 | SC | e0 | Obsolete | 3 (168 Hours) | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 0.95V~1.26V | BOTTOM | BALL | 225 | 1.2V | 1mm | not_compliant | 30 | LFSC3GA115 | 942 | 不合格 | 1.2V | 1.21.2/3.32.5V | 975kB | 现场可编程门阵列 | 115000 | 7987200 | 700MHz | 28750 | 424 | 115200 | 5.3mm | 42.5mm | 42.5mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||
 | LFEC1E-4Q208C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2.3kB | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 112 | 0°C~85°C TJ | Tray | 2000 | EC | e0 | no | Obsolete | 3 (168 Hours) | 208 | EAR99 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | 1.14V~1.26V | QUAD | 鸥翼 | 225 | 1.2V | 0.5mm | unknown | 30 | LFEC1 | 208 | 112 | 不合格 | 1.2V | 1.21.2/3.33.3V | 3kB | 192 CLBS | 现场可编程门阵列 | 1500 | 18432 | 378MHz | 0.48 ns | 192 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | |||||||||||||||||||
 | LFSC3GA25E-6FN900C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 900-BBGA | 900 | 378 | 0°C~85°C TJ | Tray | 2008 | SC | e1 | yes | Obsolete | 3 (168 Hours) | 900 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.95V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | not_compliant | 40 | LFSC3GA25 | 900 | 378 | 不合格 | 1.2V | 1.21.2/3.32.5V | 240kB | 现场可编程门阵列 | 25000 | 1966080 | 700MHz | 6250 | 104 | 25400 | 2.6mm | 31mm | 31mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||
 | LFSC3GA40E-5FFN1152C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 1152-BBGA | 1152 | 604 | 0°C~85°C TJ | Tray | 2011 | SC | Obsolete | 3 (168 Hours) | EAR99 | 8542.39.00.01 | 0.95V~1.26V | BOTTOM | BALL | 1.2V | 1mm | LFSC3GA40 | 604 | 1.21.2/3.32.5V | 486kB | 1000MHz | 现场可编程门阵列 | 40000 | 4075520 | 10000 | 216 | 40400 | 3.5mm | 35mm | 35mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||
 | LFXP15E-4FN484C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 40.5kB | 表面贴装 | 表面贴装 | 484-BBGA | 484 | 300 | 0°C~85°C TJ | Tray | 2010 | XP | e1 | yes | Obsolete | 3 (168 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | 40 | LFXP15 | 484 | 300 | 不合格 | 1.2V | 48.1kB | 1932 CLBS | 现场可编程门阵列 | 15000 | 331776 | 4 | 360MHz | 1875 | 0.53 ns | 1932 | 1932 | 2.6mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||
| LFXP10E-3F388C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 27kB | 表面贴装 | 表面贴装 | 388-BBGA | 388 | 244 | 0°C~85°C TJ | Tray | 2007 | XP | no | Obsolete | 3 (168 Hours) | EAR99 | 1.14V~1.26V | not_compliant | LFXP10 | 388 | 1.2V | 31.9kB | 10000 | 221184 | 4 | 320MHz | 1250 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
 | ICE65L01F-LCB132C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8kB | 表面贴装 | 表面贴装 | 132-VFBGA, CSPBGA | 132 | 93 | 0°C~70°C TA | Tray | 2012 | iCE65™ L | Obsolete | 3 (168 Hours) | 132 | 1.14V~1.26V | BOTTOM | BALL | 1V | 0.5mm | unknown | ICE65 | 93 | 不合格 | 1.2V | 1V | 12μA | 8kB | 现场可编程门阵列 | 1280 | 65536 | 256MHz | 160 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||
 | LCMXO1200E-3T100I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 73 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | SRAM | -40°C~100°C TJ | Tray | 2000 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.26V | QUAD | 鸥翼 | 240 | 1.2V | 0.5mm | not_compliant | 30 | LCMXO1200 | 100 | 73 | 不合格 | 1.2V | 18mA | 18mA | 5.1 ns | 闪存 PLD | 1200 | 9421 | 500MHz | 150 | MACROCELL | 600 | 7 | 1.6mm | 14mm | 14mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||
