制造商是'KEMET'
KEMET 陶瓷电容器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 端子形状 | 越来越多的功能 | 引脚数 | 材料 | 介电材料 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 温度系数 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 应用 | HTS代码 | 电容量 | 子类别 | 电压 - 额定直流 | 包装方式 | 端子间距 | 深度 | 结构 | Reach合规守则 | 参考标准 | 终端样式 | 箱码（公制） | 箱码（英制） | 螺纹距离 | 电容式 | 电介质 | 失败率 | 引线间距 | 温度特性代码 | 多层 | 额定(DC)电压(URdc) | 铅直径 | 尺寸代码 | 电压 | 引线样式 | 耗散因数 | 正容差 | 负公差 | 产品类别 | 定制功能 | 尺寸(mm) | 产品 | 特征 | 产品类别 | 产品长度(mm) | 高度 | 座位高度(最大) | 长度 | 宽度 | 厚度（最大） | 器件厚度 | 产品高度(mm) | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | 评级结果 | |||||||||||||||||||||||||||||||||||||||||||
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 | C0603C475M8PACTU | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tin | 表面贴装 | Surface Mount, MLCC | 0603 (1608 Metric) | WRAPAROUND | 2 | Ceramic | -55°C~85°C | Tape & Reel (TR) | 2012 | SMD Comm X5R | 0.063Lx0.031W 1.60mmx0.80mm | ±20% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | SMD/SMT | EAR99 | X5R | 通用型 | 4.7μF | 10V | TR, Punched Paper, 7 Inch | 800μm | 1608 | 0603 | X5R | 有 | 5 % | 800μm | 1.6mm | 0.8mm | 0.034 0.87mm | 863.6μm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | C0603C102J5GACAUTO7411 | KEMET Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8532.24.00.20 | 0.001uF | 极低 | 无 | 表面贴装 | 陶瓷芯片 | 0.1 | -55 | 125 | 0.8 | Tape & Reel (TR) | 活跃 | 50 V | Compliant | AEC-Q200 | 0603 | 1608 | 1 nF | + 125 C | 0.000222 oz | - 55 C | 15000 | 0.001 uF | KEMET | 50 VDC | KEMET | FT-CAP | Class 1 | , 0603 | SMT | -55 °C | 125 °C | 有 | C0603C102J5GACAUTO7411 | 矩形包装 | 活跃 | KEMET ELECTRONICS CORP | 5.23 | 0603 | Multilayer Ceramic Capacitors MLCC - SMD/SMT | 0603 | YES | WRAPAROUND | SURFACE MOUNT | Ceramic | 2 | KEMET | EAR99 | 卷带 | * | 5% | e3 | 有 | 活跃 | Standard | -/+30ppm/Cel ppm/°C | C0G Dielectric Commercial Grade MLCCs | Matte Tin (Sn) - with Nickel (Ni) barrier | 125 °C | -55 °C | 1 nF | Capacitors | TR, PUNCHED PAPER, 13 INCH | 800 µm | Flat | compliant | AEC-Q200 | Pad | 陶瓷电容器 | C0G | C0G | 有 | 50 V | 0603 | 50VDC | 5% | 5% | 1.6 X 0.8 X 0.8 | 通用型MLCC | 陶瓷电容器 | 1.6 | 0.8 mm | 1.6 mm | 0.8 mm | 0.8 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||
| C1812C105M1RAC7800 | KEMET Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1uF | 无 | 表面贴装 | 陶瓷芯片 | 2.5 | -55 | 125 | 3.2 | 100 V | Compliant | Tape & Reel (TR) | C1812C | 活跃 | 100V | , 1812 | SMT | -55 °C | 125 °C | 有 | C1812C105M1RAC7800 | KEMET Corporation | 活跃 | KEMET ELECTRONICS CORP | 5.62 | C(SIZE)C(X7R) | Surface Mount, MLCC | 1812 | Ceramic | 2 | KEMET | EAR99 | -55°C ~ 125°C | 卷带 | SMD Comm X7R | 0.177 L x 0.126 W (4.50mm x 3.20mm) | 20% | e3 | 有 | 活跃 | EAR99 | X7R | Matte Tin (Sn) - with Nickel (Ni) barrier | 125 °C | -55 °C | Bypass, Decoupling | 8532.24.00.20 | 1 µF | TR, Embossed Plastic, 7 Inch | 3.2 mm | Flat | compliant | Pad | 陶瓷电容器 | X7R | - | - | X7R | 有 | 100 V | 1812 | 100VDC | - | 20% | 20% | 4.5 X 3.2 X 1.55 | - | 4.5 | 1.55 mm | - | 4.5 mm | 3.2 mm | 0.065 (1.65mm) | 1.55 | 符合RoHS标准 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | C0402C105M8PACTU | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 23 Weeks | 表面贴装 | Surface Mount, MLCC | 0402 (1005 Metric) | WRAPAROUND | Ceramic | -55°C~85°C | Tape & Reel (TR) | 2016 | SMD Comm X5R | 0.039Lx0.020W 1.00mmx0.50mm | ±20% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | SMD/SMT | EAR99 | X5R | Matte Tin (Sn) - with Nickel (Ni) barrier | 通用型 | 8532.24.00.20 | 1μF | 10V | TR, Punched Paper, 7 Inch | 500μm | 1005 | 0402 | X5R | 有 | 5 % | 500μm | 1mm | 0.5mm | 0.022 0.55mm | 558.8μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | C0201C101K3GACTU | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 表面贴装 | Surface Mount, MLCC | 0201 (0603 Metric) | Ceramic | -55°C~125°C | Tape & Reel (TR) | 2012 | SMD Comm C0G | 0.024Lx0.012W 0.60mmx0.30mm | ±10% | yes | 活跃 | 1 (Unlimited) | SMD/SMT | C0G NP0 | 通用型 | 100pF | 25V | 0603 | 0201 | C0G | 0.1 % | 低ESL | 330μm | 0.013 0.33mm | 330.2μm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | C0603C103K3RAC7411 | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 0603 | WRAPAROUND | Ceramic | Tape & Reel | 10% | e3 | yes | 2 | EAR99 | 30 ppm/°C | Matte Tin (Sn) - with Nickel (Ni) barrier | 125°C | -55°C | 8532.24.00.20 | 10nF | 25V | TR, PUNCHED PAPER, 13 INCH | 800μm | X7R | X7R | 有 | 870μm | 1.6mm | 0.8mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CBR06C270FAGAC | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 31 Weeks | 表面贴装 | Surface Mount, MLCC | 0603 (1608 Metric) | WRAPAROUND | Ceramic | -55°C~125°C | Tape & Reel (TR) | 2016 | CBR-SMD RF C0G | 0.063Lx0.031W 1.60mmx0.80mm | ±1% | e3 | 活跃 | 1 (Unlimited) | 2 | EAR99 | C0G NP0 | Matte Tin (Sn) - with Nickel (Ni) barrier | RF, Microwave, High Frequency | 8532.24.00.20 | 27pF | 250V | TR, PUNCHED PAPER, 7 INCH | 1608 | 0603 | C0G | 有 | High Q, Low Loss, Ultra Low ESR | 870μm | 1.6mm | 0.8mm | 0.034 0.87mm | 863.6μm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CBR06C180FAGAC | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 31 Weeks | 表面贴装 | Surface Mount, MLCC | 0603 (1608 Metric) | WRAPAROUND | Ceramic | -55°C~125°C | Tape & Reel (TR) | 2015 | CBR-SMD RF C0G | 0.063Lx0.031W 1.60mmx0.80mm | ±1% | e3 | 活跃 | 1 (Unlimited) | 2 | EAR99 | C0G NP0 | Matte Tin (Sn) - with Nickel (Ni) barrier | RF, Microwave, High Frequency | 8532.24.00.20 | 18pF | 250V | TR, PUNCHED PAPER, 7 INCH | 1608 | 0603 | C0G | 有 | High Q, Low Loss, Ultra Low ESR | 870μm | 1.6mm | 0.8mm | 0.034 0.87mm | 863.6μm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| C0603C223K8RACTU | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | WRAPAROUND | Ceramic | 10% | e3 | yes | 2 | SMD/SMT | EAR99 | 30 ppm/°C | Matte Tin (Sn) - with Nickel (Ni) barrier | 125°C | -55°C | 8532.24.00.20 | 22nF | 10V | TR, Punched Paper, 7 Inch | 800μm | 1608 | 0603 | 700μm | X7R | X7R | 有 | 870μm | 1.6mm | 787.4μm | 863.6μm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | C1206C823K1RACTU | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | PCB, Surface Mount | Surface Mount, MLCC | 1206 (3216 Metric) | WRAPAROUND | 2 | Ceramic | -55°C~125°C | Tape & Reel (TR) | 2005 | SMD Comm X7R | 0.126Lx0.063W 3.20mmx1.60mm | ±10% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | SMD/SMT | EAR99 | X7R | Matte Tin (Sn) - with Nickel (Ni) barrier | Bypass, Decoupling | 0.082μF | 100V | TR, PUNCHED PAPER/EMBOSSED PLASTIC, 7 INCH | 1.6mm | 3216 | 1206 | X7R | 有 | 100V | 2.5 % | 880μm | 0.035 0.88mm | 889μm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | C0805H103J1GACTU | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 表面贴装 | Surface Mount, MLCC | 0805 (2012 Metric) | WRAPAROUND | 2 | Ceramic | -55°C~200°C | Tape & Reel (TR) | 2010 | SMD Indust C0G HT200C | 0.079Lx0.049W 2.00mmx1.25mm | ±5% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | SMD/SMT | EAR99 | C0G NP0 | Matte Tin (Sn) - with Nickel (Ni) barrier | Downhole | 10000pF | 100V | TR, PAPER, 7 INCH | 2012 | 0805 | 750μm | C0G | C0G | 有 | Low ESL, High Temperature | 1.25mm | 0.039 1.00mm | 990.6μm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| C0402C391J4RACTU | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Surface Mount, MLCC | 0402 (1005 Metric) | WRAPAROUND | 2 | Ceramic | -55°C~125°C | Tape & Reel (TR) | 2013 | SMD Comm X7R | 0.039Lx0.020W 1.00mmx0.50mm | ±5% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | EAR99 | X7R | Matte Tin (Sn) - with Nickel (Ni) barrier | Bypass, Decoupling | 390pF | 16V | TR, Punched Paper, 7 Inch | 500μm | X7R | 有 | 550μm | 1mm | 0.5mm | 0.022 0.55mm | 558.8μm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| C0402C561J3RACTU | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 48 Weeks | 表面贴装 | Surface Mount, MLCC | 0402 (1005 Metric) | WRAPAROUND | 2 | Ceramic | -55°C~125°C | Tape & Reel (TR) | 2012 | SMD Comm X7R | 0.039Lx0.020W 1.00mmx0.50mm | ±5% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | EAR99 | X7R | Matte Tin (Sn) - with Nickel (Ni) barrier | Bypass, Decoupling | 560pF | 25V | TR, Punched Paper, 7 Inch | X7R | 有 | 550μm | 1mm | 0.5mm | 0.022 0.55mm | 558.8μm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| C0805C121K5GACTU | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | Surface Mount, MLCC | 0805 (2012 Metric) | WRAPAROUND | Ceramic | -55°C~125°C | Tape & Reel (TR) | 2016 | SMD Comm C0G | 0.079Lx0.049W 2.00mmx1.25mm | ±10% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | SMD/SMT | EAR99 | C0G NP0 | Matte Tin (Sn) - with Nickel (Ni) barrier | 通用型 | 8532.24.00.20 | 120pF | 50V | TR, PAPER, 7 INCH | 1.25mm | 2012 | 0805 | 750μm | C0G | C0G | 有 | 0.1 % | 低ESL | 780μm | 2mm | 0.035 0.88mm | 889μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VCR40V102KGS | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | PCB, Through