制造商是'Lattice Semiconductor'
Lattice Semiconductor 嵌入式 - FPGA(现场可编程门阵列)
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![]() | LCMXO2-1200HC-4TG144C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 107 | 8kB | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 1.319103g | FLASH | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~3.465V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-1200 | 144 | 108 | 2.5V | 2.5/3.3V | 3.49mA | 17.3kB | 7.24 ns | 现场可编程门阵列 | 1280 | 64 kb | 65536 | 160 | 640 | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||
![]() | LCMXO2-2000HC-4TG100I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 79 | 9.3kB | 表面贴装 | 表面贴装 | 100-LQFP | 100 | FLASH | -40°C~100°C TJ | Tray | 2000 | MachXO2 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~3.465V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-2000 | 100 | 80 | 2.5V | 2.5/3.3V | 80μA | 21.3kB | 7.24 ns | 现场可编程门阵列 | 2112 | 75776 | 264 | 1056 | 1.4mm | 14mm | 14mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||
![]() | LCMXO2-1200HC-4TG100C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 79 | 8kB | 表面贴装 | 表面贴装 | 100-LQFP | 100 | FLASH | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~3.465V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-1200 | 100 | 80 | 2.5V | 2.5/3.3V | 3.49mA | 17.3kB | 7.24 ns | 现场可编程门阵列 | 1280 | 64 kb | 65536 | 160 | 640 | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||
![]() | LCMXO2-2000HC-4TG144I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 111 | 9.3kB | 表面贴装 | 表面贴装 | 144-LQFP | 144 | FLASH | -40°C~100°C TJ | Tray | 2000 | MachXO2 | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~3.465V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-2000 | 144 | 112 | 2.5V | 2.5/3.3V | 82μA | 21.3kB | 7.24 ns | 现场可编程门阵列 | 2112 | 75776 | 264 | 1056 | 1.4mm | 20mm | 20mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||
![]() | LCMXO256C-3TN100C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 78 | 0B | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 657.000198mg | SRAM | 0°C~85°C TJ | Tray | 2000 | MachXO | e3 | yes | 活跃 | 3 (168 Hours) | 100 | SMD/SMT | EAR99 | Matte Tin (Sn) | IT CAN ALSO OPERATE AT 2.5V AND 3.3V | 8542.39.00.01 | 1.71V~3.465V | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 500MHz | 30 | LCMXO256 | 100 | 78 | 3.3V | 13mA | 256B | 4.9 ns | 4.9 ns | 闪存 PLD | 256 | 2 kb | 32 | MACROCELL | 128 | 256 | 7 | 1.6mm | 14mm | 14mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||
![]() | LCMXO2-1200HC-4MG132I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 104 | 8kB | 表面贴装 | 表面贴装 | 132-LFBGA, CSPBGA | 132 | FLASH | -40°C~100°C TJ | Tray | 2000 | MachXO2 | e1 | yes | 活跃 | 3 (168 Hours) | 132 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.375V~3.465V | BOTTOM | BALL | 250 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-1200 | 132 | 105 | 2.5V | 2.5/3.3V | 3.49mA | 17.3kB | 7.24 ns | 现场可编程门阵列 | 1280 | 65536 | 160 | 640 | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||
![]() | LCMXO2-640HC-4TG100C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 78 | 2.3kB | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 657.000198mg | FLASH | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~3.465V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-640 | 79 | 2.5V | 2.5/3.3V | 1.84mA | 5.9kB | 7.24 ns | 现场可编程门阵列 | 640 | 147 kb | 18432 | 80 | 320 | 640 | 1.6mm | 14mm | 14mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||
![]() | LCMXO2-2000HC-4TG100C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 79 | 9.3kB | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 657.000198mg | FLASH | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~3.465V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-2000 | 100 | 80 | 2.5V | 2.5/3.3V | 4.8mA | 21.3kB | 7.24 ns | 现场可编程门阵列 | 2112 | 75776 | 264 | 1056 | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||