| LCMXO1200E-4T144I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 113 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | SRAM | -40°C~100°C TJ | Tray | 2000 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 144 | EAR99 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | 1.14V~1.26V | QUAD | 鸥翼 | 225 | 1.2V | 0.5mm | not_compliant | 30 | LCMXO1200 | 144 | 113 | 不合格 | 1.2V | 18mA | 18mA | 4.4 ns | 闪存 PLD | 1200 | 9421 | 550MHz | 150 | MACROCELL | 600 | 7 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||
 | LCMXO2280E-3FT256I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 211 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | SRAM | -40°C~100°C TJ | Tray | 2013 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 225 | 1.2V | 1mm | not_compliant | 30 | LCMXO2280 | 256 | 211 | 不合格 | 1.2V | 20mA | 20mA | 5.1 ns | 闪存 PLD | 2280 | 28262 | 500MHz | 285 | MACROCELL | 1140 | 7 | 1.55mm | 17mm | 17mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||
 | LCMXO2280C-4M132I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 101 | 表面贴装 | 表面贴装 | 132-LFBGA, CSPBGA | 132 | SRAM | -40°C~100°C TJ | Tray | 2013 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 132 | EAR99 | Tin/Lead (Sn63Pb37) | IT CAN ALSO OPERATE AT 2.5V AND 3.3V | 8542.39.00.01 | 1.71V~3.465V | BOTTOM | BALL | 240 | 1.8V | 0.5mm | 30 | LCMXO2280 | 132 | 101 | 3.3V | 23mA | 23mA | 4.4 ns | 4.4 ns | 闪存 PLD | 2280 | 28262 | 550MHz | 285 | MACROCELL | 1140 | 7 | 1.35mm | 8mm | 8mm | 无 | Non-RoHS Compliant | 无铅 | |||||||||||||||
| LCMXO2280E-3M132C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 101 | 表面贴装 | 表面贴装 | 132-LFBGA, CSPBGA | 132 | SRAM | 0°C~85°C TJ | Tray | 2013 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 132 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 240 | 1.2V | 0.5mm | not_compliant | 30 | LCMXO2280 | 132 | 101 | 不合格 | 1.2V | 20mA | 20mA | 5.1 ns | 闪存 PLD | 2280 | 28262 | 500MHz | 285 | MACROCELL | 1140 | 7 | 1.35mm | 8mm | 8mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||
 | LCMXO256E-3M100C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 78 | 表面贴装 | 表面贴装 | 100-LFBGA, CSPBGA | 100 | SRAM | 0°C~85°C TJ | Tray | 2011 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 240 | 1.2V | 0.5mm | not_compliant | 30 | LCMXO256 | 100 | 78 | 不合格 | 1.2V | 10mA | 10mA | 256B | 4.9 ns | 闪存 PLD | 256 | 500MHz | 32 | MACROCELL | 128 | 256 | 7 | 1.35mm | 8mm | 8mm | Non-RoHS Compliant | 无铅 | |||||||||||||||
| LCMXO2280E-5FT256C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 211 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | SRAM | 0°C~85°C TJ | Tray | 2013 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 225 | 1.2V | 1mm | not_compliant | 30 | LCMXO2280 | 256 | 211 | 不合格 | 1.2V | 20mA | 20mA | 3.6 ns | 闪存 PLD | 2280 | 28262 | 600MHz | 285 | MACROCELL | 1140 | 7 | 1.55mm | 17mm | 17mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||