Hole | 通孔 | Radial | WIRE | Ceramic | -55°C~200°C | Bulk | 2010 | VCR Indust C0G HVHT200C | 0.350Lx0.275W 8.89mmx6.98mm | ±10% | e4 | no | 活跃 | 1 (Unlimited) | 2 | EAR99 | C0G NP0 | Gold (Au) | 通用型 | 8532.23.00.60 | 1000pF | 3kV | 7.62mm | 6.98mm | 6.35mm | C0G | 0.250 6.35mm | C0G | 无 | 4027 | 3kV | Straight | 2.5 % | 可根据要求提供其他公差 | High Voltage, High Temperature | 10.16mm | 0.400 10.16mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| C0603C181K1GACTU | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 42 Weeks | Tin | 表面贴装 | Surface Mount, MLCC | 0603 (1608 Metric) | WRAPAROUND | Ceramic | -55°C~125°C | Tape & Reel (TR) | 2012 | SMD Comm C0G | 0.063Lx0.031W 1.60mmx0.80mm | ±10% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | EAR99 | C0G NP0 | 通用型 | 8532.24.00.20 | 180pF | 100V | BULK CASSETTE; TR, PUNCHED PAPER, 7/13 INCH | 800μm | C0G | C0G | 有 | 低ESL | 870μm | 1.6mm | 0.8mm | 0.034 0.87mm | 863.6μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| C0805C159C1GACTU | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 48 Weeks | 表面贴装 | Surface Mount, MLCC | 0805 (2012 Metric) | WRAPAROUND | Ceramic | 5.499807mg | -55°C~125°C | Tape & Reel (TR) | 2013 | SMD Comm C0G | 0.079Lx0.049W 2.00mmx1.25mm | ±0.25pF | e3 | yes | 活跃 | 1 (Unlimited) | 2 | SMD/SMT | EAR99 | C0G NP0 | Matte Tin (Sn) - with Nickel (Ni) barrier | 通用型 | 8532.24.00.20 | 1.5pF | 100V | TR, PAPER, 7 INCH | 1.25mm | 2012 | 0805 | C0G | C0G | 有 | 低ESL | 880μm | 2mm | 0.035 0.88mm | 889μm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| C0603C620G5GACTU | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 51 Weeks | 表面贴装 | Surface Mount, MLCC | 0603 (1608 Metric) | WRAPAROUND | Ceramic | -55°C~125°C | Tape & Reel (TR) | 2013 | SMD Comm C0G | 0.063Lx0.031W 1.60mmx0.80mm | ±2% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | SMD/SMT | EAR99 | C0G NP0 | Matte Tin (Sn) - with Nickel (Ni) barrier | 通用型 | 8532.24.00.20 | 62pF | 50V | BULK CASSETTE; TR, PUNCHED PAPER, 7/13 INCH | 1608 | 0603 | C0G | C0G | 有 | 低ESL | 870μm | 1.6mm | 0.8mm | 0.034 0.87mm | 863.6μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | C052K221K2X5CA7301 | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Molded | C(SIZE)K | 10% | e0 | 2 | Radial | EAR99 | -/+15ppm/Cel ppm/°C | Tin/Lead (Sn60Pb40) | 125°C | -55°C | Ceramic | 8532.24.00.60 | 220pF | 200V | TR | 2.29mm | MIL-C-11015 | 5.08mm | X7R | X7R | 640 μm | 1909 | 2.5 % | 4.83mm | 4.83mm | 2.29mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| C0805C751J5GACTU | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | Surface Mount, MLCC | 0805 (2012 Metric) | WRAPAROUND | Ceramic | -55°C~125°C | Tape & Reel (TR) | 2014 | SMD Comm C0G | 0.079Lx0.049W 2.00mmx1.25mm | ±5% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | SMD/SMT | EAR99 | C0G NP0 | Matte Tin (Sn) - with Nickel (Ni) barrier | 通用型 | 8532.24.00.20 | 750pF | 50V | TR, PAPER, 7 INCH | 1.25mm | 2012 | 0805 | 750μm | C0G | C0G | 有 | 低ESL | 880μm | 2mm | 0.035 0.88mm | 889μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| C0603C680J5GACAUTO | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Surface Mount, MLCC | 0603 (1608 Metric) | YES | WRAPAROUND | Ceramic | -55°C~125°C | Tape & Reel (TR) | 2013 | SMD Auto C0G | 0.063Lx0.031W 1.60mmx0.80mm | ±5% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | C0G NP0 | Matte Tin (Sn) - with Nickel (Ni) barrier | 汽车 | 68pF | 50V | TR, PUNCHED PAPER, 7 INCH | 800μm | C0G | C0G | 有 | 低ESL | 870μm | 1.6mm | 0.8mm | 0.034 0.87mm | ROHS3 Compliant | 无铅 | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| C0805C562KARACTU | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | Surface Mount, MLCC | 0805 (2012 Metric) | WRAPAROUND | Ceramic | -55°C~125°C | Tape & Reel (TR) | 2013 | SMD Comm X7R Tip-Ring | 0.079Lx0.049W 2.00mmx1.25mm | ±10% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | SMD/SMT | EAR99 | X7R | Matte Tin (Sn) - with Nickel (Ni) barrier | 通用型 | 8532.24.00.20 | 5600pF | 250V | TR, Punched Paper, 7 Inch | 1.2mm | 2012 | 0805 | 750μm | X7R | 有 | 880μm | 1.25mm | 0.035 0.88mm | 889μm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| C0603C759J5GACTU | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | 表面贴装 | Surface Mount, MLCC | 0603 (1608 Metric) | WRAPAROUND | Ceramic | 2.012816mg | -55°C~125°C | Tape & Reel (TR) | 2012 | SMD Comm C0G | 0.063Lx0.031W 1.60mmx0.80mm | ±5% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | SMD/SMT | EAR99 | C0G NP0 | Matte Tin (Sn) - with Nickel (Ni) barrier | 通用型 | 8532.24.00.20 | 7.5pF | 50V | BULK CASSETTE; TR, PUNCHED PAPER, 7/13 INCH | 800μm | 1608 | 0603 | C0G | C0G | 有 | 低ESL | 870μm | 1.6mm | 0.8mm | 0.034 0.87mm | 863.6μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CBR04C508B1GAC | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 31 Weeks | 表面贴装 | Surface Mount, MLCC | 0402 (1005 Metric) | WRAPAROUND | Ceramic | -55°C~125°C | Tape & Reel (TR) | 2016 | CBR-SMD RF C0G | 0.039Lx0.020W 1.00mmx0.50mm | ±0.1pF | e3 | 活跃 | 1 (Unlimited) | 2 | EAR99 | C0G NP0 | Matte Tin (Sn) - with Nickel (Ni) barrier | RF, Microwave, High Frequency | 8532.24.00.20 | 0.5pF | 100V | TR, PUNCHED PAPER, 7 INCH | 1005 | 0402 | C0G | 有 | High Q, Low Loss, Ultra Low ESR | 550μm | 1mm | 0.5mm | 0.022 0.55mm | 558.8μm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| C0805C822K5RALTU | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 48 Weeks | 表面贴装 | Surface Mount, MLCC | 0805 (2012 Metric) | WRAPAROUND | Ceramic | -55°C~125°C | Tape & Reel (TR) | 2012 | SMD Comm X7R SnPb | 0.079Lx0.049W 2.00mmx1.25mm | ±10% | e0 | no | 活跃 | 1 (Unlimited) | 2 | SMD/SMT | EAR99 | X7R | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier | Bypass, Decoupling | 8532.24.00.20 | 8200pF | 50V | TR, Punched Paper, 7 Inch | 1.25mm | not_compliant | 2012 | 0805 | X7R | 有 | 0.78mm | 2mm | 0.035 0.88mm | 889μm | Non-RoHS Compliant | 含铅 |