![]() | LCMXO2-1200HC-4TG144I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 107 | 8kB | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 1.319103g | FLASH | -40°C~100°C TJ | Tray | 2000 | MachXO2 | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~3.465V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-1200 | 144 | 108 | 2.5V | 2.5/3.3V | 3.49mA | 17.3kB | 7.24 ns | 现场可编程门阵列 | 1280 | 65536 | 160 | 640 | 1.4mm | 20mm | 20mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||
![]() | LCMXO2-1200HC-4MG132C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 104 | 8kB | 表面贴装 | 表面贴装 | 132-LFBGA, CSPBGA | 132 | FLASH | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e1 | yes | 活跃 | 3 (168 Hours) | 132 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.375V~3.465V | BOTTOM | BALL | 250 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-1200 | 132 | 105 | 2.5V | 2.5/3.3V | 3.49mA | 17.3kB | 7.24 ns | 现场可编程门阵列 | 1280 | 64 kb | 65536 | 160 | 640 | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||
![]() | LCMXO2-256HC-4TG100C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 55 | 0B | 表面贴装 | 表面贴装 | 100-LQFP | 100 | FLASH | 0°C~85°C TJ | Tray | 2012 | MachXO2 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~3.465V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-256 | 100 | 56 | 2.5/3.3V | 1.15mA | 256B | 7.24 ns | 0 DEDICATED INPUTS, 0 I/O | 256 | 32 | MIXED | 128 | 256 | 1.6mm | 14mm | 14mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||
![]() | LFXP2-8E-5TN144C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 27.6kB | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 100 | 0°C~85°C TJ | Tray | 2000 | XP2 | e3 | 活跃 | 3 (168 Hours) | 144 | SMD/SMT | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 1.14V~1.26V | QUAD | 鸥翼 | 1.2V | 0.5mm | 311MHz | LFXP2-8 | 144 | 100 | 1.2V | 1.21.2/3.33.3V | 29.9kB | 现场可编程门阵列 | 8000 | 221 kb | 226304 | 1000 | 4000 | 0.494 ns | 1.4mm | 20mm | 20mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||
![]() | LFXP2-5E-5TN144I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 20.8kB | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 100 | -40°C~100°C TJ | Tray | 2000 | XP2 | e3 | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) - annealed | 8542.39.00.01 | 1.14V~1.26V | QUAD | 鸥翼 | 1.2V | 0.5mm | LFXP2-5 | 144 | 100 | 1.2V | 1.21.2/3.33.3V | 22kB | 435MHz | 现场可编程门阵列 | 5000 | 169984 | 625 | 0.494 ns | 1.6mm | 20mm | 20mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||
![]() | LFXP2-5E-5QN208C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 20.8kB | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 146 | 0°C~85°C TJ | Tray | 2000 | XP2 | e3 | 活跃 | 3 (168 Hours) | 208 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 1.14V~1.26V | QUAD | 鸥翼 | 1.2V | 0.5mm | 311MHz | LFXP2-5 | 208 | 146 | 1.2V | 1.21.2/3.33.3V | 17mA | 22kB | 现场可编程门阵列 | 5000 | 169984 | 625 | 0.494 ns | 3.4mm | 28mm | 28mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||
![]() | LCMXO2-256HC-4TG100I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 55 | 0B | 表面贴装 | 表面贴装 | 100-LQFP | 100 | FLASH | -40°C~100°C TJ | Tray | 2012 | MachXO2 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~3.465V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-256 | 56 | 不合格 | 3.3V | 18μA | 256B | 7.24 ns | 现场可编程门阵列 | 256 | 32 | 128 | 256 | 1.4mm | 14mm | 14mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||
![]() | LCMXO2-2000HC-4FTG256C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 206 | 9.3kB | 表面贴装 | 表面贴装 | 256-LBGA | 256 | FLASH | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.375V~3.465V | BOTTOM | BALL | 260 | 2.5V | 1mm | 269MHz | 30 | LCMXO2-2000 | 256 | 207 | 2.5V | 2.5/3.3V | 4.8mA | 21.3kB | 7.24 ns | 现场可编程门阵列 | 2112 | 75776 | 264 | 1056 | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||
![]() | LCMXO1200C-3TN144C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 113 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 1.319103g | SRAM | 0°C~85°C TJ | Tray | 2000 | MachXO | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | IT CAN ALSO OPERATE AT 2.5V AND 3.3V | 8542.39.00.01 | 1.71V~3.465V | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 420MHz | 40 | LCMXO1200 | 144 | 113 | 3.3V | 21mA | 5.1 ns | 5.1 ns | 闪存 PLD | 1200 | 9421 | 150 | MACROCELL | 600 | 7 | 1.6mm | 20mm | 20mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||