| LCMXO256C-3M100C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 78 | 表面贴装 | 表面贴装 | 100-LFBGA, CSPBGA | 100 | SRAM | 0°C~85°C TJ | Tray | 2011 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | IT CAN ALSO OPERATE AT 2.5V AND 3.3V | 8542.39.00.01 | 1.71V~3.465V | BOTTOM | BALL | 240 | 1.8V | 0.5mm | not_compliant | 30 | LCMXO256 | 100 | 78 | 不合格 | 3.3V | 13mA | 13mA | 256B | 4.9 ns | 闪存 PLD | 256 | 500MHz | 32 | MACROCELL | 128 | 256 | 7 | 1.35mm | 8mm | 8mm | Non-RoHS Compliant | 无铅 | ||||||||||||||
| LCMXO640C-4T100C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 74 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | SRAM | 0°C~85°C TJ | Tray | 2000 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | IT CAN ALSO OPERATE AT 2.5V AND 3.3V | 8542.39.00.01 | 1.71V~3.465V | QUAD | 鸥翼 | 240 | 1.8V | 0.5mm | not_compliant | 30 | LCMXO640 | 100 | 74 | 不合格 | 3.3V | 17mA | 17mA | 4.2 ns | 闪存 PLD | 640 | 550MHz | 80 | MACROCELL | 320 | 640 | 7 | 1.6mm | 14mm | 14mm | Non-RoHS Compliant | 无铅 | |||||||||||||||
| LCMXO640E-4T144C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 113 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | SRAM | 0°C~85°C TJ | Tray | 2000 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 144 | EAR99 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | 1.14V~1.26V | QUAD | 鸥翼 | 225 | 1.2V | 0.5mm | not_compliant | 30 | LCMXO640 | 144 | 113 | 不合格 | 1.2V | 14mA | 14mA | 4.2 ns | 闪存 PLD | 640 | 550MHz | 80 | MACROCELL | 320 | 640 | 7 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||
| LCMXO2280E-4FT256I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 211 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | SRAM | -40°C~100°C TJ | Tray | 2013 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 225 | 1.2V | 1mm | not_compliant | 30 | LCMXO2280 | 256 | 211 | 不合格 | 1.2V | 20mA | 20mA | 4.4 ns | 闪存 PLD | 2280 | 28262 | 550MHz | 285 | MACROCELL | 1140 | 7 | 1.55mm | 17mm | 17mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||
 | LCMXO3L-2100E-5UWG49ITR50 | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 49-UFBGA, WLCSP | 38 | -40°C~100°C TJ | Tray | 2015 | MachXO3 | Discontinued | 3 (168 Hours) | 49 | EAR99 | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 未说明 | 1.2V | 0.4mm | 未说明 | LCMXO3L-2100 | R-PBGA-B49 | 9.3kB | 现场可编程门阵列 | 2112 | 75776 | 264 | 264 | 0.6mm | 3.185mm | 3.106mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||
| LCMXO2280C-5FT256C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 211 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | SRAM | 0°C~85°C TJ | Tray | 2008 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | IT CAN ALSO OPERATE AT 2.5V AND 3.3V | 8542.39.00.01 | 1.71V~3.465V | BOTTOM | BALL | 225 | 1.8V | 1mm | 30 | LCMXO2280 | 256 | 211 | 不合格 | 3.3V | 23mA | 23mA | 3.6 ns | 闪存 PLD | 2280 | 28262 | 600MHz | 285 | MACROCELL | 1140 | 7 | 1.55mm | 17mm | 17mm | 符合RoHS标准 | 无铅 | ||||||||||||||||
| LCMXO2280E-3T100I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 73 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | SRAM | -40°C~100°C TJ | Tray | 2000 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.26V | QUAD | 鸥翼 | 240 | 1.2V | 0.5mm | not_compliant | 30 | LCMXO2280 | 100 | 73 | 不合格 | 1.2V | 20mA | 20mA | 5.1 ns | 闪存 PLD | 2280 | 28262 | 500MHz | 285 | MACROCELL | 1140 | 7 | 1.6mm | 14mm | 14mm | Non-RoHS Compliant | 无铅 |