![]() | LCMXO2-4000HC-4MG132C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 104 | 11.5kB | 表面贴装 | 表面贴装 | 132-LFBGA, CSPBGA | 132 | FLASH | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e1 | yes | 活跃 | 3 (168 Hours) | 132 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.375V~3.465V | BOTTOM | BALL | 250 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-4000 | 105 | 不合格 | 2.5V | 2.5/3.3V | 8.45mA | 27.8kB | 7.24 ns | 现场可编程门阵列 | 4320 | 94208 | 540 | 2160 | 1.35mm | 8mm | 8mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||
![]() | LCMXO2-1200HC-4TG100I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 79 | 8kB | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 657.000198mg | FLASH | -40°C~100°C TJ | Tray | 2000 | MachXO2 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~3.465V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-1200 | 100 | 80 | 2.5V | 2.5/3.3V | 3.49mA | 17.3kB | 7.24 ns | 现场可编程门阵列 | 1280 | 65536 | 160 | 640 | 1.4mm | 14mm | 14mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||
![]() | LCMXO2-640HC-4TG100I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 78 | 2.3kB | 表面贴装 | 表面贴装 | 100-LQFP | 100 | FLASH | -40°C~100°C TJ | Tray | 2000 | MachXO2 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~3.465V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-640 | 79 | 2.5V | 2.5/3.3V | 28μA | 5.9kB | 7.24 ns | 现场可编程门阵列 | 640 | 18432 | 80 | 320 | 640 | 1.4mm | 14mm | 14mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||
![]() | LCMXO640C-3TN100C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 74 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 657.000198mg | SRAM | 0°C~85°C TJ | Tray | 2000 | MachXO | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | IT CAN ALSO OPERATE AT 2.5V AND 3.3V | 8542.39.00.01 | 1.71V~3.465V | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 420MHz | 40 | LCMXO640 | 100 | 74 | 3.3V | 17mA | 0B | 4.9 ns | 4.9 ns | 闪存 PLD | 640 | 80 | MACROCELL | 320 | 640 | 7 | 1.6mm | 14mm | 14mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||
![]() | LCMXO2-256HC-4SG32C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 21 | 0B | 表面贴装 | 表面贴装 | 32-UFQFN Exposed Pad | FLASH | 0°C~85°C TJ | Tray | 2013 | MachXO2 | 活跃 | 3 (168 Hours) | 32 | EAR99 | 8542.39.00.01 | 2.375V~3.465V | QUAD | 2.5V | 0.5mm | LCMXO2-256 | 22 | 3.3V | 18μA | 256B | 22 | 现场可编程门阵列 | 256 | 269MHz | 32 | 128 | 256 | 0.6mm | 5mm | 5mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||
![]() | LCMXO2-7000HC-4FG484C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 334 | 30kB | 表面贴装 | 表面贴装 | 484-BBGA | 484 | FLASH | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e1 | yes | 活跃 | 3 (168 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.375V~3.465V | BOTTOM | BALL | 250 | 2.5V | 1mm | 269MHz | 30 | LCMXO2-7000 | 335 | 2.5V | 2.5/3.3V | 189μA | 68.8kB | 7.24 ns | 现场可编程门阵列 | 6864 | 240 kb | 245760 | 858 | 3432 | 2.6mm | 23mm | 23mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||
![]() | LFE3-35EA-8FN484C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 165.9kB | 表面贴装 | 表面贴装 | 484-BBGA | 484 | 295 | 0°C~85°C TJ | Tray | 2013 | ECP3 | e1 | 活跃 | 3 (168 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | 30 | LFE3-35 | 484 | 295 | 1.2V | 18mA | 174.4kB | 现场可编程门阵列 | 33000 | 1358848 | 500MHz | 4125 | 0.281 ns | 2.6mm | 23mm | 23mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||
![]() | LCMXO2-2000HC-4MG132C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 104 | 9.3kB | 表面贴装 | 表面贴装 | 132-LFBGA, CSPBGA | 132 | FLASH | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e1 | yes | 活跃 | 3 (168 Hours) | 132 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.375V~3.465V | BOTTOM | BALL | 250 | 2.5V | 0.5mm | 269MHz | 30 | LCMXO2-2000 | 132 | 105 | 不合格 | 2.5V | 2.5/3.3V | 4.8mA | 21.3kB | 7.24 ns | 现场可编程门阵列 | 2112 | 75776 | 264 | 1056 | 无SVHC | ROHS3 Compliant | 无铅 |